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公开(公告)号：EP3828130A1
公开(公告)日：2021-06-02
申请号：EP20207910.9
申请日：2020-11-16
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar
Abstract: A packaged environmental sensor includes: a supporting structure (17); a sensor die (18), which incorporates an environmental sensor and is arranged on a first side (17a) of the supporting structure (17); a control chip (20), which is coupled to the sensor die (18) and is arranged on a second side (17b) of the supporting structure opposite to the first side (17a); and a ring (21), which is bonded to the first side (17a) of the supporting structure (17) and is open towards the outside in a direction opposite to the supporting structure (17), the sensor die (18) being housed within the ring (21).
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公开(公告)号：EP3330688A1
公开(公告)日：2018-06-06
申请号：EP17177413.6
申请日：2017-06-22
Applicant: STMicroelectronics S.r.l.
Inventor： GRITTI, Alex , GHIDONI, Marco Omar
CPC classification number: G01L19/0092 , G01L9/0042 , G01L9/0054 , G01L9/08 , G01L11/06 , G01L19/147 , G01L2019/0053 , H04R19/005 , H04R2201/003
Abstract: A transducer modulus (11; 51; 61; 71; 81; 91), comprising: a supporting substrate (23); a cap (27), which is arranged on the supporting substrate and defines a chamber (8) therewith; a pressure transducer (12') in the chamber (8); an acoustic transducer (12") in the chamber (8); and a processing chip (22), or ASIC, operatively coupled to the pressure transducer (12') and to the acoustic transducer (12"). The pressure transducer (12') and the acoustic transducer (12") are arranged on top of one another to form a stack.
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3.发明公开
公开(公告)号：EP3896727A1
公开(公告)日：2021-10-20
申请号：EP21165321.7
申请日：2021-03-26
Applicant: STMicroelectronics S.r.l.
Inventor： PESATURO, Massimiliano , GHIDONI, Marco Omar
Abstract: An ambient temperature sensor that may be coupled to a PCB (2) and including: a package (20) including a first cap (22) and an insulating structure (24), the insulating structure being formed of thermally insulating material, the first cap and the insulating structure being coupled so as to delimit a first cavity (26); and a semiconductor device (4), which generates an electrical signal indicative of a temperature, the semiconductor device being fixed on top of the insulating structure and being arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity (30), which extends below the semiconductor device and is open laterally.
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公开(公告)号：EP3330689A1
公开(公告)日：2018-06-06
申请号：EP17177436.7
申请日：2017-06-22
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar
IPC: G01L9/00
Abstract: A transducer modulus (11), comprising: a substrate (23); a cap (27) on the substrate, defining a chamber (8); and a sensor modulus (21) in the chamber (8), integrating a first MEMS transducer (12'; 53) facing the chamber (8), and a second MEMS transducer (12") facing the supporting substrate (23). The cap has a first opening (39) that forms a path for access of the first environmental quantity exclusively towards a sensitive element of the first transducer, and the supporting substrate (23) has a second opening (49) that forms a path for access of the second environmental quantity exclusively towards a sensitive element of the second transducer.
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公开(公告)号：EP3534126A2
公开(公告)日：2019-09-04
申请号：EP19157021.7
申请日：2019-02-13
Applicant: STMicroelectronics S.r.l.
Inventor： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , GHIDONI, Marco Omar
Abstract: A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be measured. The column (144) is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor (120). The peripheral structure (146) is configured to transfer the remaining fraction of the load to be measured to the base.
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Patent Agency Ranking6.发明公开MULTI-DEVICE TRANSDUCER MODULE, APPARATUS INCLUDING THE TRANSDUCER MODULE AND METHOD OF MANUFACTURING THE TRANSDUCER MODULE 审中-公开多器件换能器模块，包括换能器模块的装置以及制造换能器模块的方法
公开(公告)号：EP3240306A1
公开(公告)日：2017-11-01
申请号：EP17162651.8
申请日：2017-03-23
Applicant: STMicroelectronics S.r.l.
Inventor： BRIOSCHI, Roberto , GHIDONI, Marco Omar
CPC classification number: H04R19/04 , B06B1/0292 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R1/44 , H04R3/005 , H04R7/06 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11 , H01L2924/00014
Abstract: A multi-device module (61), comprising: a first substrate (23), which houses a first MEMS transducer (21, 1), designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit (22, 22'), coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate (49), which houses a second MEMS transducer (41, 42), designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit (36), mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
Abstract translation: 1。一种多装置模块（61），包括：第一基板（23），其容纳被设计成将第一环境量转换成第一电信号的第一MEMS换能器（21,1）;以及集成电路 耦合到所述第一MEMS换能器，用于接收所述第一电信号; 第二衬底（49），其容纳第二MEMS换能器（41,42），所述第二MEMS换能器设计成将第二环境量转换成第二电信号; 和柔性印刷电路（36），所述柔性印刷电路机械连接到所述第一和第二基板并且电耦合到所述集成电路和所述第二MEMS换能器，使得所述第二电信号在使用中从所述第二MEMS换能器流到所述集成电路 。
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公开(公告)号：EP3330688B1
公开(公告)日：2020-12-02
申请号：EP17177413.6
申请日：2017-06-22
Applicant: STMicroelectronics S.r.l.
Inventor： GRITTI, Alex , GHIDONI, Marco Omar
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公开(公告)号：EP3330689B1
公开(公告)日：2020-10-07
申请号：EP17177436.7
申请日：2017-06-22
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar
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公开(公告)号：EP3534126A3
公开(公告)日：2019-11-13
申请号：EP19157021.7
申请日：2019-02-13
Applicant: STMicroelectronics S.r.l.
Inventor： ABBASI GAVARTI, Mohammad , CALTABIANO, Daniele , GHIDONI, Marco Omar
Abstract: A load sensor package (140) includes a housing having a cap (142), a column (144), a peripheral structure (146), and a base (148). The base (148) includes a major surface configured to mount a stress sensor (120), while the cap (142) includes a cap major surface configured to receive a load to be measured. The column (144) is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor (120). The peripheral structure (146) is configured to transfer the remaining fraction of the load to be measured to the base.
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公开(公告)号：EP3239096A3
公开(公告)日：2018-01-03
申请号：EP17162672.4
申请日：2017-03-23
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar , BRIOSCHI, Roberto
CPC classification number: B81B7/02 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/05 , B81B2207/07 , B81B2207/092 , B81B2207/096 , B81C1/0023 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003
Abstract: A transducer module (10), comprising: a supporting substrate (23), having a first side (23a) and a second side (23b); a cap (27), which extends over the first side of the supporting substrate and defines therewith a first chamber (108) and a second chamber (109) internally isolated from one another; a first transducer (1) in the first chamber (8); a second transducer (42) in the second chamber (18); and a control chip (22), which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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