摘要:
A deposition method is provided wherein a donor substrate (10) is arranged opposite a target substrate (20), the donor substrate having a surface (12) facing the target substrate that is provided with a viscous donor material (14). An optical beam (30) is directed via the donor substrate to the donor material so as to release the donor material and to therewith transfer the donor material as a jet towards the target substrate. In the method provided herein an input signal (Ds) is received that specifies a shape to be assumed by the jet with which the donor material is to be transferred and an energy profile of the optical beam is accordingly controlled. Additionally or alternatively the energy profile of the optical beam may be controlled in accordance with a pattern according to which the donor material is to be deposited on the target substrate. Likewise a corresponding deposition apparatus is provided.
摘要:
The present disclosure concerns methods for the manufacturing of products with printed conductive tracks. The process comprising scribing a first trench into the surface of the object, wherein on a border of the trench a first ridge is formed to define a first edge of a material receiving track. At a distance from the first trench a second trench is formed, wherein on the borders of the second trench a second ridge is formed facing the first ridge. The first and second ridges define a material receiving track which may be provided with a material suited to form a conductive track.
摘要:
A method for applying a patterned structure on a surface, comprising providing a donor substrate (1) comprising donor material (1a) between a light source (3) and a receiving surface (5), providing by means of the light source (3) a light pulse (3a) directed to the donor substrate (1), the light pulse (3a) being configured to cause the donor material (1a) to be transferred from the donor substrate (1) onto the receiving surface (5), wherein the donor substrate (1) comprises a pattern (2) of donor material (1a) on discrete portions (2a) of the donor substrate (1). The pattern (2) on the donor substrate (1) is transferred so as to form a pattern (4) of donor material (1a) on the receiving surface (5).
摘要:
A method is provided for assembling a component (20) with a flexible foil (10). The method comprising the steps of - providing (S1) a flexible foil (10) having a first side (11) with at least one liquid confinement zone (12) and at least one liquid confinement subzone (13) enclosed by the liquid confinement zone, - depositing (S2) an alignment liquid (30) in the at least one liquid confinement subzone (13), - moving (S3) the component (20) towards the liquid confinement zone, and bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid in the at least one liquid confinement subzone and releasing (S5) the component (20). The step of moving (S3) the component (20) towards the flexible foil, and the step of bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid, is realized with a gripping tool (130) that includes one or more capillary tubes (131) ending in a downward facing opening (132). At least a portion of the capillary tubes that ends in the downward facing opening (132) is filled with a carrier liquid (135). A first, adhesive force (Fa1) exerted by the carrier liquid on the component (20) is larger than a second force (Fg), that is exerted by gravity on the component and wherein said first adhesive force (Fa1) is smaller than the sum (Fg+Fa2) of said second force (Fg) and a third, adhesive force (Fa2) exerted by the alignment liquid on the component when the component (20) comes into contact with the alignment liquid (30). The alignment liquid (30) in contact with the component (20) exerts adhesive forces on the component that align the released component (20) with the flexible foil (10).
摘要:
The present disclosure concerns a method and system for providing a patterned structure (3p) on an acceptor substrate 4). The method comprises providing a donor substrate (10) arranged between a light source (5) and an acceptor substrate (4). A mask (7) is arranged between the light source (5) and the donor substrate (10). The mask (7) comprises a mask pattern (7p) for patterning light (6). The patterned light (6p) impinging the donor substrate (10) causes the donor material (3) to be released from the donor substrate (10) and transfer to the acceptor substrate (4) to form the patterned structure (3p) thereon. The patterned light (6p) is divided by the mask pattern (7p) into a plurality of separate homogeneously sized beams (6b) simultaneously impinging the donor substrate (10) for causing the donor material (3) to be released from the donor substrate (10) in the form of separate homogeneously sized droplets (3d).
摘要:
The application concerns a method and apparatus for transferring components (11,12,13) such as micro-LEDs. A first substrate (10) is provided with the components (11,12,13). A second substrate (20) is provided with an adhesive layer (20a) comprising a hot melt adhesive material (20m). The components (11,12,13) on the first substrate (10) are contacted with the adhesive layer (20a) on the second substrate (20) while the adhesive layer (20a) is melted. The adhesive layer (20a) is allowed to solidify to form an adhesive connection between the components (11,12,13) and the second substrate (20). The first and second substrates (10,20) are moved apart to transfer the components (11,12,13) from the first substrate (10) to the second substrate (20). At least a subset of the components (11) is transferred from the second substrate (20) to a third substrate (30) by radiating light (L) onto the adhesive layer (20a) to form a jet (21j) of melted adhesive carrying the components (11). The third substrate (30) may be provided with recesses (31) for receiving the transferred components (10). An electrically conductive material (50s) may be applied to the components (11) while the components (11) are disposed on the third substrate (30). The third substrate (30) may comprise a hot melt adhesive layer (31a) to hold the components (11) after transfer. The components (11) or a subset thereof may be transferred from the third substrate (30) to the fourth substrate (40), e.g. using selective illumination by light (L).