Plasma processing apparatus and performance validation system therefore
    8.
    发明公开
    Plasma processing apparatus and performance validation system therefore 审中-公开
    系统动物系统zum Kontrollieren von deren Wirkungsweise

    公开(公告)号:EP1720197A1

    公开(公告)日:2006-11-08

    申请号:EP06016997.6

    申请日:2001-07-10

    摘要: A plasma processing apparatus includes a plasma processing chamber (CN) having a plasma excitation electrode (4) for exciting a plasma, a radiofrequency generator (1) for supplying a radiofrequency voltage to the electrode, a radiofrequency feeder (3) connected to the electrode, and a matching circuit (2A) having an input end (PR3) and an output end (PR). The input end is connected to the radiofrequency generator and the output end is connected to an end of the radiofrequency feeder so as to achieve impedance matching between the plasma processing chamber and the radiofrequency generator. A frequency which is three times a first series resonant frequency f 0 of the plasma processing chamber which is measured at the end of the radiofrequency feeder is larger than a power frequency f e of the radiofrequency waves.

    摘要翻译: 一种等离子体处理装置包括:具有用于激发等离子体的等离子体激励电极(4)的等离子体处理室(CN),向该电极供给射频电压的射频发生器(1);与该电极连接的射频馈送器 ,以及具有输入端(PR3)和输出端(PR)的匹配电路(2A)。 输入端连接到射频发生器,输出端连接到射频馈线的一端,以实现等离子体处理室与射频发生器之间的阻抗匹配。 在射频馈送器末端测量的等离子体处理室的第一串联谐振频率f 0的三倍的频率大于射频波的功率频率f e。

    Semiconductor device and method of manufacturing the same
    9.
    发明公开
    Semiconductor device and method of manufacturing the same 审中-公开
    半导体装置及它们的制备方法

    公开(公告)号:EP1427003A3

    公开(公告)日:2005-03-02

    申请号:EP03027739.6

    申请日:2003-12-02

    申请人: OHMI, Tadahiro

    IPC分类号: H01L21/306 H01L21/336

    摘要: In a semiconductor device formed on a silicon surface which has a substantial (110) crystal plane orientation, the silicon surface is flattened so that an arithmetical mean deviation of surface Ra is not greater than 0.15nm, preferably, 0.09nm, which enables to manufacture an n-MOS transistor of a high mobility. Such a flattened silicon surface is obtained by repeating a deposition process of a self-sacrifice oxide film in an oxygen radical atmosphere and a removing process of the self-sacrifice oxide film, by cleaning the silicon surface in deaerated H 2 O or a low OH density atmosphere, or by strongly terminating the silicon surface by hydrogen or heavy hydrogen. The deposition process of the self-sacrifice oxide film may be carried out by isotropic oxidation.

    Fluid control valve and fluid supply/exhaust system
    10.
    发明公开
    Fluid control valve and fluid supply/exhaust system 失效
    Steuerventil undFlüssigkeitszuführungs-/ Entleerungs-系统

    公开(公告)号:EP1486711A2

    公开(公告)日:2004-12-15

    申请号:EP04021884.4

    申请日:1997-12-01

    IPC分类号: F16K31/06

    摘要: The invention relates to a fluid control valve which controls a fluid moving through a valve body (121) by means of opening and closing a portion between a valve seat (112) and a valve holder (126) using a drive unit (28), wherein:

    said drive unit (28) comprises a rod shaped shaft (108) for applying pressure via said valve holder (126) and a valve rod (109), and a member a (104) which is affixed around said rod shaped shaft (108),
    said member a (104) comprises a magnetic material, and
    a coil (102) having a space between it and the shaft and provided at a position parallel to said shaft (108) moves said member a (104) upwardly and downwardly by electromagnetic induction, and using the force of a spring (115), thereby opening and closing the portion between said valve seat (112) and said valve holder (126), and
    a means is provided for adjusting a gap G between said coil (102) and said member a (104).

    摘要翻译: 本发明涉及一种流体控制阀,其通过使用驱动单元(28)打开和关闭阀座(112)和阀保持器(126)之间的部分来控制流过阀体(121)的流体, 其特征在于:所述驱动单元(28)包括用于经由所述阀保持器(126)和阀杆(109)施加压力的杆形轴(108),以及围绕所述杆形轴 108),所述构件a(104)包括磁性材料,并且在平行于所述轴(108)的位置处设置有在所述轴和轴之间具有空间的线圈(102),所述构件a(104)向上和向下移动 通过电磁感应,并且使用弹簧(115)的力,从而打开和关闭所述阀座(112)和所述阀保持器(126)之间的部分,并且设置一个装置,用于调节所述线圈 102)和所述构件a(104)。