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1.发明公开Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material 失效材料用于电动车辆和含有该材料的多层电路和集成电路芯片的载体。
公开(公告)号：EP0279769A2
公开(公告)日：1988-08-24
申请号：EP88630026.8
申请日：1988-02-17
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Mosko, John C. , Jackson, Connie S. , Traut, Robert G.
CPC classification number: H05K1/0373 , C08K9/06 , H01B3/445 , H01L23/145 , H01L2924/0002 , H01L2924/3011 , H05K1/034 , H05K1/0366 , H05K1/056 , H05K3/389 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2201/068 , Y10S428/901 , Y10T428/252 , Y10T428/259 , Y10T428/2995 , Y10T428/3154 , Y10T428/31544 , Y10T428/31692 , C08L27/12 , H01L2924/00
Abstract: The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material.
Abstract translation: 电基片材料优选包含聚四氟乙烯填充有二氧化硅微玻璃纤维少量沿。 在本发明的一个重要特征，所述陶瓷填料（二氧化硅）涂覆有硅烷涂层材料。
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2.发明公开Method of manufacturing a multilayer circuit 失效Verfahren zur Herstellung einer mehrschichtigen Schaltung。
公开(公告)号：EP0645952A1
公开(公告)日：1995-03-29
申请号：EP94114083.2
申请日：1994-09-08
Applicant: ROGERS CORPORATION
Inventor： Daigle, Robert C. , Smith, David W. , Olenick, John A. , Arthur, David J. , Swei, Gwo S.
CPC classification number: H01L21/4857 , H01L23/49894 , H01L23/5383 , H01L2221/68345 , H01L2924/0002 , H05K1/0206 , H05K1/0289 , H05K3/20 , H05K3/205 , H05K3/243 , H05K3/28 , H05K3/328 , H05K3/423 , H05K3/4617 , H05K3/4632 , H05K3/4647 , H05K3/4652 , H05K3/4658 , H05K3/4682 , H05K2201/0129 , H05K2201/015 , H05K2201/09563 , H05K2203/0726 , H05K2203/0733 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
Abstract: In accordance with the present invention, a circuit assembly is manufactured in an additive process using at least one layer of a fluoropolymer composite material and a conductive material. The conductive layers are plated, and the fluoropolymer composite layers are laminated. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. A plurality of these circuit assemblies are stacked, one on top of the other. At least, selected exposed locations of the conductive material comprise a diffusible conductive material (e.g., gold). Once stacked the circuit assemblies are subjected to lamination under heat and pressure to simultaneously fuse adjacent fluoropolymer composite material and diffuse adjacent diffusible conductive material together to form an integral multilayer circuit having solid conductive interconnects.
Abstract translation: 根据本发明，使用至少一层含氟聚合物复合材料和导电材料的添加方法制造电路组件。 对导电层进行电镀，层压含氟聚合物复合层。 使用填充的氟聚合物复合材料不需要隔离层和导体之间的阻挡金属层。 多个这些电路组件一个在另一个之上堆叠。 至少，导电材料的选定的暴露位置包括可扩散的导电材料（例如，金）。 一旦堆叠，电路组件在热和压力下进行层压，以同时熔化相邻的含氟聚合物复合材料并将相邻的可扩散导电材料扩散在一起以形成具有固体导电互连的整体多层电路。
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3.发明授权Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material 失效材料用于电动车辆和含有该材料的多层电路和集成电路芯片的载体。
公开(公告)号：EP0279769B1
公开(公告)日：1994-09-21
申请号：EP88630026.8
申请日：1988-02-17
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Mosko, John C. , Jackson, Connie S. , Traut, Robert G.
CPC classification number: H05K1/0373 , C08K9/06 , H01B3/445 , H01L23/145 , H01L2924/0002 , H01L2924/3011 , H05K1/034 , H05K1/0366 , H05K1/056 , H05K3/389 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2201/068 , Y10S428/901 , Y10T428/252 , Y10T428/259 , Y10T428/2995 , Y10T428/3154 , Y10T428/31544 , Y10T428/31692 , C08L27/12 , H01L2924/00
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Patent Agency Ranking
公开(公告)号：EP0443401B1
公开(公告)日：1997-03-26
申请号：EP91101884.4
申请日：1991-02-11
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Swei, Gwo S.
