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    COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT AND ELECTRICAL/ELECTRONIC COMPONENT USING THE SAME
    2.
    发明公开
    COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT AND ELECTRICAL/ELECTRONIC COMPONENT USING THE SAME 审中-公开
    复合电气/电子元件和电气/电子组件

    公开(公告)号：EP2295618A1

    公开(公告)日：2011-03-16

    申请号：EP09770166.8

    申请日：2009-06-23

    申请人： The Furukawa Electric Co., Ltd.

    发明人： SUGAHARA, Chikahito ,  ZAMA, Satoru ,  TACHIBANA, Akira

    IPC分类号： C23C26/00 ,  C22C19/03 ,  C25D7/00

    CPC分类号： C23C10/28 ,  C22C19/03 ,  C23C18/32 ,  C25D5/50 ,  C25D7/00 ,  Y10T428/12458 ,  Y10T428/12569 ,  Y10T428/1291

    摘要： A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing:
    a metal base material having at least a surface formed of Cu or a Cu alloy; and
    an insulating film provided on at least a part of the metal base material;

    wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and
    wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

    摘要翻译： 一种复合材料，在电气/电子部件，所有这些都被用作材料用于电气/电子部件，包含：具有至少形成的Cu或Cu合金的表面上的金属基体材料; 和在绝缘薄膜设置在至少所述金属基体材料的一部分; worin具有铜扩散在Ni或Ni合金，在金属基体材料和绝缘膜 - 之间的金属层; 和worin的Cu原子的数目，以通过分析由俄歇电子能谱的金属层的最外表面得到的Ni原子的（铜/镍）的数量的比率是0005或更大。

    ELECTRIC CONTACT MATERIAL, ELECTRIC CONTACT MATERIAL MANUFACTURING METHOD, AND TERMINAL
    4.
    发明公开
    ELECTRIC CONTACT MATERIAL, ELECTRIC CONTACT MATERIAL MANUFACTURING METHOD, AND TERMINAL 审中-公开
    ELEKTRISCHES KONTAKTMATERIAL，HERSTELLUNGSVERFAHRENFÜRELEKTRISCHES KONTAKTMATERIAL UND ANSCHLUSS

    公开(公告)号：EP3150745A1

    公开(公告)日：2017-04-05

    申请号：EP15800089.3

    申请日：2015-06-01

    申请人： The Furukawa Electric Co., Ltd. ,  Furukawa Automotive Systems Inc.

    发明人： OKUNO, Yoshikazu ,  KOBAYASHI, Yoshiaki ,  NAKATSUGAWA, Tatsuya ,  MITOSE, Kengo ,  TACHIBANA, Akira ,  KAWATA, Shingo

    IPC分类号： C25D7/00 ,  B21D53/00 ,  C25D5/12 ,  C25D5/50 ,  H01H1/025 ,  H01H1/04

    CPC分类号： H01B1/026 ,  B21D53/00 ,  B32B15/018 ,  C22F1/08 ,  C22F1/10 ,  C22F1/16 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  C25D5/505 ,  C25D7/00 ,  H01H1/025 ,  H01H1/04

    摘要： {Problem} To provide an electrical contact material, in which diffusion of the material of the conductive substrate into the outermost layer is suppressed even in a high-temperature use environment, and in which the increase in contact resistance is suppressed.
    {Means} An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed with respect to the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 µm/µm 2 or less; a method of producing the same; and a terminal.

    摘要翻译： {问题}为了提供即使在高温使用环境下也抑制导电性基板的材料向最外层的扩散而抑制接触电阻的增加的电接触材料。 {装置}具有：由铜或铜合金形成的导电基板（1）的电接触材料（10） 设置在所述导电性基板（1）上的第一中间层（2） 设置在第一中间层（2）上的第二中间层（3）; 以及由锡或锡合金形成并设置在第二中间层（3）上的最外层（4），其中第一中间层（2）被构造为从导电基板（1）侧向 所述第二中间层（3）侧，并且其中，在所述第一中间层（2）中，在相对于所述导电性基板与所述第一中间层之间的界面形成的角度的方向上延伸的晶界的密度 中间层为45°以上，为4μm/μm2以下。 其制造方法; 和一个终端。

    MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT AND ELECTRICAL/ELECTRONIC COMPONENT
    6.
    发明公开
    MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT AND ELECTRICAL/ELECTRONIC COMPONENT 审中-公开
    材料FÜRELEKTRISCHES / ELEKTRONISCHES BAUTEIL UND ELEKTRISCHES / ELEKTRONISCHES BAUTIIL

    公开(公告)号：EP2248663A1

    公开(公告)日：2010-11-10

    申请号：EP09715665.7

    申请日：2009-02-26

    申请人： The Furukawa Electric Co., Ltd.

    发明人： TACHIBANA, Akira ,  ITO, Takayori ,  SUGAHARA, Chikahito

    IPC分类号： B32B15/088 ,  B32B15/08 ,  C23C26/00

    CPC分类号： C08G73/1053 ,  C08G73/1035 ,  C08G73/1067 ,  C08G73/1075 ,  C08G73/14 ,  C09D179/08 ,  H01B3/306 ,  H05K9/0084 ,  Y10T428/12569 ,  Y10T428/31681

    摘要： A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure:


    in which R 1 , R 2 , R 3 , and R 4 each represent one selected from a hydrogen atom, an alkyl group, a hydroxyl group, a halogen atom, and an alkoxy group.

    摘要翻译： 一种用于电气/电子部件的材料，其具有直接形成在金属基板的至少一部分上的树脂涂层或设置在金属基板上的金属层的至少一部分，树脂涂层由树脂组合物形成 在分子结构中含有选自由式（I）或（II）表示的结构的聚酰胺酰亚胺树脂和聚酰亚胺树脂中的至少一种：其中R 1，R 2，R 3和R 4各自表示选自氢原子，烷基，羟基，卤素原子和烷氧基的一个。