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    SUBSTRATE FOR POWER MODULES, SUBSTRATE ASSEMBLY FOR POWER MODULES, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES
    1.
    发明公开
    SUBSTRATE FOR POWER MODULES, SUBSTRATE ASSEMBLY FOR POWER MODULES, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES 审中-公开
    用于功率模块的基板，用于功率模块的基板组件以及用于为功率模块制造基板的方法

    公开(公告)号：EP3306655A1

    公开(公告)日：2018-04-11

    申请号：EP16800144.4

    申请日：2016-05-27

    申请人： NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd.

    发明人： KIICHIRO, Mori

    IPC分类号： H01L23/12 ,  H01L23/13 ,  H01L23/36

    CPC分类号： H01L23/3735 ,  B32B3/263 ,  B32B3/30 ,  B32B7/04 ,  B32B15/04 ,  B32B15/20 ,  B32B18/00 ,  B32B37/06 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2311/12 ,  B32B2315/02 ,  B32B2457/00 ,  H01L21/4871 ,  H01L23/13 ,  H01L23/142

    摘要： A power module substrate allows prompt heat dissipation from a semiconductor device and avoids separation of a ceramic plate and a copper plate at their joint interface and cracks in the ceramic plate. A power module substrate (10) for mounting a semiconductor device (14) includes a ceramic plate (11), a copper circuit plate (12) on a main surface of the ceramic plate (11), and a heat dissipation copper plate (13) on a surface of the ceramic plate (11) opposite to the main surface. The copper circuit plate (12) includes at least one first copper circuit plate (12a) and at least one second copper circuit plate (12b) different from the first circuit board (12a). The first copper circuit plate (12a) includes a first portion (15a) on which the semiconductor device (14) is mountable, and a second portion (15b) outward from the first copper circuit plate (12a) and surrounding the first portion (12a) and thinner than the first portion (15a).

    摘要翻译： 功率模块基板允许从半导体器件迅速散热并避免陶瓷板和铜板在其接合界面处的分离和陶瓷板中的裂纹。 一种用于安装半导体器件（14）的功率模块基板（10）包括陶瓷板（11），位于陶瓷板（11）的主表面上的铜电路板（12）以及散热铜板（13） ）置于陶瓷板（11）的与主表面相对的表面上。 铜电路板（12）包括至少一个第一铜电路板（12a）和至少一个不同于第一电路板（12a）的第二铜电路板（12b）。 第一铜电路板（12a）包括可安装半导体器件（14）的第一部分（15a）以及从第一铜电路板（12a）向外且围绕第一部分（12a）的第二部分（15b） ）并且比第一部分（15a）薄。

    COMPOSITE SUBSTRATE
    3.
    发明公开
    COMPOSITE SUBSTRATE 审中-公开
    VERBUNDSUBSTRAT

    公开(公告)号：EP3109893A4

    公开(公告)日：2017-09-27

    申请号：EP15752195

    申请日：2015-02-16

    申请人： SHIN-ETSU CHEMICAL CO LTD

    发明人： KAWAI MAKOTO ,  KONISHI SHIGERU

    IPC分类号： H01L21/02 ,  H01L27/12

    CPC分类号： H01L27/1203 ,  B32B9/04 ,  B32B37/025 ,  B32B2255/20 ,  B32B2307/206 ,  B32B2313/00 ,  B32B2315/02 ,  B32B2315/08 ,  B32B2457/14 ,  C30B29/06 ,  C30B33/06 ,  H01L21/0242 ,  H01L21/0245 ,  H01L21/02521 ,  H01L21/2007 ,  H01L21/76254 ,  H01L21/76841 ,  H01L21/76846 ,  H01L21/84 ,  H01L27/12 ,  H01L29/66772 ,  H01L29/7812

    摘要： This composite substrate has a single-crystal semiconductor thin film (13) provided to at least the front surface of an inorganic insulating sintered-body substrate (11) having a thermal conductivity of at least 5 W/m·K and a volume resistivity of at least 1×10 8 ©·cm. The composite substrate also has, provided between the inorganic insulating sintered-body substrate (11) and the single-crystal semiconductor thin film (13), a silicon coating layer (12) comprising polycrystalline silicon or amorphous silicon. As a result of the present invention, metal impurity contamination from the sintered body can be inhibited, even in a composite substrate in which a single-crystal silicon thin film is provided upon an inexpensive ceramic sintered body which is opaque with respect to visible light, which exhibits an excellent thermal conductivity, and which further exhibits little loss at a high frequency range, and characteristics can be improved.

