公开(公告)号：EP3186082A2

公开(公告)日：2017-07-05

申请号：EP15774738.7

申请日：2015-08-26

申请人： 3M Innovative Properties Company

发明人： WOLK, Martin B. ,  FREE, Michael Benton ,  SCHMIDT, Daniel J. ,  MEYER, Justin P. ,  PELLERITE, Mark J. ,  JOHNSON, Stephen A. ,  COLLIER, Terry O. ,  MA, Xiaohua

IPC分类号： B32B37/00 ,  H01L51/50 ,  H01L51/00

CPC分类号： B32B38/0036 ,  B32B37/025 ,  B32B38/10 ,  B32B2457/00 ,  B32B2457/10 ,  H01G4/308 ,  H01L51/003 ,  H01M6/005 ,  H01M10/02

摘要： Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films (100) may include a plurality of co-extensive electrical protolayers (22, 23, 24) forming an electrical protolayer stack (20), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 103 and 104 Poise at a shear rate of 100/s when heated to a temperature between its Tg and Tdec.

摘要翻译： 公开了转印膜，由其制成的制品以及制造和使用转印膜以形成电堆叠的方法。 所述转移膜可以包括形成电气原型层叠的多个共同延伸的电气原型层，至少选择的或每个电气原型层独立地包括至少25wt％的牺牲材料和热稳定材料并且具有小于25微米的均匀厚度 。 转移膜可以包括多个形成电气的原型层叠的共同延伸的电气原型层，至少选择的或每个原型层在加热到介于100℃和100℃之间的温度时，在100 / s的剪切速率下独立地表现出103和104泊之间的复数粘度 其Tg和Tdec。

公开(公告)号：EP2273517A1

公开(公告)日：2011-01-12

申请号：EP10167297.0

申请日：2010-06-25

申请人： Delphi Technologies, Inc.

发明人： Taylor, Ralph S. ,  Myers, John D. ,  Baney, William J.

IPC分类号： H01G4/015 ,  H01G13/00

CPC分类号： H01G2/18 ,  H01G4/015 ,  H01G4/1218 ,  H01G4/308 ,  H01G13/00 ,  Y02T10/7022 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/1168

摘要： A method that employs a novel combination of conventional fabrication techniques provides a ceramic short-resistant capacitor (30) that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The method allows thinner and more flexible ceramic capacitors to be made. The method includes forming a first thin metal layer (12) on a substrate (10); depositing a thin, ceramic dielectric layer (14) over the metal layer (12); depositing a second thin metal layer (18) over the dielectric layer to form a capacitor exhibiting a benign failure mode; and separating the capacitor (30) from the substrate (10).

摘要翻译： 使用常规制造技术的新颖组合的方法提供了可弯曲和/或可成形的陶瓷短路电容器（30），以提供非常紧凑并且适合于所需几何形状的多层电容器。 该方法可以制造更薄更柔性的陶瓷电容器。 该方法包括在基底（10）上形成第一薄金属层（12）。 在所述金属层（12）上沉积薄的陶瓷介电层（14）; 在所述电介质层上沉积第二薄金属层（18）以形成呈现良性失效模式的电容器; 以及将所述电容器（30）与所述基板（10）分离。

公开(公告)号：EP1626420A3

公开(公告)日：2007-12-19

申请号：EP05017300.4

申请日：2005-08-09

申请人： TDK Corporation

发明人： Abe, Kyotaro ,  Ishiyama, Tamotsu ,  Sato, Shigeki

IPC分类号： H01G4/30

CPC分类号： C04B35/6342 ,  C04B35/4682 ,  C04B35/6261 ,  C04B35/62625 ,  C04B35/6263 ,  C04B35/6264 ,  C04B35/62665 ,  C04B35/632 ,  C04B35/64 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3225 ,  C04B2235/3239 ,  C04B2235/3262 ,  C04B2235/3436 ,  C04B2235/3454 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/6582 ,  C04B2235/663 ,  H01G4/308 ,  H05K1/0306 ,  H05K3/207 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09881 ,  H05K2203/0156 ,  Y10T428/252

摘要： A release layer paste used for producing a multilayer electronic device, used in combination with an electrode layer paste including terpineol, dehydroterpineol, terpineol acetate, or dehydroterpineol acetate and including a ceramic powder, organic vehicle, plasticizer, and dispersion agent, the organic vehicle containing a binder having polyvinyl acetal as its main ingredient, a ratio (P/B) of the ceramic powder and the binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).

公开(公告)号：EP0732735A3

公开(公告)日：1997-10-01

申请号：EP96400545.8

申请日：1996-03-15

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Kawakami, Hiroyuki, c/o Murata Manufac. Co., Ltd. ,  Kohno, Yoshiaki, c/o Murata Manufac. Co., Ltd. ,  Kubodera, Noriyuki, c/o Murata Manufac. Co., Ltd.

