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公开(公告)号：EP4253466B1
公开(公告)日：2024-10-02
申请号：EP21897870.8
申请日：2021-11-19
CPC分类号： C08K2201/00620130101 , C08K2003/26720130101 , C08L11/00 , C08K3/22 , C08K2003/222420130101
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公开(公告)号：EP3991970B1
公开(公告)日：2024-09-25
申请号：EP20832650.4
申请日：2020-06-19
IPC分类号： C08J5/18 , C08G63/60 , B32B27/36 , B32B15/09 , B32B15/18 , B32B15/20 , B32B27/18 , B32B27/20
CPC分类号： C08G63/605 , C08J5/18 , C08J2367/0320130101 , B32B15/18 , B32B2307/30620130101 , B32B27/18 , B32B2457/0820130101 , B32B2307/70420130101 , B32B2457/0020130101 , B32B2307/73420130101 , B32B27/36 , B32B15/20 , B32B2307/3020130101 , B32B2307/73220130101 , B32B2307/74820130101 , B32B2307/20620130101 , B32B15/09 , B32B27/20
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公开(公告)号：EP4023439B1
公开(公告)日：2024-09-18
申请号：EP20856862.6
申请日：2020-08-19
CPC分类号： B32B27/00 , B32B27/30 , B32B27/18 , C08K5/3492 , B32B7/023 , B32B27/08 , B32B27/304 , B32B27/308 , B32B2250/0220130101 , B32B2250/2420130101 , B32B2307/30820130101 , B32B2307/41220130101 , B32B2307/3020130101 , B32B2307/70420130101 , B32B2307/7120130101 , B32B2307/73220130101 , B32B2605/00620130101 , B32B7/12 , B32B2307/7520130101 , B32B2307/726520130101 , B32B2307/58420130101 , B32B2605/00320130101 , B32B2307/40620130101 , B32B27/36 , B32B2307/41420130101 , B32B2270/0020130101 , B32B2605/0820130101 , B32B2307/71220130101 , Y02E10/50
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公开(公告)号：EP3882010B1
公开(公告)日：2024-09-11
申请号：EP19885994.4
申请日：2019-11-13
IPC分类号： B29K21/00 , B29K23/00 , B29K75/00 , B32B3/30 , B29C59/04 , B29C48/21 , B32B27/20 , B32B27/08 , B32B7/12 , B29L31/34 , B29C51/16 , B29C51/10 , B29C51/14 , B29C35/08 , B29C59/02 , B29K305/00 , B29L9/00 , B32B27/22 , B32B27/30 , B32B27/40
CPC分类号： B29C2059/02320130101 , B29C2035/082720130101 , B29C2035/082220130101 , B29C51/10 , B29C51/14 , B29C51/16 , B29K2305/0020130101 , B29L2009/00820130101 , B29L2031/340620130101 , B32B7/12 , B32B2255/1020130101 , B32B27/308 , B32B2307/40620130101 , B32B27/306 , B32B2250/0220130101 , B32B2307/2120130101 , B32B27/34 , B32B2307/73220130101 , B32B2274/0020130101 , B32B2471/0420130101 , B32B27/302 , B32B2307/714520130101 , B32B2264/1020130101 , B32B27/32 , B32B2270/0020130101 , B32B2425/0020130101 , B32B27/40 , B32B27/22 , B32B2439/0020130101 , B32B2457/0020130101 , B32B27/36 , B32B2605/00320130101 , B32B3/30 , B32B2272/0020130101 , B32B2307/402620130101 , B32B2264/10220130101 , B32B2262/10120130101 , B32B27/304 , B32B27/08 , B32B27/20 , B32B2250/2420130101 , B29C59/025 , B29C59/04 , B29C48/21 , B29C48/495 , B29C48/305 , B29C48/277 , B29C48/92 , B29C48/914 , Y02P70/10 , B30B3/005
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公开(公告)号：EP4417645A1
公开(公告)日：2024-08-21
申请号：EP22895523.3
申请日：2022-11-10
发明人： WADA, Kosuke , FUKAO, Kenji , ONOZUKA, Masao
摘要： The inorganic filler of the present invention has a zeta potential of -15 mV or less at a pH of 7. The heat dissipation member of the present invention contains the inorganic filler of the present invention and a resin. The present invention can provide an inorganic filler that has good dispersibility in a resin, and a heat dissipation member containing the inorganic filler.
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公开(公告)号：EP4414324A1
公开(公告)日：2024-08-14
申请号：EP22892820.6
申请日：2022-11-09
发明人： WADA, Kosuke , FUKAO, Kenji , IWASAKI, Takayuki
IPC分类号： C01B21/064 , C08K3/38 , C08K9/06 , C08L83/07
CPC分类号： C01B21/064 , C08L83/04 , C08K3/38 , C08K9/06
摘要： A boron nitride powder of the present invention is a boron nitride powder surface-treated with a reactive silicone oil having a mass average molecular weight of 5000 or more. According to the present invention, a boron nitride powder that can be mixed with a resin to produce a heat dissipation sheet having an improved insulating property can be provided.
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7.发明公开
公开(公告)号：EP4407659A1
公开(公告)日：2024-07-31
申请号：EP22883392.7
申请日：2022-10-07
IPC分类号： H01L21/304 , B32B27/00 , C09J7/20 , C09J7/29 , C09J7/38 , C09J201/00 , H01L21/301 , H01L21/683
CPC分类号： B32B27/00 , C09J7/29 , C09J7/38 , C09J7/20 , C09J201/00 , H01L21/30 , H01L21/304 , H01L21/683
摘要： The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material which is used for an adhesive sheet for processing a semiconductor wafer having a projected part, wherein the thermal shrinkages of the base material in the machine direction (MD) and in the transverse direction (TD) after heating at 130°C for 10 minutes are both 0% or more.
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公开(公告)号：EP4067433B1
公开(公告)日：2024-07-17
申请号：EP20894238.3
申请日：2020-11-20
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公开(公告)号：EP4382558A1
公开(公告)日：2024-06-12
申请号：EP22852828.7
申请日：2022-07-19
摘要： A resin film that has both high transparency and excellent blocking resistance is provided. A film, including crosslinked (meth)acrylic acid ester-based resin particles and including methacrylic acid ester-based resin as a main component, wherein the crosslinked (meth)acrylic acid-based resin particles have an average particle diameter of 1% or more and 10% or less with respect to an average thickness of the film, wherein the film does not comprise vinylidene fluoride-based resin, wherein a haze of the film measured based on JIS K7136: 2000 is 5% or less, and wherein a clarity (CLR) of the film is 97% or more.
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