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公开(公告)号：EP1697980B1
公开(公告)日：2009-08-12
申请号：EP04803007.6
申请日：2004-12-22
发明人： ZAKEL, Elke , AZDASHT, Ghassem
IPC分类号： H01L21/306 , F26B3/30
CPC分类号： H01L21/67034 , F26B3/30
摘要： The invention relates to a method and to a device for drying circuit substrates (13), in particular semi-conductor substrates. According to the invention, a circuit surface (30) is rinsed by means of a rinsing liquid (10) during a rinsing phase and is dried in a subsequent drying phase. In the rinsing phase, the circuit substrate is displaced in a direction of the flat extension thereof, transversally and in relation to a liquid level (28) of the rinsing liquid mirror, in such a manner that a liquid meniscus is formed in a transition area which varies according to the relative movement thereof, between the circuit surface and the liquid level, and the transition area moistened by the liquid meniscus is impinged upon by thermal radiation (36) in the drying phase.
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2.发明公开OPTISCHES SYSTEM MIT EINER KAMERAEEINRICHTUNG ZUR BETRACHTUNG MEHERERER ENTFERNT VONEINANDER ANGEORDNETER GEGENSTÄNDE 审中-公开选择系统MIT EINER KAMERAEEINRICHTUNG ZUR BETACHACHUNG MEHERERER ENTFERNT VINEINANDER ANGEORDNETERGEGENSTÄNDE
公开(公告)号：EP1706771A1
公开(公告)日：2006-10-04
申请号：EP04803006.8
申请日：2004-12-22
发明人： ZAKEL, Elke , AZDASHT, Ghassem
CPC分类号： G02B27/143 , G02B27/144
摘要： The invention relates to an optical system (40), for viewing several objects (61, 63), arranged remotely from each other, by means of a camera device (42), comprising a first prism device (43), on the optical axis (41) and in the beam path (47) of the camera device, for the generation of two part beam paths (48, 49) and two object prism devices (51, 52), each arranged in a part beam path and each provided for one object. Both the outlet prism (51) and also the outlet prism (52) are provided with an illumination device embodied as a light diode (57 or 58), each of which emits a illumination beam (59, 60). Said arrangement clearly permits, by means of a inspection device (40) inserted in a contact gap (65) between two substrates (62, 63), checking of the correct alignment of two contact surfaces (61, 63) for mutual contacting, or aligning the contact surfaces (61, 63) with relation to a contact axis (66) which corresponds to the axis of the partial beam paths (49, 48).
摘要翻译： 本发明涉及一种光学系统（40），用于借助于包括第一棱镜装置（43）的照相机装置（42）来观看彼此远离地布置的多个物体（61,63），所述第一棱镜装置在光轴上 （41）和相机装置的光束路径（47）中，用于产生两个部分光束路径（48,49）和两个物体棱镜装置（51,52），每个物体棱镜装置布置在部分光束路径中并且每个都提供 为一个对象。 出口棱镜（51）和出口棱镜（52）都设置有构造为发光二极管（57或58）的照明装置，每个照明装置发射照明光束（59,60）。 所述装置通过插入两个基板（62,63）之间的接触间隙（65）中的检查装置（40）清楚地允许检查用于相互接触的两个接触表面（61,63）的正确对准，或者 使接触表面（61,63）相对于与部分光束路径（49,48）的轴线相对应的接触轴线（66）对准。
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公开(公告)号：EP1326730A1
公开(公告)日：2003-07-16
申请号：EP01980472.3
申请日：2001-10-02
发明人： ZAKEL, Elke , KASULKE, Paul , UEBEL, Oliver , TITERLE, Lars
CPC分类号： H05K13/08 , B23K3/0607 , B23K3/08 , B23Q3/18 , B23Q15/225 , B23Q17/2233 , B23Q17/24 , G05B2219/37555 , G05B2219/50353
摘要： The invention relates to a device for positioning a tool (1) in relation to a workpiece (6). Said device controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) by means of two cameras (10, 11). The first camera (10) records an image essentially along a spatial axis (y), and the other camera (11) is oriented essentially perpendicularly to a surface (8) of the workpiece.
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公开(公告)号：EP0948813A1
公开(公告)日：1999-10-13
申请号：EP97913093.0
申请日：1997-10-09
CPC分类号： H01L24/83 , H01L21/563 , H01L23/49827 , H01L23/4985 , H01L24/29 , H01L2224/1147 , H01L2224/11474 , H01L2224/11902 , H01L2224/13022 , H01L2224/13611 , H01L2224/16237 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83102 , H01L2224/83191 , H01L2224/838 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/15173 , H01L2924/1579 , H01L2924/00 , H01L2224/0401
摘要： Chip module (20) with a chip support (21) and at least one chip (22), in which the chip support is designed as a foil having a supporting layer (23) made of synthetic material and a strip conductor structure (24) with strip conductors (28), and the chip support is connected with the chip by an inserted array of a filling material (37). The strip conductors are connected on their front side with the connecting surfaces (32) of the chip and have external contact areas (26) on their rear side (27) to form a two-dimensionally distributed connecting surfaces device (34) for connecting the chip module with an electronic component or a substrate (31), and the strip conductors (28) extend on a plane on the chip contact side (35) of the supporting layer (23) facing the chip (22), the external contact areas (26) are formed by recesses in the supporting layer (23) which extend against the rear side (27) of the strip conductors (28) and the supporting layer (23) extends on the area of the connecting surfaces (30) of the chip.
