公开(公告)号：EP2779810A2

公开(公告)日：2014-09-17

申请号：EP14158757.6

申请日：2014-03-11

申请人： Tripod Technology Corporation

发明人： Huang, Bo-Shiung ,  Yang, Wei-Hsiung ,  Shih, Han-Ching ,  Lin, Cheng-Feng

IPC分类号： H05K1/16 ,  H05K3/46 ,  H01F17/06

CPC分类号： H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

摘要： A printed circuit board package structure includes a substrate (110) having a first surface (111) and a second surface (113), a ring-shaped magnetic element (120), an adhesive layer (130), conductive portions (140) and conductive channels (150). The first and second surfaces respectively have first (114) and second (116) metal portions. A ring-shaped concave portion (112) is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall (122) and outside an outer wall (124) of the ring-shaped concave portion. Each of the conductive channels includes a conductive film (152) electrically connects to the aligned conductive portion and second metal portion.

摘要翻译： 印刷电路板封装结构包括具有第一表面（111）和第二表面（113），环形磁性元件（120），粘合剂层（130），导电部分（140）和 导电通道（150）。 第一和第二表面分别具有第一（114）和第二（116）金属部分。 环形凹部（112）形成在未被第一表面的第一金属部分覆盖的位置上。 环形磁性元件放置在环形凹部中。 粘合层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道贯穿导电部分，粘合剂层和基板，并且分别位于环形凹入部分的内壁（122）和外壁（124）的外侧。 每个导电沟道包括导电膜（152），其电连接到对齐的导电部分和第二金属部分。

公开(公告)号：EP2779810A3

公开(公告)日：2014-11-26

申请号：EP14158757.6

申请日：2014-03-11

申请人： Tripod Technology Corporation

发明人： Huang, Bo-Shiung ,  Yang, Wei-Hsiung ,  Shih, Han-Ching ,  Lin, Cheng-Feng

IPC分类号： H05K1/16 ,  H05K3/46 ,  H01F17/06 ,  H05K1/11 ,  H05K1/02 ,  H05K3/42

CPC分类号： H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

摘要： A printed circuit board package structure includes a substrate (110) having a first surface (111) and a second surface (113), a ring-shaped magnetic element (120), an adhesive layer (130), conductive portions (140) and conductive channels (150). The first and second surfaces respectively have first (114) and second (116) metal portions. A ring-shaped concave portion (112) is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall (122) and outside an outer wall (124) of the ring-shaped concave portion. Each of the conductive channels includes a conductive film (152) electrically connects to the aligned conductive portion and second metal portion.

公开(公告)号：EP2779810B1

公开(公告)日：2019-01-30

申请号：EP14158757.6

申请日：2014-03-11

申请人： Tripod Technology Corporation

发明人： Huang, Bo-Shiung ,  Yang, Wei-Hsiung ,  Shih, Han-Ching ,  Lin, Cheng-Feng

IPC分类号： H05K1/16 ,  H05K3/46 ,  H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H01F27/28 ,  H01F17/06

公开(公告)号：EP2863721B1

公开(公告)日：2016-06-29

申请号：EP14189035.0

申请日：2014-10-15

申请人： Tripod Technology Corporation

发明人： Huang, Bo-Shiung ,  Yang, Wei-Hsiung ,  Shih, Han-Ching ,  Lin, Cheng-Feng

IPC分类号： H05K3/46 ,  H01F17/00 ,  H01F17/04 ,  H01F17/06 ,  H01F27/28 ,  H01F41/04 ,  H05K1/16 ,  H05K3/00 ,  H05K1/02

CPC分类号： H05K1/181 ,  H01F17/0006 ,  H01F17/06 ,  H01F27/2804 ,  H01F41/046 ,  H05K1/0272 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/165 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0275 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/1003 ,  H05K2203/1178 ,  Y10T29/302 ,  Y10T29/49165

公开(公告)号：EP2863721A1

公开(公告)日：2015-04-22

申请号：EP14189035.0

申请日：2014-10-15

申请人： Tripod Technology Corporation

发明人： Huang, Bo-Shiung ,  Yang, Wei-Hsiung ,  Shih, Han-Ching ,  Lin, Cheng-Feng

IPC分类号： H05K3/46 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/16 ,  H05K3/00

CPC分类号： H05K1/181 ,  H01F17/0006 ,  H01F17/06 ,  H01F27/2804 ,  H01F41/046 ,  H05K1/0272 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/165 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0275 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/1003 ,  H05K2203/1178 ,  Y10T29/302 ,  Y10T29/49165

摘要： A printed circuit board package structure 100 includes a substrate 110, plural ring-shaped magnetic elements 130, a support layer 140, and first conductive layers 160, 162, 164. The substrate has two opposite first and second surfaces 112, 114, first ring-shaped recesses 116, and first grooves 118. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings 119. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes 150. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

摘要翻译： 印刷电路板封装结构100包括衬底110，多个环形磁性元件130，支撑层140和第一导电层160,162,164。衬底具有两个相对的第一和第二表面112,114，第一环 形状的凹部116和第一凹槽118.第一环形凹部中的每一个通过至少一个第一凹槽与另一个第一环形凹部连通，并且至少两个第一环形凹槽与 基板的侧表面通过第一凹槽形成至少两个开口119.环形磁性元件分别位于第一环形凹部中。 支撑层位于第一表面上，并且覆盖第一环形凹部和第一凹槽。 支撑层和基板具有通孔150.第一导电层分别位于支撑层和面向通孔的基板的表面上。