公开(公告)号：EP2822368B1

公开(公告)日：2016-06-22

申请号：EP14163388.3

申请日：2014-04-03

申请人： Heidelberger Druckmaschinen AG

发明人： Dr. Schmitt-Lewen, Martin ,  Weber, Alexander

IPC分类号： H05K3/04 ,  H05K3/38 ,  G06K19/077 ,  B41F16/00 ,  B41F19/00 ,  H05K1/03

CPC分类号： H05K3/046 ,  B41F16/002 ,  B41F19/00 ,  H05K1/0386 ,  H05K3/38 ,  H05K3/382 ,  H05K3/386 ,  H05K2201/10098 ,  H05K2203/0522 ,  H05K2203/0537 ,  H05K2203/068 ,  H05K2203/1545

公开(公告)号：EP2129530B1

公开(公告)日：2013-06-19

申请号：EP08742625.0

申请日：2008-04-07

申请人： E. I. Du Pont de Nemours and Company

发明人： BLANCHET, Graciela, Beatriz ,  LEE, Hee, Hyun

IPC分类号： B41M3/00 ,  H01L51/00 ,  H05K3/04 ,  G03F7/00

CPC分类号： H05K3/048 ,  B41M3/006 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L51/0004 ,  H05K1/097 ,  H05K2203/0108 ,  H05K2203/0537

公开(公告)号：EP2129530A1

公开(公告)日：2009-12-09

申请号：EP08742625.0

申请日：2008-04-07

申请人： E. I. Du Pont de Nemours and Company

发明人： BLANCHET, Graciela, Beatriz ,  LEE, Hee, Hyun

IPC分类号： B41M3/00 ,  B41M5/03 ,  H01L21/00 ,  B41F17/00 ,  H05K3/00

CPC分类号： H05K3/048 ,  B41M3/006 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L51/0004 ,  H05K1/097 ,  H05K2203/0108 ,  H05K2203/0537

摘要： The invention provides a method to form a pattern (55) of functional material (46) on a substrate (34) for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material (32) to a substrate (34) and form a pattern of open area (42) on the substrate (34). The functional material (46) is applied to the substrate (34) in at least the open area (42). Contact of an adhesive material (52) to an exterior surface (56) opposite the substrate (34) and separation of the adhesive from the substrate forms the pattern (55) of functional material (46) on the substrate (34). The method is- suitable for the fabrication of microcircuitry for electronic devices and components.,

公开(公告)号：EP1847162B1

公开(公告)日：2009-06-17

申请号：EP06701350.8

申请日：2006-01-24

申请人： SPAL Automotive S.r.l.

发明人： SPAGGIARI, Alessandro

IPC分类号： H05K3/28

CPC分类号： H05K3/041 ,  H05K3/0097 ,  H05K3/202 ,  H05K3/28 ,  H05K2203/0537 ,  H05K2203/1545

公开(公告)号：EP2057677A1

公开(公告)日：2009-05-13

申请号：EP07803020.2

申请日：2007-08-29

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： WEIDNER, Karl

IPC分类号： H01L23/31

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3164 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2203/0537 ,  H05K2203/063 ,  H05K2203/074 ,  H05K2203/1311

摘要： The invention relates to a method and an apparatus for manufacturing an electronic module. The inventive method comprises a substrate (11) which has at least one component (16, 19), particularly a semiconductor chip, arranged on it. In this case, at least one method step involves a film (40) made of plastic material being laminated onto a surface (29) of the substrate (11) and of the at least one component (16, 19), said surface comprising at least one contact area. This method step comprises the following steps: the film (40) to be laminated onto the surface (29) of the substrate (11) and of the at least one component (16, 19), or a film composite (42) comprising the film (40), is arranged in a chamber (31) such that the chamber (31) is split by the film (40) or the film composite (42) into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight; a higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface (29) of the substrate (11) arranged in the second chamber section and the at least one component (16, 19) and the film (40) or the film composite (42), which contact brings about the lamination of the film (40) onto the surface (29).

公开(公告)号：EP1170983A4

公开(公告)日：2005-06-01

申请号：EP00981676

申请日：2000-12-13

申请人： MATSUSHITA ELECTRIC IND CO LTD

发明人： NISHII TOSHIHIRO

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K3/42

CPC分类号： H05K3/0032 ,  H05K1/116 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09909 ,  H05K2203/0191 ,  H05K2203/0537 ,  H05K2203/065 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/24917 ,  Y10T428/249953

摘要： In order to improve the adhesion of a circuit to a circuit forming board, a separation film (4) comprising a base film and a coating layer formed on the base film is joined to both the sides of the board (1). When a laser beam (5) is applied to form a throughhole (6) in the board (1), a unified portion (7) of the board (1) and the separation film (4) is formed around the throughhole (6). An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.

公开(公告)号：EP0252735B1

公开(公告)日：1993-06-02

申请号：EP87306048.7

申请日：1987-07-08

申请人： OLIN HUNT SPECIALTY PRODUCTS, INC.