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公开(公告)号：EP1326729B1
公开(公告)日：2010-04-21
申请号：EP01972089.5
申请日：2001-10-02
发明人： ZAKEL, Elke , KASULKE, Paul , UEBEL, Oliver , TITERLE, Lars
CPC分类号： H01L21/67144 , B23K3/0607 , B23K3/0623 , H01L21/4853 , H05K3/3478
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公开(公告)号：EP1326730B1
公开(公告)日：2009-09-23
申请号：EP01980472.3
申请日：2001-10-02
发明人： ZAKEL, Elke , KASULKE, Paul , UEBEL, Oliver , TITERLE, Lars
CPC分类号： H05K13/08 , B23K3/0607 , B23K3/08 , B23Q3/18 , B23Q15/225 , B23Q17/2233 , B23Q17/24 , G05B2219/37555 , G05B2219/50353
摘要： The invention relates to a device for positioning a tool (1) in relation to a workpiece (6). Said device controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) by means of two cameras (10, 11). The first camera (10) records an image essentially along a spatial axis (y), and the other camera (11) is oriented essentially perpendicularly to a surface (8) of the workpiece.
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公开(公告)号：EP1370387B1
公开(公告)日：2004-07-28
申请号：EP02730154.8
申请日：2002-04-12
发明人： ZAKEL, Elke , AZDASHT, Ghassem
IPC分类号： B23K3/06
CPC分类号： B23K3/0607 , B23K3/0623 , B23K2201/36 , H05K3/3478
摘要： The invention relates to a device for applying solder globules to a substrate (7, 9) and for remelting the solder globules onto soldering points (6) of the substrate (7, 9). Said device has a capillary (3) for guiding the solder globule (5) to the soldering point (6) and for placing the soldering globule (5) on the free end (4) of the capillary (3) opposite the smoldering point. The invention also relates to a device for guiding heat to the solder globule (5) in order to remelt said solder globule, and a pressing device (10) for holding down the substrate (7, 9) in order to prevent the substrate (7, 9) from springing back when the solder globule (5) is placed and remelted.
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公开(公告)号：EP1360715A2
公开(公告)日：2003-11-12
申请号：EP02702354.8
申请日：2002-02-13
发明人： ZAKEL, Elke , TEUTSCH, Thorsten
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L24/81 , H01L24/83 , H01L24/91 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/13006 , H01L2224/73203 , H01L2224/81191 , H01L2224/81193 , H01L2224/81385 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a method for contacting microchips, whereby an adhesive agent is applied to a side of a substrate on which a strip conductor is arranged, and/or to a side of a microchip on which at least one bump is situated, in such a way that a liquid layer of the adhesive agent is formed on the same. After the microchip has been adjusted in such a way that the at least one bump is situated over a pre-determined position on the strip conductor of the substrate, a pressure contact is established between the at least one bump and the pre-determined position by exerting pressure between the microchip and the substrate, said adhesive agent then being hardened.
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9.发明公开KONTAKTHÖCKERAUFBAU ZUR HERSTELLUNG EINES VERGINDUNGSAUFBAUS ZWISCHEN SUBSTRATANSCHLUSSFLÄCHEN 审中-公开联系HÖCKER建设PRODUCING之间的曲面VERGINDUNGSAUFBAUS一个基板连接的
公开(公告)号：EP1352419A2
公开(公告)日：2003-10-15
申请号：EP01985323.3
申请日：2001-12-19
发明人： ZAKEL, Elke
IPC分类号： H01L21/60
CPC分类号： H01L24/12 , H01L24/02 , H01L24/11 , H01L24/16 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/351 , H01L2924/00
摘要： Contact hump construction (27) and method for production of a contact hump construction for the formation of raised contact sites on connector surfaces (22) of a substrate (21), in particular, chip connector surfaces, with a spacing metallization (28) to achieve a defined height for the contact hump construction, whereby the spacing metallization (28) at last partly comprises tempered copper.
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公开(公告)号：EP1328965A1
公开(公告)日：2003-07-23
申请号：EP01988943.5
申请日：2001-10-24
发明人： TEUTSCH, Thorsten , ZAKEL, Elke
IPC分类号： H01L21/00
CPC分类号： H01L21/68728 , H01L21/68735
摘要： The invention relates to a treatment device for cleaning or ashing the surfaces of flat wafers (10). At least one flat base plate (30) is provided as an electrode in a treatment chamber (40), said treatment chamber being able to be evacuated. Troughs (31) are arranged in the base plate. Said troughs are embodied and distributed in such a way that they are suitable for receiving support pieces (20) and have at least one arrangement or position adapted to the form of the wafer to be treated. The support pieces also comprise a bearing surface. The height of the at least one bearing surface comes to rest at a level (1) above the base plate after insertion into the respective trough.
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