公开(公告)号：EP3206227A4

公开(公告)日：2017-10-25

申请号：EP15848453

申请日：2015-10-08

申请人： SUPERUFO291 TEC

发明人： FUKUI AKIRA

IPC分类号： C25D5/12 ,  C25D5/50 ,  C25D7/12 ,  H01L23/373

CPC分类号： H01L23/3732 ,  B22F3/1035 ,  B22F3/105 ,  B22F3/14 ,  B22F3/16 ,  B22F3/24 ,  B22F7/008 ,  B22F7/04 ,  B22F2003/247 ,  B22F2007/042 ,  B22F2301/052 ,  B22F2301/255 ,  B22F2302/406 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  C22C26/00 ,  C23C18/16 ,  C23C18/32 ,  C25D3/12 ,  C25D5/12 ,  C25D5/34 ,  C25D5/44 ,  C25D5/50 ,  C25D7/12 ,  H01L21/4882 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2003/241

摘要： A heat dissipation substrate having a metallic layer with few defects on its surface is obtained by a process including the steps of: forming a metallic layer by plating on the surface of an alloy composite mainly composed of a powder of a principal metal, additional metal and diamond; and heating and pressurizing the alloy composite coated with the metallic layer, at a temperature equal to or lower than the melting points of the metallic layer and the alloy composite. Consequently a heat dissipation substrate is obtained which has a coefficient of linear expansion of 6.5 ppm/K or higher and 15 ppm/K or lower as well as a degree of thermal conductivity of 420 W/m·K or higher, the substrate having a metallic layer with few defects in its surface layer and thereby allowing for a Ni-based plating on which the void percentage in the solder joint will be 5 % or lower.

公开(公告)号：EP3190198A4

公开(公告)日：2017-10-25

申请号：EP15838762

申请日：2015-09-01

申请人： ALMT CORP

发明人： MORIKAWA TATSUYA ,  KADOKURA TAKANORI ,  OSAWA KENSUKE

IPC分类号： C22C26/00 ,  B22F3/10 ,  B22F3/24 ,  C22C1/05 ,  C22C1/10 ,  C22C5/06 ,  C22C5/08 ,  C22C32/00

CPC分类号： C09K5/14 ,  B22F1/0003 ,  B22F3/10 ,  B22F3/24 ,  B22F2301/255 ,  B22F2302/05 ,  B22F2302/20 ,  B22F2302/406 ,  B22F2302/45 ,  B22F2304/10 ,  C22C1/05 ,  C22C1/10 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C32/00 ,  C22C2026/005 ,  C22C2026/007 ,  C22C2026/008 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3735

摘要： Provided are a diamond composite material which is excellent in thermal conductivity, suitable as a material for a heat radiating member, and dense, the heat radiating member, and a method for producing a diamond composite material that can productively produce a diamond composite material which is excellent in wettability between diamond and metal and dense. The diamond composite material includes: a coated diamond particle including a diamond particle and a carbide layer covering a surface of the diamond particle and including an element of group 4 of the periodic table; and silver or a silver alloy binding such coated diamond particles together, with an oxygen content of 0.1 mass% or less.

公开(公告)号：EP3294480A1

公开(公告)日：2018-03-21

申请号：EP16729654

申请日：2016-05-06

申请人： DIAMOND INNOVATIONS INC

发明人： SURYAVANSHI ABHIJIT ,  GLEDHILL ANDREW ,  LONG CHRISTOPHER ,  KONOVALOV VALERIY ,  ZHANG KAI

IPC分类号： B22F3/15 ,  B22F3/24 ,  B22F5/00 ,  B23B27/14 ,  B23B27/20 ,  B23P15/28 ,  B24D3/08 ,  C22C11/00 ,  C22C12/00 ,  C22C26/00 ,  C22C29/02 ,  C22C29/08 ,  E21B10/46

