摘要:
The present invention relates to vertical nanowire transistors with a wrap-gated geometry. The threshold voltage of the vertical nanowire transistors is controlled by the diameter of the nanowire, the doping of the nanowire, the introduction of segments of heterostructures in the nanowire, the doping in shell-structures surrounding the nanowire, tailoring the work function of the gate stack, by strain engineering, by control of the dielectrica or the choice of nanowire material. Transistors with varying threshold voltages are provided on the same substrate, which enables the design of advanced circuits utilizing the shifts in the threshold voltages, similar to the directly coupled field logic.
摘要:
The present invention provides a semiconductor device comprising a semiconductor nanoelement (100) and a volume element (105) arranged in epitaxial connection to each other. The semiconductor device is electrically connectable with the volume element (105) and the nanoelement (100) electrically connected in series. The volume element (105) is at least partly doped to provide a high charge carrier concentration into the nanoelement (100) and a low access resistance in an electrical connection to the volume element (105). Preferably the nanoelement (100) protrudes from a semiconductor substrate (110). A concentric layer (106) may be arranged on the volume element (105) to form an electrical contact. LED structures comprising nanoelement-volume element structures (100, 105) are disclosed. A method for producing a semiconductor device according to the invention is also presented.
摘要:
The present invention relates to providing layers of different thickness on vertical and horizontal surfaces (15, 20) of a vertical semiconductor device (1). In particular the invention relates to gate electrodes and the formation of precision layers (28) in semiconductor structures comprising a substrate (10) and an elongated structure (5) essentially standing up from the substrate. According to the method of the invention the vertical geometry of the device (1) is utilised in combination with either anisotropic deposition or anisotropic removal of deposited material to form vertical or horizontal layers of very high precision.