公开(公告)号：EP3134253A4

公开(公告)日：2018-06-13

申请号：EP15818955

申请日：2015-04-21

申请人： UNIV CORNELL

发明人： MACCURDY ROBERT ,  LIPSON HOD

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K3/28 ,  H05K3/36 ,  H05K3/46

CPC分类号： H05K1/185 ,  A61B17/50 ,  B29C64/00 ,  B29C65/16 ,  B29C67/0051 ,  B29L2031/34 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L21/67115 ,  H01L21/67132 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/112 ,  H01L25/18 ,  H01L25/50 ,  H01L27/01 ,  H01L27/13 ,  H05K1/0287 ,  H05K1/113 ,  H05K1/115 ,  H05K1/117 ,  H05K1/14 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/125 ,  H05K3/284 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4673 ,  H05K3/4697 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1327

摘要： A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.