CPC分类号： B22F3/15 ,  B22F3/14 ,  B22F3/24 ,  B22F5/00 ,  B22F7/06 ,  B22F2005/001 ,  B22F2301/15 ,  B22F2301/30 ,  B22F2302/10 ,  B22F2302/15 ,  B22F2302/406 ,  B22F2303/30 ,  B22F2998/10 ,  B22F2999/00 ,  B24D3/08 ,  B24D18/0009 ,  B24D99/005 ,  C22C11/00 ,  C22C12/00 ,  C22C19/07 ,  C22C26/00 ,  C22C29/08 ,  C22C2026/006 ,  E21B10/5735 ,  B22F2003/244 ,  B22F3/26

摘要： Cutting elements having accelerated leaching rates and methods of making the same are disclosed herein. In one embodiment, a method of forming a cutting element includes assembling a reaction cell having diamond particles, a non-catalyst material, a catalyst material, and a substrate within a refractory metal container, where the non-catalyst material is generally immiscible in the catalyst material at a sintering temperature and pressure. The method also includes subjecting the reaction cell and its contents to a high pressure high temperature sintering process to form a polycrystalline diamond body that is attached to the substrate. The method further includes contacting at least a portion of the polycrystalline diamond body with a leaching agent to remove catalyst material and non-catalyst material from the diamond body, where a leaching rate of the catalyst material and the non-catalyst material exceeds a conventional leaching rate profile by at least about 30%.

公开(公告)号：EP3121296A1

公开(公告)日：2017-01-25

申请号：EP15764365.1

申请日：2015-03-12

申请人： Tanaka Kikinzoku Kogyo K.K.

发明人： OKAMOTO, Nobuhisa ,  HOSOI, Takuya ,  SAKAIRI, Koichi

IPC分类号： C22B11/02 ,  B22F1/00 ,  B22F9/00 ,  C22B7/00 ,  H01B1/22 ,  H01B13/00

CPC分类号： C22B11/04 ,  B22F1/0014 ,  B22F1/0059 ,  B22F1/0074 ,  B22F9/00 ,  B22F2009/001 ,  B22F2301/25 ,  B22F2302/253 ,  B22F2302/406 ,  B22F2302/45 ,  B22F2304/10 ,  C22B7/001 ,  C22B7/006 ,  C22B11/021 ,  Y02P10/214 ,  Y02P10/24

摘要： The present invention relates to a technique for recovering and recycling a platinum paste. The present invention provides a method for recovering a metal powder from a platinum paste formed by mixing a solid component composed of a metal powder including at least a platinum powder or a platinum alloy powder and an organic component including at least an organic solvent, the method including removing the organic component by heating the platinum paste at a recovery temperature set in a temperature range of 300°C or higher and 500°C or lower. The recovered metal powder can be recycled into a platinum paste equivalent to a new product by mixing the metal powder with a solvent etc.

摘要翻译： 本发明涉及一种技术，用于回收和再循环铂糊状物。 本发明提供了一种用于回收从由混合的金属粉末，包括至少包括至少在有机溶剂中，该方法的铂粉末或铂合金粉末和有机成分构成的固体成分而形成的铂糊的金属粉末 包括通过在恢复温度的温度范围内的300℃或更高和500℃或更低的设定加热铂膏除去有机组分。 将回收的金属粉末可以通过将金属粉末与溶剂等混合而再循环到铂糊相当于新产品一

公开(公告)号：EP3205428A1

公开(公告)日：2017-08-16

申请号：EP17155092.4

申请日：2017-02-07

申请人： Diamond Innovations, Inc.

发明人： GLEDHILL, Andrew

IPC分类号： B22F3/12 ,  B22F3/26 ,  C04B35/52 ,  C22C26/00 ,  B22F5/00

CPC分类号： B22F7/008 ,  B22F3/10 ,  B22F3/24 ,  B22F3/26 ,  B22F2003/244 ,  B22F2005/001 ,  B22F2302/406 ,  B22F2998/10 ,  B22F2999/00 ,  B28B11/08 ,  C04B35/52 ,  C04B35/638 ,  C04B37/026 ,  C04B41/009 ,  C04B41/50 ,  C04B41/87 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3232 ,  C04B2235/3826 ,  C04B2235/386 ,  C04B2235/3891 ,  C04B2235/427 ,  C04B2235/616 ,  C04B2235/80 ,  C04B2235/85 ,  C04B2237/12 ,  C04B2237/363 ,  C04B2237/401 ,  C22C1/1094 ,  C22C26/00 ,  C22C2026/006 ,  C22C2026/007 ,  C22C2026/008 ,  E21B10/567 ,  B22F7/06 ,  B22F3/14 ,  B22F2003/247 ,  B22F2003/242

