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    A method of manufacturing a semiconductor device
    2.
    发明公开
    A method of manufacturing a semiconductor device 失效
    一种制造半导体器件的方法

    公开(公告)号：EP0425037A2

    公开(公告)日：1991-05-02

    申请号：EP90202803.4

    申请日：1990-10-19

    申请人： PHILIPS ELECTRONICS UK LIMITED ,  Philips Electronics N.V.

    发明人： Slatter, John Alfred George ,  Brockman, Henry Edward ,  Haisma, Jan

    IPC分类号： H01L21/18 ,  H01L21/28 ,  H01L21/338 ,  H01L29/41 ,  H01L29/812

    CPC分类号： H01L29/66416 ,  H01L21/187 ,  H01L29/42316 ,  H01L29/47 ,  H01L29/66424 ,  H01L29/7391 ,  H01L29/7722 ,  Y10S148/012

    摘要： A semiconductor device (10) is formed by providing first and second semiconductor bodies (1 and 11) each having first and second major surfaces (2 and 3) and (12 and 13), respectively, defining a rectifying junction pattern (21) adjacent to at least one (12) of the first major surfaces, and bonding the first major surfaces (2 and 12) together to join the two semiconductor bodies (1 and 11) to form the semiconductor device (10) in which the rectifying junction pattern 21 defines a path for the flow of charge carriers between the second major surfaces. The rectifying junction pattern (21) is defined at the one first major surface (12) by an electrically conductive pattern (20) forming a Schottky junction (21) with at least one of the first and second semiconductor bodies (1 and 11).

    摘要翻译： 通过提供分别具有第一和第二主表面（2和3）以及（12和13）的第一和第二半导体本体（1和11）来形成半导体器件（10），所述半导体本体限定了相邻的整流结图案（21） 到第一主表面中的至少一个（12），并且将第一主表面（2和12）结合在一起以接合两个半导体本体（1和11）以形成半导体器件（10），其中整流结图案 21限定了用于第二主表面之间的电荷载体流动的路径。 整流结图案（21）通过与第一和第二半导体本体（1和11）中的至少一个形成肖特基结（21）的导电图案（20）限定在一个第一主表面（12）处。

    Method of manufacturing a device for conducting quantized particles
    9.
    发明公开
    Method of manufacturing a device for conducting quantized particles 失效
    一种制备装置，用于引导量化颗粒的方法。

    公开(公告)号：EP0220772A1

    公开(公告)日：1987-05-06

    申请号：EP86201832.2

    申请日：1986-10-21

    申请人： Philips Electronics N.V.

    发明人： Haisma, Jan ,  Scholtens, Eltjo

    IPC分类号： H01J9/26 ,  G02B6/08 ,  C03B23/207 ,  C03B37/14

    CPC分类号： H01J9/263 ,  C03B23/207 ,  C03B37/15 ,  G02B6/08

    摘要： A method is provided of manufacturing a device for conducting guantized particles such as photons and electrons. The method comprises the following steps:

    - providing a layer of magnetizable material throughout the length of a conductor;
    - dividing the conductor into conductor pieces having a predetermined length;
    - aligning the conductor pieces by means of a magnetic field in such a manner that their ends are positioned perpendicularly to an abutment face;
    - bundling the conductor pieces to a dense packing and
    - joining the bundled conductor pieces to a mechanical unit.

    The method is preferably carried out in such a manner that the abutment face extends substantially perpendicularly to the direction of the gravitational field and that the attraction caused by the magnetic field is greater than and opposed to the force of gravity caused by the gravitational field.