Abstract:
The invention relates to an electrical circuit arrangement (11) having a basic element (16) of a printed circuit board (1) and a fastening apparatus (15) for fastening the printed circuit board (1) to the basic element (16), wherein the fastening apparatus (15) holds the printed circuit board (1) by virtue of the basic element (16) appearing on a top side (2) and an underside (3) of the printed circuit board. In this case, the basic element (16) impinges on the top side (2) and underside (3) of the printed circuit board (1) at impingement points (8), which are opposite and offset with respect to one another, whilst elastically deforming the printed circuit board (1).
Abstract:
The invention relates to a control device (10), comprising: a housing unit (12), which is composed of a protective mass (20) made of plastic and which directly surrounds a circuit carrier (18) at least in some areas; at least one circuit unit arranged on the circuit carrier (18); and at least one contact unit (22) for establishing electrical contact between the control device (10) and another electrical module (50), wherein the housing unit (12) is free of the protective mass (20) at least in some areas in the region of the contact unit (22). According to the invention, at least one pressing element (26) is connected to the housing unit (12), the at least one pressing element being designed to at least indirectly produce a pressing force (F) on a counter element (6) of the other electrical module (50), which counter element electrically contacts the contact unit (22).
Abstract:
The invention relates to a control device of a motor vehicle, preferably a motor control device of the motor vehicle, comprising at least one plastic substrate, with which an electrically conductive and/or thermally conductive element is associated. The invention provides for the plastic substrate (1) to have at least one electrically conductive and/or thermally conductive doping (16, 17) forming the element in at least some regions. The invention further relates to a method for the production of a plastic substrate for a control device of a motor vehicle, particularly as described above. The invention also provides for the plastic substrate to be doped for the configuration of an electrically conductive and/or thermally conductive structure, at least in some regions.
Abstract:
The invention relates to a circuit housing (10, 110) having a heat coupling element (70, 170) and a mounting device (80, 180) for mounting a circuit (20, 120) having at least one component (30, 124) in the interior of the circuit housing. A housing wall of the circuit housing comprises the heat coupling element. The heat coupling element is disposed on an interior surface (170a, d, e) of the housing wall, and the mounting device is configured such as to place the at least one component in the interior of the circuit housing in direct contact with the heat coupling element. The invention further relates to an associated method for the heat dissipating mounting of a circuit.
Abstract:
The invention relates to a controller (1), in particular for a motor vehicle, wherein the controller (1) has a housing (2) which has at least one heat-dissipating region (18) and in which at least one electrical and/or electronic subassembly (7) having at least one heat-dissipating element (13) is arranged, wherein the heat-dissipating element (13) is connected to the heat-dissipating region (18), in terms of heat-conducting technology, by means of a heat-conducting element (26) which is introduced into the interior (12) of the housing (2) through at least one housing aperture (25) and is pasty, at least when being introduced. The invention also relates to a corresponding method for producing a controller (1).
Abstract:
The invention relates to a device for cooling components (41), comprising a housing (1) having a hollow space (3) configured therein, in which a phase change material (5) is accommodated, wherein the housing (1) has at least one surface (11), which can be contacted with the component (41) to be cooled, and at least one heat emitting surface (13). The hollow space (3) containing the phase change material (5) is enclosed by at least one coil (17, 18), and the phase change material (5) contains ferromagnetic or magnetizable particles (7). The invention further relates to a method for cooling a component (41) utilizing the device.