摘要： Polycrystalline diamond compacts having parting compound within the interstitial volumes are disclosed herein. In one embodiment, a polycrystalline diamond compact includes a polycrystalline diamond body having a plurality of diamond grains bonded together in diamond-to-diamond bonds, interstitial volumes positioned between the adjacent diamond grains, and a parting compound positioned in at least a portion of the interstitial volumes of the polycrystalline diamond body.

摘要翻译： 本文公开了在间隙体积内具有分隔化合物的多晶金刚石复合片。 在一个实施方案中，多晶金刚石复合片包括多晶金刚石体，其具有以金刚石 - 金刚石结合在一起的多个金刚石晶粒，位于相邻金刚石晶粒之间的间隙体积和位于至少一部分 多晶金刚石体的间隙体积。

公开(公告)号：EP2591144B1

公开(公告)日：2017-05-10

申请号：EP11743287.2

申请日：2011-07-04

申请人： Centre National de la Recherche Scientifique

发明人： SILVAIN, Jean-François ,  VINCENT, Cécile ,  HEINTZ, Jean-Marc

IPC分类号： C23C22/73

CPC分类号： C23C22/73 ,  B22F2998/00 ,  C23C26/00 ,  B22F2302/406 ,  B22F2302/403 ,  B22F2302/40 ,  B22F2302/105 ,  B22F2302/253 ,  B22F2303/30 ,  B22F2301/10 ,  B22F1/025

公开(公告)号：EP2591144A1

公开(公告)日：2013-05-15

申请号：EP11743287.2

申请日：2011-07-04

申请人： Centre National de la Recherche Scientifique

发明人： SILVAIN, Jean-François ,  VINCENT, Cécile ,  HEINTZ, Jean-Marc

IPC分类号： C23C22/82

CPC分类号： C23C22/73 ,  B22F2998/00 ,  C23C26/00 ,  B22F2302/406 ,  B22F2302/403 ,  B22F2302/40 ,  B22F2302/105 ,  B22F2302/253 ,  B22F2303/30 ,  B22F2301/10 ,  B22F1/025

摘要： The present invention relates to a method for forming a metal deposit on the surface of a solid substrate, said method including at least: 1) a step of functionalizing the surface of the substrate by means of -O-P, -O-P-O, -O-S, or -O-S-O groupings; 2) a step of mixing the substrate with metal or metal-oxide particles sublimated at a low temperature; 3) a step of heat-treating the substrate obtained above after step 2), it being understood that said step 3) is only carried out when a metal is utilized in the above step 2), said step 3) also being carried out at a temperature that is lower than the temperature for melting the metal in question and further being carried out in the air so as to oxidize said metal; and 4) a step of reducing the metal oxide obtained in step 3) or the metal oxide utilized in step 2) in a reducing atmosphere at a temperature of 0.1 Tf to a temperature that is lower than Tf, Tf being the melting temperature expressed in Kelvin, reducing said metal oxide and concomitantly sublimating the metal and/or metal oxide, and then bonding the metal atoms to the phosphorus atoms of the -O-P groupings, to the sulfur atoms of the O-S groupings, or to the free oxygen atom of the O-P-O or -O-S-O groupings connected to the substrate. The invention also relates to the uses of the method, in particular for preparing reinforcements for powder metallurgy, for casting, or for improving the thermal conductivity of materials.