发明人： Bujese, David Patrick ,  Schmidt, Gary William

IPC分类号： G03G17/04 ,  G03G13/26

CPC分类号： G03G5/026 ,  G03G7/00 ,  G03G13/16 ,  G03G13/26 ,  H05K3/065 ,  H05K2203/0517 ,  H05K2203/0537

公开(公告)号：EP0415692A3

公开(公告)日：1991-12-04

申请号：EP90309366.4

申请日：1990-08-28

申请人： CLYDE PRODUCT TECHNOLOGY LIMITED

发明人： Hamilton, Sheila

IPC分类号： F16B11/00 ,  C09J7/02

CPC分类号： C09J5/00 ,  H05K1/05 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/323 ,  H05K3/386 ,  H05K2201/066 ,  H05K2201/10984 ,  H05K2203/0537 ,  H05K2203/0545 ,  Y02P70/613

摘要： There is described a method of bonding a first article to a second article, by providing a carrier sheet detachably carrying a plurality of closely spaced discrete nodules of adhesive. Applying a contoured surface portion of the first article is applied to said carrier sheet to cause the surface portion of the first article to become substantially covered with nodules of adhesive. The first article is removed from said carrier sheet along with the nodules of adhesive transferred to said first article and applies to a surface portion of the second article to cause the adhesive therebetween to bond the first article to the second article. A material for carrying out the method is also described, being a carrier sheet with adhesive applied thereto in the form of an array of closely spaced discrete nodules.

公开(公告)号：EP0410274A2

公开(公告)日：1991-01-30

申请号：EP90113687.9

申请日：1990-07-17

申请人： DAI NIPPON INSATSU KABUSHIKI KAISHA

发明人： Takeuchi, Satoshi, c/o DAI NIPPON INSATSU K.K.

IPC分类号： H05K3/06 ,  C23F1/02

CPC分类号： B41M1/00 ,  B41M3/00 ,  C23F1/02 ,  C25D5/022 ,  H05K3/0082 ,  H05K3/061 ,  H05K3/064 ,  H05K2203/0117 ,  H05K2203/0537 ,  H05K2203/0551 ,  H05K2203/0585 ,  H05K2203/0726 ,  H05K2203/135

摘要： A fine pattern is formed by the following steps. A prescribed mask pattern of an electrically insulative material (3, 5, 8) is formed on an electroconductive surface of a base plate (2) of a printing plate (1), so that the part, other than the mask pattern, of the printing plate becomes an electroconductive printing pattern part . Then, the printing plate (1) is electrolized and the electrodeposition substance (14) is deposited on the electroconductive printing pattern part of the printing plate (1). Then, the deposited substance (14) is transferred onto the surface of a printing object (20) such as a plate of glass or plastic, for forming a pattern thereon. Thereafter, the surface of the printing object (20) is etched with the electrodeposited substance (14) thus transferred as an erosion resistant material.

摘要翻译： 通过以下步骤形成精细图案。 在印版（1）的基板（2）的导电表面上形成电绝缘材料（3,5,8）的规定的掩模图案，使得除了掩模图案之外的部分 印版成为导电印刷图案部分。 然后，在含有电沉积物质的电解质（11）中进行电解，该电解质（11）作为成分，印刷板作为一个电极（1）和相对的电极（12）都浸没在电解质（11）中，使得 电沉积物质（14）沉积在印版（1）的导电印刷图案部分上。 此后，将印版（1）从电解质（11）中取出，洗涤并干燥。 然后，将沉积物质（14）转印到诸如玻璃或塑料的印刷对象（20）的表面上，以在其上形成图案。 此后，用作为耐腐蚀材料转印的电沉积物质（14）蚀刻印刷对象（20）的表面。 将电沉积物质（14）从印版（1）转印到印刷对象（20）的表面上，随后蚀刻印刷物体表面，能够准确地再现印刷对象上的精细图案 。

公开(公告)号：EP0252735A3

公开(公告)日：1990-04-11

申请号：EP87306048.7

申请日：1987-07-08

申请人： OLIN HUNT SPECIALTY PRODUCTS, INC.

发明人： Bujese, David Patrick ,  Schmidt, Gary William

IPC分类号： G03G17/04 ,  G03G13/26

CPC分类号： G03G5/026 ,  G03G7/00 ,  G03G13/16 ,  G03G13/26 ,  H05K3/065 ,  H05K2203/0517 ,  H05K2203/0537

摘要： A method of fabricating a toned pattern on an isolated nonabsorbent conductive receiving surface is disclosed wherein a charged electrostatic latent image area is established on an electrostatically imageable surface, and is transferred to the conductive receiving surface across a gap of between about 1 mil and about 20 mils filled with a liquid formed at least partially of a nonpolar insulating solvent in which are suspended charged toner particles. There is also disclosed a method of making a permanent master and a permanent master for an electrostatic image transfer and a method of using such permanent master to electrostatically transfer a electrophotographic developed electrostatic image from the permanent master to a receiving surface are disclosed.