    摘要翻译： 该复合基板至少在导热系数为5W / m·K以上的无机绝缘
    烧结体基板（11）的表面设置单晶半导体薄膜（13），其体积电阻率 至少1×10 8？cm。 在无机绝缘烧结体基板（11）和单晶半导体薄膜（13）之间，复合基板还具有包含多晶硅或非晶硅的硅涂层（12）。 根据本发明，即使是在对可见光不透明的廉价的陶瓷烧结体上设置单晶硅薄膜的复合基板，也能够抑制来自烧结体的金属杂质污染， 其表现出优异的导热性，并且在高频范围内进一步表现出很小的损耗，并且可以改善特性。

    HONEYCOMB STRUCTURE MANUFACTURING METHOD
    6.
    发明公开
    HONEYCOMB STRUCTURE MANUFACTURING METHOD 审中-公开
    HERSTELLUNGSVERFAHRENFÜREINE WABENSTRUKTUR

    公开(公告)号：EP2816021A1

    公开(公告)日：2014-12-24

    申请号：EP12868835.5

    申请日：2012-02-16

    申请人： Ibiden Co., Ltd

    发明人： KANAI, Masanori ,  YAMAKAWA, Yuu ,  SATO, Masaya

    IPC分类号： C04B37/00 ,  B28B11/00

    CPC分类号： B01D46/0001 ,  B01D46/00 ,  B01D46/001 ,  B01D46/24 ,  B01D46/247 ,  B01D46/2474 ,  B01D2046/2481 ,  B28B1/002 ,  B28B1/08 ,  B32B3/12 ,  B32B37/02 ,  B32B37/10 ,  B32B37/12 ,  B32B37/1284 ,  B32B37/14 ,  B32B37/146 ,  B32B37/18 ,  B32B38/00 ,  B32B38/0004 ,  B32B38/0012 ,  B32B2305/024 ,  B32B2305/80 ,  B32B2307/732 ,  B32B2315/02 ,  B32B2605/00 ,  C04B28/24 ,  C04B37/005 ,  C04B38/0019 ,  C04B2111/00793 ,  C04B2237/08 ,  C04B2237/083 ,  C04B2237/09 ,  C04B2237/341 ,  C04B2237/346 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  Y10T156/1052 ,  C04B35/565 ,  C04B38/0009 ,  C04B14/324 ,  C04B24/383

    摘要： The method of manufacturing a honeycomb structured body of the present invention includes forming a ceramic block by binding multiple pillar-shaped honeycomb fired bodies with adhesive layers interposed therebetween. The honeycomb fired bodies each have many cells longitudinally disposed in parallel with each other and cell walls between the cells. Each cell wall of the honeycomb fired bodies has a thickness of 0.1 to 0.2 mm and each peripheral wall of the honeycomb fired bodies has a thickness of 0.25 to 0.5 mm. The ceramic block forming includes binding the multiple honeycomb fired bodies on a support by piling up the honeycomb fired bodies successively. The binding includes: determining a placing position where a primary honeycomb fired body is to be placed; fixing a position of an end face of at least one secondary honeycomb fired body by applying force to the end face of the secondary honeycomb fired body, the secondary honeycomb fired body being a honeycomb fired body whose side face is to be opposite to a side face of the primary honeycomb fired body below the placing position; and placing the primary honeycomb fired body on the placing position with the position of the end face of the secondary honeycomb fired body being fixed. The fixing further includes first positioning or second positioning based on the number of secondary honeycomb fired bodies before the fixing, the secondary honeycomb fired bodies each being placed on a position where a side face of the secondary honeycomb fired body is opposite to a side face of the primary honeycomb fired body to be placed. When the at least one secondary honeycomb fired body includes one secondary honeycomb fired body, the first positioning is performed to fix a position of an end face of only the single secondary honeycomb fired body. When the at least one secondary honeycomb fired body includes multiple secondary honeycomb fired bodies, the second positioning is performed to fix positions of first end faces of only the multiple secondary honeycomb fired bodies so as to align the positions of the first end faces of the multiple secondary honeycomb fired bodies.

    摘要翻译： 本发明的蜂窝结构体的制造方法包括通过在多个柱状蜂窝烧制体之间夹有粘合剂层而形成陶瓷块。 蜂窝烧制体各自具有彼此平行地纵向设置的许多单元和单元之间的单元壁。 蜂窝烧制体的每个细胞壁的厚度为0.1〜0.2mm，蜂窝烧制体的各周壁的厚度为0.25〜0.5mm。 陶瓷块形成包括将多个蜂窝烧制体连续堆积在支撑体上。 绑定包括：确定放置主要蜂窝烧制体的放置位置; 第二蜂窝烧制体通过向第二蜂窝烧制体的端面施加力而固定至少一个二次蜂窝烧制体的端面的位置，该二次蜂窝烧制体是其侧面与侧面相反的蜂窝烧制体 的主要蜂窝烧制体位于放置位置下方; 并且将第一蜂窝烧制体放置在第二蜂窝烧制体的端面的位置固定的放置位置。 该固定还包括基于在固定之前的二次蜂窝烧制体的数量的第一定位或第二定位，所述第二蜂窝烧制体各自被放置在所述第二蜂窝烧制体的侧面与所述第二蜂窝烧制体的侧面相对的位置 要放置的主要蜂窝烧制体。 当至少一个二次蜂窝烧制体包括一个二次蜂窝烧制体时，执行第一定位以固定仅一个二次蜂窝烧制体的端面的位置。 当至少一个二次蜂窝烧制体包括多个二次蜂窝烧制体时，进行第二定位以固定仅多个二次蜂窝烧制体的第一端面的位置，以便使多个第二蜂窝烧制体的第一端面的位置对齐 二次蜂窝烧制体。