IPC分类号： H01L21/48

CPC分类号： H01G4/308 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0156 ,  H05K2203/0315 ,  H05K2203/1142 ,  Y10T29/49163

摘要： A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film (12) on a PET film (11); forming a multilayered metal film (17) by forming a second metal film (14) on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure (18) including the multilayered metal film (17); forming a portion of the first metal film (12), which is overlain by the second metal film (14) in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the part are diffused into ceramics (16); and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method. As a result, a stepped portion between a portion in which the internal electrodes overlap one another and a portion in which the internal electrodes do not overlap can be prevented from being formed, generation of delamination can effectively be prevented, whereby a monolithic ceramic electronic device exhibiting stable characteristics and a method for manufacturing the monolithic ceramic electronic device can be obtained.

摘要翻译： 一种制造单片陶瓷电子器件的方法包括以下步骤：在PET膜（11）上形成第一金属膜（12）; 通过在第一金属膜的一部分上形成第二金属膜（14），形成多层金属膜（17），第二金属膜比第一金属膜厚; 形成包括所述多层金属膜（17）的整体式陶瓷结构（18）。 在所述整体式陶瓷结构体中形成由所述第二金属膜（14）所覆盖的所述第一金属膜（12）的一部分形成绝缘结构，使得形成所述部件的金属成分扩散到陶瓷（16）中， ; 并烧制陶瓷。 还公开了通过该方法制造的单片陶瓷电子器件。 结果，可以防止形成内部电极彼此重叠的部分与内部电极不重叠的部分之间的阶梯部分，从而可以有效地防止分层的产生，从而将单片陶瓷电子装置 可以获得显示稳定特性的方法和制造该单片陶瓷电子器件的方法。

公开(公告)号：EP0748261A1

公开(公告)日：1996-12-18

申请号：EP93909215.0

申请日：1993-03-30

申请人： VISTATECH CORPORATION

发明人： RAINWATER, Jewel G.

IPC分类号： B05D5 ,  H01G4 ,  H01L21 ,  H01L23 ,  H05K3

CPC分类号： H01L21/67236 ,  H01G4/308 ,  H01L21/4857 ,  H01L21/4867 ,  H05K3/4664

摘要： A method for making a substrate for use in a multilayered integrated circuit or multichip module which includes coating a conductive material (14) on a surface of a support sheet (10) to form a conductive circuit (12) and then drying the sheet. Next, a coating of a layer of dielectric layer (18) is placed on the support surface in the areas where the conductive material is not cast. After which the coated sheet is densified to form a densified conductive circuit embedded dielectric layer. A second coating of a dielectric (28) is placed over the first densified conductive circuit embedded dielectric layer such that the second layer is characterized by vias (30) therein which are in register with at least a portion of the conductive circuit (12). The vias in the second dielectric layer are filled to form electrically conductive vias and then densified to form the substrate (44).

公开(公告)号：EP0362404A4

公开(公告)日：1992-11-04

申请号：EP89903265

申请日：1989-03-07

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： NAKAO, KEIICHI REJIDENSU MOMOYAMA 103 ,  OKINAKA, HIDEYUKI ,  HORIBE, YASUTAKA ,  OKUYAMA,HIKOJI ,  KATOH, MASAHIRO ,  IGUCHI, TAKASHI 19-8-202, SHINTOMI 3-CHOME ,  OHMI, AKIRA 19-7-302, SHINTOMI 3-CHOME ,  MIURA, YOSHIYUKI

IPC分类号： B28B19/00 ,  C04B41/45 ,  C04B41/51 ,  H01C7/10 ,  H01G4/30 ,  H01L41/273 ,  H01L41/297 ,  H01L41/39 ,  H05K1/03 ,  H05K3/46 ,  H01G4/12 ,  H01L41/22

CPC分类号： B28B19/0015 ,  C04B41/4511 ,  C04B41/5194 ,  C04B2111/00844 ,  H01C7/10 ,  H01G4/308 ,  H01L41/273 ,  H01L41/297 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  C04B41/4578

摘要： An electrode-embedded green ceramic sheet (25) formed on a suppport member is attached with pressure onto another green ceramic sheet or an electrode (23). Then, the support member only is peeled off, and the electrode-embedded green ceramic sheet (25) is transferred onto the second green ceramic sheet or electrode (23) so as to be laminated thereon. According to this production method, even a green ceramic sheet having a thickness of as small as 20 microns or less can be laminated maintaining mechanical strength. The electrodes embedded in the green ceramic sheet do not cause the surfaces to become rugged even when many sheets are laminated one upon another.

公开(公告)号：EP0488535A2

公开(公告)日：1992-06-03

申请号：EP91310114.3

申请日：1991-11-01

申请人： BMC TECHNOLOGY CORPORATION

发明人： Crownover, Joseph ,  Meckel, Ben B. ,  Burer, Aubrey M.

