公开(公告)号：EP3113283B1

公开(公告)日：2019-06-05

申请号：EP15755089.8

申请日：2015-02-27

申请人： Samsung Electronics Co., Ltd.

发明人： JUNG, Dong-Yun ,  CHOI, Sung-Tae ,  KIM, Ji-Hoon ,  ROH, Yi-Ju ,  SHIM, Yun-A ,  LEE, Dong-Hyun ,  HONG, Seung-Pyo

IPC分类号： H01Q3/30 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q25/00 ,  H01Q1/24 ,  H01Q21/28 ,  H01Q9/16 ,  H01Q21/06

公开(公告)号：EP2626897A1

公开(公告)日：2013-08-14

申请号：EP11830896.4

申请日：2011-10-05

申请人： Samsung Electronics Co., Ltd

发明人： JUNG, Dong-Yun ,  CHOI, Sung-Tae ,  KIM, Young-Hwan ,  CHOI, Jung-Han ,  KIM, Ji-Hoon ,  LEE, Jei-Young ,  LEE, Dong-Hyun

IPC分类号： H01L23/12 ,  H01L23/48 ,  H01L23/485

CPC分类号： H05K1/0216 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01L2924/30107 ,  H05K1/0204 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit Board (PCB). The a multi-layer substrate has at least one substrate layer, has at least one first chip region and at least one second chip region in a lowermost substrate layer, configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a Co-Planar Waveguide guide (CPW), and has an LGP coupling pad for connecting with a Printed Circuit Board (PCB) in the lowermost layer. The at least one integrated circuit chip is coupled in the first chip region and the second chip region. The PCB is connected with the multi-layer substrate using the LGA coupling via the LGA coupling pad.

摘要翻译： 提供了一种使用Land Grid Array（LGA）耦合的单芯片封装的设备。 该装置包括多层基板，至少一个集成电路芯片和印刷电路板（PCB）。 所述多层衬底具有至少一个衬底层，在最下层衬底层中具有至少一个第一芯片区域和至少一个第二芯片区域，构成垂直结构的传输线转换，以从至少一个 集成电路芯片以同轴形状或Co-Planar波导引导件（CPW）的形式耦合在第一芯片区域中，并且具有用于与最下层中的印刷电路板（PCB）连接的LGP耦合焊盘。 所述至少一个集成电路芯片耦合在所述第一芯片区域和所述第二芯片区域中。 PCB使用LGA耦合通过LGA耦合垫与多层基板连接。

公开(公告)号：EP3113283A1

公开(公告)日：2017-01-04

申请号：EP15755089.8

申请日：2015-02-27

申请人： Samsung Electronics Co., Ltd.

发明人： JUNG, Dong-Yun ,  CHOI, Sung-Tae ,  KIM, Ji-Hoon ,  ROH, Yi-Ju ,  SHIM, Yun-A ,  LEE, Dong-Hyun ,  HONG, Seung-Pyo

IPC分类号： H01Q3/30

CPC分类号： H01Q9/16 ,  H01Q1/241 ,  H01Q3/30 ,  H01Q21/065 ,  H01Q21/28

摘要： An electronic device is provided in a wireless communication system. The device comprises a plurality of antenna sets; a plurality of antenna elements configuring the plurality of antenna sets; an RF transceiver including a plurality of switches for selecting the plurality of antenna elements and a plurality of phase shifters for shifting the phase of a signal transmitted/received through the plurality of antenna elements; and a control unit for determining a beam forming direction and the phase of the signal by simultaneously controlling the plurality of switches and the plurality of phase shifters according to a beambook.

摘要翻译： 一种电子设备，在无线通信系统中提供的设备包括天线设置多个。 天线元件配置的天线设定所述多个的多元性; 到RF收发器包括开关，用于选择天线元件的多个A多元性和移相器的用于移动的信号的相位的多元反mitted /通过天线元件的多个接收到的; 以及用于确定性采矿的控制单元的波束成形方向和信号的通过同时控制开关的多元性和移相器的gemäß到梁书所述多个相。

公开(公告)号：EP3091702A1

公开(公告)日：2016-11-09

申请号：EP15733140.6

申请日：2015-01-02

申请人： Samsung Electronics Co., Ltd.

发明人： ROH, Yi-Ju ,  KIM, Ji-Hoon ,  SON, Ju-Ho ,  SHIM, Yun-A ,  LEE, Dong-Hyun ,  JUNG, Dong-Yun ,  CHOI, Sung-Tae ,  HONG, Seung-Pyo

IPC分类号： H04L25/03

CPC分类号： H04L25/06 ,  H03D2200/0047 ,  H04B1/30 ,  H04B2001/305

摘要： The present invention relates to a method and an apparatus for direct current offset calibration of a direct conversion receiver, a Direct Current (DC) offset calibration apparatus of a direct conversion receiver includes a plurality of variable gain amplifiers for amplifying an input signal based on a gain control value, a DC offset monitoring unit for monitoring a DC offset for an output signal of the plurality of variable gain amplifiers, a plurality of variable Digital to Analog Converters (DACs) for controlling a current applied to each of the plurality of variable gain amplifiers according to a current control code, and a DC offset cancellation unit for determining a current control code set which minimizes the DC offset value per preset gain control value, and thus the DC offset can be precisely cancelled without being affected by external factors such as a signal modulation method and heat and performance degradation of the receiver can be prevented.

摘要翻译： 本发明涉及一种用于直接转换接收机的直流偏移校准的方法和装置，直接转换接收机的直流（DC）偏移校准装置包括多个可变增益放大器，用于基于 增益控制值，用于监视所述多个可变增益放大器的输出信号的DC偏移的DC偏移监视单元，用于控制施加到所述多个可变增益中的每一个的可变增益放大器的多个可变数字到模拟转换器（DAC） 根据当前控制码的放大器以及用于确定使每个预设增益控制值的DC偏移值最小化的电流控制码集的DC偏移消除单元，因此可以精确地消除DC偏移，而不受外部因素的影响，例如 可以防止信号调制方法和接收机的热和性能劣化。