公开(公告)号：EP4336550A1

公开(公告)日：2024-03-13

申请号：EP23195227.6

申请日：2023-09-04

申请人： NXP USA, Inc.

发明人： Vincent, Michael B. ,  Hayes, Scott M. ,  Gong, Zhiwei ,  van Gemert, Leo ,  Kamphuis, Antonius Hendrikus Jozef ,  Huang, Wen Hung

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L21/60 ,  H01L23/498

摘要： A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.

公开(公告)号：EP4383325A1

公开(公告)日：2024-06-12

申请号：EP23212555.9

申请日：2023-11-28

申请人： NXP USA, Inc.

发明人： Hayes, Scott M ,  Huang, Wen Hung ,  VINCENT, Michael B ,  Kamphuis, Antonius Hendrikus Jozef ,  Gong, Zhiwei ,  van Gemert, Leo

IPC分类号： H01L23/00 ,  H01L23/538

CPC分类号： H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/23 ,  H01L2924/18120130101 ,  H01L2224/2422120130101 ,  H01L2225/0654820130101 ,  H01L2224/3214520130101 ,  H01L2225/0651720130101 ,  H01L2225/0655820130101 ,  H01L25/0657 ,  H01L25/0652 ,  H01L25/50 ,  H01L23/49816 ,  H01L2225/0658620130101

摘要： An electronic device package and method of fabricating such a package includes a first and second components encapsulated in a volume of molding material. A surface of the first component is bonded to a surface of the second component. Upper and lower sets of redistribution lowers that include, respectively, first and second sets of conductive interconnects are formed on opposite sides of the molding material. A through-package interconnect passes through the volume of molding material and has ends that terminate, respectively, within the upper set of redistribution layers and within the lower set of redistribution layers.

公开(公告)号：EP4383316A1

公开(公告)日：2024-06-12

申请号：EP23212579.9

申请日：2023-11-28

申请人： NXP USA, Inc.

发明人： Gong, Zhiwei ,  Hayes, Scott M ,  VINCENT, Michael B ,  van Gemert, Leo ,  Kamphuis, Antonius Hendrikus Jozef ,  Huang, Wen Hung

IPC分类号： H01L21/48 ,  H01L23/538 ,  H01L21/683

CPC分类号： H01L23/5389 ,  H01L23/49816 ,  H01L21/4857 ,  H01L23/13 ,  H01L25/0652 ,  H01L24/81 ,  H01L2221/6835920130101 ,  H01L2221/6834520130101 ,  H01L23/3128 ,  H01L25/50 ,  H01L2225/0652420130101

摘要： A package is formed that encapsulates first and second components having respective first and second thickness differing from each other. Each component has lower surface provided with electrical contact pads and an upper surface opposite the lower surface. A volume of molding material encapsulates the first component. The package includes a set redistribution layers including a set of electrically-conductive interconnects surrounded by electrically-insulating material. The redistribution layers are disposed above the upper surface of the first component. The package includes one or more electrically conductive interconnects that pass through the redistribution layers to the lower surface of the first component; The second component is disposes at a location adjacent to the first component. A first portion of the second component is surrounded by the volume of molding material and a second portion of the second component is surrounded by one or more of the redistribution layers.