IPC分类号： H01G13/06 ,  C23C14/04 ,  H01G4/30

CPC分类号： C23C14/042 ,  C23C14/562 ,  H01G4/308 ,  H01G13/06 ,  H05K1/0306 ,  H05K3/143 ,  Y10T156/1062

摘要： A method and apparatus for manufacturing electrodes for capacitors having a plurality of thin metal coatings on a ceramic dielectric substrate, with the coated substrates assembled in a mononlithic structure. A layer of green ceramic material (10) is formed on a support tape. This green ceramic tape (10) is moved in registration with a stencil web (20) overlying the tape. The stencil web has openings corresponding to the configuration of the conductive coating to be formed on the tape. The sandwich of tape and web is moved through a sputtering chamber (28) in which a selected metal or alloy is sputtered from a target (30) so as to fall on the stencil web (20), coating the ceramic tape wherever openings are present. The sputtering chamber is arranged so that initially the ceramic tape receives a light, low energy metal coating before being exposed to maximum sputtering. This allows a reflective coating to be formed to reflect thermal energy before the intensity of the thermal radiation reaches a level that would damage an uncoated ceramic. The coated ceramic substrate tape may then be divided and assembled into multi-layer monolithic capacitors. In a related embodiment, the metallic electrodes may be sputtered onto a plastic carrier film to form a transferable layer or decalcomania, with the electrodes later transferred to the surface of the ceramic substrate.

摘要翻译： 一种用于制造电容器的方法和装置，其具有在陶瓷电介质基底上的多个薄金属涂层，涂覆的基底以单体结构组装。 在支撑带上形成一层绿色陶瓷材料。 将这块绿色的陶瓷胶带与覆盖在胶带上的模板纸对准移动。 模板网具有对应于要形成在带上的导电涂层的构造的开口。 胶带和纸幅的夹层被移动通过溅射室，其中从目标物溅射选定的金属或合金，以便落在模板纸上，在存在开口的地方涂覆陶瓷带。 溅射室被布置成使得最初陶瓷带在暴露于最大溅射之前接收光，低能量的金属涂层。 这允许在热辐射的强度达到将损坏未涂覆的陶瓷的水平之前形成反射涂层以反射热能。 然后将涂覆的陶瓷基板带分割并组装成多层单片电容器。 在相关实施例中，金属电极可以溅射到塑料载体膜上以形成可转移层或decalcomania，其中电极稍后转移到陶瓷衬底的表面。

公开(公告)号：EP3207552A1

公开(公告)日：2017-08-23

申请号：EP15787488.4

申请日：2015-10-12

申请人： Leibniz-institut Für Festkörper- Und Werkstofffors

发明人： SCHMIDT, Oliver G.

IPC分类号： H01G4/32 ,  H01G4/008

CPC分类号： H01G4/32 ,  H01G4/008 ,  H01G4/10 ,  H01G4/129 ,  H01G4/308 ,  H01G4/33 ,  H01L28/60

摘要： The invention concerns the field of microelectronics and relates to a compact capacitor, which can be used, for example, in high-frequency oscillating circuits and in high-frequency filters. The problem addressed by the invention is that of specifying a compact micro- or nanocapacitor that has reliable and simple contacting of the functional layers. This problem is solved by means of a method for producing a compact micro- or nanocapacitor, in which method a layer stack consisting of at least two functional layers and two layers of a two-dimensional material and consisting of at least two layers of an electrically insulating material is arranged on a substrate, and the at least two functional layers and the layers of a two-dimensional material are arranged protruding beyond the width of the layer stack transversely to the rolling direction on one side each alternately, and then the layer stack is rolled up and the protruding are integrally bonded to each other.

摘要翻译： 本发明涉及微电子学领域，并涉及一种小型电容器，其可用于例如高频振荡电路和高频滤波器中。 本发明解决的问题是指定具有可靠和简单的功能层接触的紧凑型微电容器或纳电容器。 该问题通过用于制造紧凑的微米或纳米电容器的方法来解决，在该方法中，由至少两个功能层和两层二维材料构成并由至少两个电层 绝缘材料布置在基板上，并且所述至少两个功能层和二维材料层在交替的一侧上彼此相对于轧制方向横向地突出超过叠层的宽度，然后层叠 卷起并且突起彼此整体结合。

公开(公告)号：EP2817835B1

公开(公告)日：2016-07-27

申请号：EP13707133.8

申请日：2013-02-19

申请人： Epcos AG

发明人： SOMITSCH, Dieter ,  RINNER, Franz ,  GALLER, Martin ,  RAMLER, Johann ,  GABL, Reinhard ,  BRUNNER, Sebastian

IPC分类号： H01L41/047 ,  H01L41/083 ,  H01L41/293

CPC分类号： H01L41/0472 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30 ,  H01G4/306 ,  H01G4/308 ,  H01G4/33 ,  H01G13/006 ,  H01L24/27 ,  H01L41/083 ,  H01L41/273 ,  H01L41/293 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

公开(公告)号：EP1944345B1

公开(公告)日：2014-04-23

申请号：EP08000305.6

申请日：2008-01-09

申请人： NITTO DENKO CORPORATION

发明人： Kishimoto, Tomoko ,  Arimitsu, Yukio

IPC分类号： H01L21/683 ,  C09J5/06 ,  C09J7/02

CPC分类号： H01L21/6836 ,  C08K5/0016 ,  C08K5/12 ,  C09J5/06 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2205/302 ,  H01G4/308 ,  H01L2221/68327 ,  H01L2924/19041 ,  Y10T428/2848

摘要： Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23±2°C, and a relative humidity of 65±5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165°C and a pressure of one atmosphere for one hour.