摘要:
A wafer holder for a semiconductor manufacturing apparatus that has a high heat conductivity and includes a conductive layer such as heater circuit pattern which can be formed with a high precision pattern, a method of manufacturing the wafer holder, and a semiconductor manufacturing apparatus having therein the wafer holder are provided. On a surface of a sintered aluminum nitride piece (10a), paste containing metal particles is applied and fired to form a heater circuit pattern (11) as a conductive layer. Between the surface of the sintered aluminum nitride piece (10a) having the heater circuit pattern (11) formed thereon and another sintered aluminum nitride piece (10b), a glass layer (14) is provided as a joint layer to be heated for joining the sintered aluminum nitride pieces (10a and 10b) together,
摘要:
A susceptor for semiconductor manufacturing equipment obtained by laminating plural aluminum nitride (AlN) ceramic substrates with a high melting point metallic layer and an adhesive layer, and in particular, the aluminum nitride (AlN) ceramic substrate contains a compound of a Group 3a element in an amount of from 0.01 to 1% by weight in terms of the element, and the balance consisting essentially of aluminum nitride (AlN), in which the average particle size of an AlN crystal is from 2 to 5 µm. The susceptor is prepared by obtaining substrates from a mixture of the material powders through the steps of molding, sintering in a non-oxidizing atmosphere at 1,600 to 2,000°C and forming into a desired substrate shape, and then laminating a plurality of the thus obtained substrate with a high melting point metallic layer and an adhesive layer inserted between the substrates, firing the laminate in a non-oxidizing atmosphere at 1,500 to 1,700° and finishing the fired laminate.
摘要:
A wafer holder includes a heater (1) and at least one pair of ceramic base members (4) with the heater (1) interposing therebetween. A backside structure (A) located on the backside relative to heater (1) has a heat insulating structure. The ceramic base member (4) in the backside structure (A) is formed of ceramic having a lower heat conductivity than that of the ceramic base member (4) in a holding surface side structure (B). Further, the ceramic base member (4) in the backside structure (A) has a heat conductivity of 100 W/mK or less and a joint layer (5) has a heat conductivity of 10 W/mK or less. In this way, the wafer holder can be provided capable of preventing heat from spreading toward the backside of the wafer holder.
摘要:
A method of producing ceramics base plates is disclosed, comprising forming a continuous flaw (1a) on at least one surface of a ceramics sintered base plate (1) from end to end using a flawing tool (5) and dividing the ceramics sintered base plate (1) along the flaw (1a) by applying an external force. It is preferred that a blade edge portion (5a) of the flawing tool (5) is made of a cemented carbide or diamond. By the method of the invention, the ceramics sintered base plate can be easily divided, and ceramics base plates excellent in dimensional accuracy are obtained without lowering the strength thereof.
摘要:
Provided is an aluminum nitride sintered body excellent in thermal shock resistance and strength and applicable to a radiating substrate for a power module or a jig for semiconductor equipment employed under a strict heat cycle. An aluminum nitride sintered body obtained with a sintering aid of a rare earth element and an alkaline earth metal element contains 0.01 to 5 percent by weight of an alkaline earth metal element compound in terms of an oxide and 0.01 to 10 percent by weight of a rare earth element compound in terms of an oxide, and the amount of carbon remaining in the sintered body is controlled to 0.005 to 0.1 percent by weight, thereby suppressing grain growth and improving thermal shock resistance and strength of the sintered body.