摘要:
An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (Tl) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).
摘要:
The opto-electric device (10) comprises an opto-electric layer structure (20) having an anode and a cathode layer (22, 24 resp.) as well as a opto-electric layer (26) arranged between said anode and cathode layers, and having a light-transmission side (28), the cathode layer of said anode and cathode layer being closest to said light-transmission side. A dual electrically conductive layer structure is (40) arranged at a side of said opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer (42, 44 resp.) mutually insulated by a first electrically insulating layer (46), the first electrically conductive layer of said first and second electrically conductive layer being closest to the opto-electric layer structure. A second electrically insulating layer (50) is arranged between the light emitting layer structure (20) and the dual electrically conductive layer structure (40), wherein the first electrically conductive layer (42) is electrically connected by at least a first transverse electrical conductor (62) through said second insulating layer with said anode layer (22) and said second electrically conductive layer (44) is electrically connected by at least a second transverse electrical conductor (64) through said first electrically insulating layer (46), said first electrically conductive layer (42), said second electrically insulating layer (50), said anode electrode layer (22) and said light emitting layer (26), with said cathode layer (24).
摘要:
The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.
摘要:
A curved human interface device (100) is manufactured by thermoforming a stack (10). The stack (10) comprises a front substrate (11) formed of a transparent, first thermoplastic material (11m); an OLED display (13) configured to display an image through the front substrate (11); and a thermomechanical buffer layer (12) formed of a transparent, second thermoplastic material (12m) arranged between the front substrate (11) and the OLED display (13). Heat (H) is applied to the stack (10) for causing a temperature of the front substrate (11) and buffer layer (12) to increase to a respective processing temperature (T1,T2) at which the first and second thermoplastic materials (11m, 12m) become pliable. The stack (10) is thermoformed while the thermoplastic materials (11m,12m) are pliable to form the curved human interface device (100). The second thermoplastic material (12m) has a lower stiffness at the respective processing temperature (T1,T2) than the first thermoplastic material (11m).
摘要:
A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11,12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L), and a surrounding area (12) of the substrate (13), outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).
摘要:
A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.