公开(公告)号：EP1816653A4

公开(公告)日：2008-11-05

申请号：EP05785720

申请日：2005-09-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： OKA YOSHIO ,  TAKII HITOSHI ,  HAYASHI NORIKI

IPC: H01B1/22 ,  H01B1/00 ,  H05K3/46

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0245 ,  H05K2201/0394

Abstract: Disclosed is a conductive paste which is obtained by kneading conductive particles into an epoxy resin and can be easily filled into a via hole. Such a conductive paste enables to form a connected portion wherein the connection resistance does not change over time even under high temperature, high humidity conditions. Also disclosed is a method for manufacturing a multilayer printed wiring board wherein such a conductive paste is used. Specifically disclosed is a conductive paste which is characterized by containing conductive particles and a resin mixture wherein the epoxy resin content with a molecular weight of not less than 10,000 is 30-90% by weight in the total resin component and the elastic modulus at 85˚C after curing is not more than 2 GPa. This conductive paste is also characterized in that the conductive particle content is 30-75% by volume. Also disclosed is a method for manufacturing a multilayer printed wiring board by using such a conductive paste.

公开(公告)号：EP2120516A4

公开(公告)日：2010-08-25

申请号：EP08711398

申请日：2008-02-15

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： OKA YOSHIO ,  KASUGA TAKASHI ,  PARK JINJOO ,  NAKAMA KOUKI

IPC: H05K1/11

CPC classification number: H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

公开(公告)号：EP2424337A4

公开(公告)日：2014-10-01

申请号：EP10766975

申请日：2010-04-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： OKA YOSHIO ,  KASUGA TAKASHI ,  OKADA ISSEI ,  MIKAGE KATSUNARI ,  UENISHI NAOTA ,  OKUDA YASUHIRO

IPC: H05K3/24 ,  H05K3/18

CPC classification number: H05K3/424 ,  C23C28/00 ,  C23C28/023 ,  C23C28/027 ,  H05K1/09 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1241 ,  H05K3/1283 ,  H05K3/188 ,  H05K3/246 ,  H05K3/38 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0154

公开(公告)号：EP1887583A4

公开(公告)日：2009-06-17

申请号：EP06746598

申请日：2006-05-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： OKA YOSHIO ,  TAKII HITOSHI ,  HAYASHI NORIKI

IPC: H01B1/22 ,  H01B1/00 ,  H05K3/12 ,  H05K3/46

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0245 ,  H05K2201/0394 ,  Y10T428/24322 ,  Y10T428/24339

Abstract: A conductive paste, which has a plate-like conductive filler having a 99% cumulative particle diameter of 25μm or less and a binder resin as essential components, is characterized in that the plate-like conductive filler is a metal powdery material provided with an alloy layer of silver and copper on the surface. The conductive paste exhibits excellent conductivity and via hole filling characteristics by being partially fused with a copper foil circuit, i.e. an object to be connected, when connecting the copper foil circuit with heat and pressure, and provides a multilayer printed wiring board having a high connecting reliability and excellent interlayer connecting characteristics.