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1.SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译: HALBLEITERBAUELEMENT UND HERSTELLUNGSVERFAHRENDAFÜR公开(公告)号:EP2571052A4
公开(公告)日:2017-04-19
申请号:EP10851389
申请日:2010-05-12
发明人: FUJISAWA ATSUSHI
IPC分类号: H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
CPC分类号: H01L23/49568 , H01L23/3107 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L23/49575 , H01L23/49582 , H01L23/562 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2223/54486 , H01L2224/05554 , H01L2224/27013 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2224/85439 , H01L2224/85444 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/10161 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/00012 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2224/45015 , H01L2924/207