VACUUM HEAT INSULATION VALVE
    7.
    发明公开
    VACUUM HEAT INSULATION VALVE 审中-公开
    真空隔热阀

    公开(公告)号:EP1707858A1

    公开(公告)日:2006-10-04

    申请号:EP05703504.0

    申请日:2005-01-13

    IPC分类号: F16K51/00

    摘要: Summary
    The present invention provides a vacuum thermal insulating valve that may be used at high temperature in gas supply systems or gas exhaust systems, and also may be made substantially small and compact in size owing to its excellent thermal insulating performance.
    With a vacuum thermal insulating valve comprising a valve equipped with a valve body and an actuator, and a vacuum thermal insulating box that houses the valve, the afore-mentioned vacuum thermal insulating box S is formed by a square-shaped lower vacuum jacket S 5 having a cylinder-shaped vacuum thermal insulating pipe receiving part J on a side and with its upper face made open, and the square-shaped upper vacuum jackets S 4 , which is hermetically fitted to the lower vacuum jacket S 5 and with its lower face made open.

    摘要翻译: 发明内容本发明提供一种真空热绝缘阀,其可以在气体供应系统或排气系统中在高温下使用,并且由于其优异的绝热性能,其尺寸可以做得基本上小而紧凑。 上述真空保温箱S由具有配备有阀体和致动器的阀以及容纳该阀的真空保温箱的真空保温箱S由方形的下部真空保护套S5形成, 一侧为圆柱形的真空保温管接收部分J,其上表面敞开;以及方形的上部真空套S4,其密封地装配在下部真空套S5上并且其下表面敞开。

    ORIFICE-BUILT-IN VALVE
    8.
    发明授权
    ORIFICE-BUILT-IN VALVE 有权
    阀,内置集成开幕

    公开(公告)号:EP1300619B1

    公开(公告)日:2006-08-02

    申请号:EP00935552.0

    申请日:2000-06-05

    IPC分类号: F16K47/08

    摘要: It is an object of the present invention to provide at low costs a valve with an integral orifice for use in a gas feeding equipment provided with a pressure-type flow volume control device to be employed for manufacturing of semi-conductors and chemical goods. The valve with an integral orifice has the excellent flow rate control characteristics by improving the processing accuracy of the orifice and preventing the distortion of the orifice at the time of assembling. To realize the objects of the present invention, the main part of the valve with an integral orifice comprises a valve main body made of heat-resisting materials having a gas inflow passage in communication with a valve chamber with an upper open end and a gas outflow passage, a synthetic resin made valve seat body formed in the valve chamber and having a gas outflow passage in communication with the gas outflow passage of the aforementioned valve main body and a valve seat, an orifice disc made of heat-resisting materials removably installed in the gas outflow passage of the valve seat body, and an orifice formed in the orifice disc to reduce the gas outflow passage of the valve seat body; wherein the orifice is formed in the stainless steel made orifice disc in advance and the metal made orifice disc with the orifice formed by a separate processing and the synthetic resin made valve seat body are removably assembled, wherein the orifice disc and the synthetic resin made valve seat body are fixed airtight to the valve main body by pressing the valve seat body via the metal inner disc.

    PLASMA PROCESSING APPARATUS
    9.
    发明公开
    PLASMA PROCESSING APPARATUS 审中-公开
    等离子体处理装置

    公开(公告)号:EP1681715A1

    公开(公告)日:2006-07-19

    申请号:EP04818177.0

    申请日:2004-11-02

    IPC分类号: H01L21/31 H01L21/3065

    摘要: The present invention has an object of improving the cooling efficiency of the process gas supply part of a plasma processor and thereby suppressing an increase in the temperature of the process gas supply part.
    Therefore, used in the present invention is a plasma processor having a processing vessel having a holder holding a substrate to be processed, a microwave antenna provided on the processing vessel so as to oppose the substrate to be processed, and a processing gas supply part provided between the substrate to be processed on the holder and the microwave antenna so as to oppose the substrate to be processed, characterized in that the process gas supply part has multiple first openings through which plasma formed in the processing vessel passes, a process gas channel connectable to a process gas source, multiple second openings communicating with the process gas channel, and a cooling medium channel through which a cooling medium cooling the process gas supply part flows, wherein the cooling medium includes mist.

    摘要翻译: 本发明的目的在于提高等离子体处理装置的处理气体供给部的冷却效率,抑制处理气体供给部的温度上升。 因此,本发明中使用的是具有处理容器的等离子体处理装置,该处理容器具有:保持被处理基板的保持架;以与处理对象基板相对的方式设置在处理容器上的微波天线;设置处理气体供给部 在所述支架上的被加工基板与所述微波天线之间,与所述被处理基板相对,其特征在于,所述处理气体供给部具有多个供所述处理容器内形成的等离子体通过的第一开口部,能够连接处理气体流路 其特征在于,在处理气体源具有与所述处理气体流路连通的多个第二开口以及冷却所述处理气体供给部的冷却介质流动的冷却介质流路,所述冷却介质包含雾。

    METHOD AND APPARATUS FOR CONVEYING THIN SHEET-LIKE SUBSTRATE
    10.
    发明授权
    METHOD AND APPARATUS FOR CONVEYING THIN SHEET-LIKE SUBSTRATE 失效
    方法和设备运送片状的T0

    公开(公告)号:EP0889515B1

    公开(公告)日:2006-06-28

    申请号:EP97912528.3

    申请日:1997-11-21

    IPC分类号: H01L21/00

    摘要: When a thin sheet-like substrate S is conveyed between conveying chambers (2) equipped with a processing apparatus (1) and kept in an inert gas atmosphere by using a conveying robot (30) equipped with an accommodation chamber (3) capable of accommodating the thin sheet-like substrate (S) in an inert gas atmosphere, a connection chamber (4) is interposed between the accommodation chamber (3) and the conveying chamber (2) when the thin sheet-like substrate (S) is transferred between the accommodation chamber (3) of the conveying robot (30) and the conveying chamber (2) on the side of the processing apparatus (1), and is vacuumized, and then an inert gas is introduced. Thereafter, gate valves (GV1 and GV2) of the accommodation chamber (3) and the conveying chamber (2) are opened and the thin sheet-like substrate (S) is carried in and out.