CPC classification number: C04B41/009 , C04B26/08 , C04B35/14 , C04B41/4584 , C04B2111/00844 , C08K9/04 , H01L23/145 , H01L2924/0002 , H05K1/034 , H05K1/0366 , H05K1/0373 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/259 , Y10T428/29 , Y10T428/3154 , C04B14/06 , C04B20/1018 , C04B41/51 , C04B41/49 , C08L27/12 , H01L2924/00
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5.发明公开
公开(公告)号：EP0279769A3
公开(公告)日：1990-08-22
申请号：EP88630026.8
申请日：1988-02-17
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Mosko, John C. , Jackson, Connie S. , Traut, Robert G.
CPC classification number: H05K1/0373 , C08K9/06 , H01B3/445 , H01L23/145 , H01L2924/0002 , H01L2924/3011 , H05K1/034 , H05K1/0366 , H05K1/056 , H05K3/389 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2201/068 , Y10S428/901 , Y10T428/252 , Y10T428/259 , Y10T428/2995 , Y10T428/3154 , Y10T428/31544 , Y10T428/31692 , C08L27/12 , H01L2924/00
Abstract: The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material.
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公开(公告)号：EP0443401A3
公开(公告)日：1992-05-06
申请号：EP91101884.4
申请日：1991-02-11
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Swei, Gwo S.
CPC classification number: C04B41/009 , C04B26/08 , C04B35/14 , C04B41/4584 , C04B2111/00844 , C08K9/04 , H01L23/145 , H01L2924/0002 , H05K1/034 , H05K1/0366 , H05K1/0373 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/259 , Y10T428/29 , Y10T428/3154 , C04B14/06 , C04B20/1018 , C04B41/51 , C04B41/49 , C08L27/12 , H01L2924/00
Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a zirconate coupling agent and/or a titanate coupling agent.
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7.发明公开
公开(公告)号：EP0443401A2
公开(公告)日：1991-08-28
申请号：EP91101884.4
申请日：1991-02-11
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Swei, Gwo S.
CPC classification number: C04B41/009 , C04B26/08 , C04B35/14 , C04B41/4584 , C04B2111/00844 , C08K9/04 , H01L23/145 , H01L2924/0002 , H05K1/034 , H05K1/0366 , H05K1/0373 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/259 , Y10T428/29 , Y10T428/3154 , C04B14/06 , C04B20/1018 , C04B41/51 , C04B41/49 , C08L27/12 , H01L2924/00
Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a zirconate coupling agent and/or a titanate coupling agent.
Abstract translation: 提出了一种复合材料，其由陶瓷填充的氟聚合物组成，其中陶瓷涂覆有锆酸酯偶联剂和/或钛酸酯偶联剂。
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公开(公告)号：EP0443400A1
公开(公告)日：1991-08-28
申请号：EP91101883.6
申请日：1991-02-11
Applicant: ROGERS CORPORATION
Inventor： Arthur, David J. , Swei, Swo S. , Nguyen, Phong X.
CPC classification number: H05K1/0373 , C08K7/28 , C08K9/04 , H05K1/034 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0239 , H05K2201/0254 , C08L27/12
Abstract: A composite material is disclosed. The material comprises a polymeric matrix and from about 20 volume percent to about 70 volume percent inorganic particles distributed throughout the matrix. Suitable inorganic particles include hollow inorganic microspheres and porous inorganic particles. The inorganic particles are coated with a surface coating. The composite material of the present invention exhibits a dielectric constant of less than about 2.5 and a thermal coefficient of expansion of less than about 70 ppm/°C.
Abstract translation: 公开了一种复合材料。 该材料包括聚合物基质和分布在整个基质中的约20体积％至约70体积％的无机颗粒。 合适的无机颗粒包括中空无机微球和多孔无机颗粒。 无机颗粒用表面涂层涂覆。 本发明的复合材料的介电常数小于约2.5，热膨胀系数小于约70ppm /℃。
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