公开(公告)号：EP3294481A1

公开(公告)日：2018-03-21

申请号：EP16729655

申请日：2016-05-06

申请人： DIAMOND INNOVATIONS INC

发明人： LONG CHRISTOPHER ,  GLEDHILL ANDREW

IPC分类号： B22F3/15 ,  B22F5/00 ,  B23B27/20 ,  B24D3/06 ,  B24D99/00 ,  C04B35/645 ,  C22C11/00 ,  C22C26/00 ,  E21B10/46

CPC分类号： E21B10/567 ,  B22F3/14 ,  B22F3/15 ,  B22F3/24 ,  B22F5/00 ,  B22F2005/001 ,  B22F2301/30 ,  B22F2302/406 ,  B22F2303/30 ,  B22F2998/10 ,  B24D3/10 ,  B24D18/0009 ,  B24D99/00 ,  C22C11/00 ,  C22C26/00 ,  C22C27/04 ,  C22C27/06 ,  E21B10/5735 ,  B22F2003/244

摘要： Polycrystalline diamond cutting elements having enhanced thermal stability, drill bits incorporating the same, and methods of making the same are disclosed herein. In one embodiment, a cutting element includes a substrate having a metal carbide and a polycrystalline diamond body bonded to the substrate. The polycrystalline diamond body includes a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds and a plurality of interstitial regions positioned between adjacent diamond grains. At least a portion of the plurality of interstitial regions comprise lead or lead alloy, a catalyst material, metal carbide, or combinations thereof. At least a portion of the plurality of interstitial regions comprise lead or lead alloy that coat portions of the adjacent diamond grains such that the lead or lead alloy reduces contact between the diamond and the catalyst.

公开(公告)号：EP3121296A4

公开(公告)日：2017-11-22

申请号：EP15764365

申请日：2015-03-12

申请人： TANAKA PRECIOUS METAL IND

发明人： OKAMOTO NOBUHISA ,  HOSOI TAKUYA ,  SAKAIRI KOICHI

IPC分类号： C22B11/02 ,  B22F1/00 ,  B22F9/00 ,  C22B7/00 ,  H01B1/22 ,  H01B13/00

CPC分类号： C22B11/04 ,  B22F1/0014 ,  B22F1/0059 ,  B22F1/0074 ,  B22F9/00 ,  B22F2009/001 ,  B22F2301/25 ,  B22F2302/253 ,  B22F2302/406 ,  B22F2302/45 ,  B22F2304/10 ,  C22B7/001 ,  C22B7/006 ,  C22B11/021 ,  Y02P10/214 ,  Y02P10/24

摘要： The present invention relates to a technique for recovering and recycling a platinum paste. The present invention provides a method for recovering a metal powder from a platinum paste formed by mixing a solid component composed of a metal powder including at least a platinum powder or a platinum alloy powder and an organic component including at least an organic solvent, the method including removing the organic component by heating the platinum paste at a recovery temperature set in a temperature range of 300°C or higher and 500°C or lower. The recovered metal powder can be recycled into a platinum paste equivalent to a new product by mixing the metal powder with a solvent etc.

公开(公告)号：EP3206227A1

公开(公告)日：2017-08-16

申请号：EP15848453.5

申请日：2015-10-08

申请人： Superufo291 Tec

发明人： FUKUI, Akira

IPC分类号： H01L23/373 ,  B22F3/10 ,  B22F3/14 ,  C22C26/00 ,  C23C18/16 ,  C25D5/50

CPC分类号： H01L23/3732 ,  B22F3/1035 ,  B22F3/105 ,  B22F3/14 ,  B22F3/16 ,  B22F3/24 ,  B22F7/008 ,  B22F7/04 ,  B22F2003/247 ,  B22F2007/042 ,  B22F2301/052 ,  B22F2301/255 ,  B22F2302/406 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  C22C26/00 ,  C23C18/16 ,  C23C18/32 ,  C25D3/12 ,  C25D5/12 ,  C25D5/34 ,  C25D5/44 ,  C25D5/50 ,  C25D7/12 ,  H01L21/4882 ,  H01L23/373 ,  H01L2924/0002 ,  H01L2924/00 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2003/241

摘要： A heat dissipation substrate having a metallic layer with few defects on its surface is obtained by a process including the steps of: forming a metallic layer by plating on the surface of an alloy composite mainly composed of a powder of a principal metal, additional metal and diamond; and heating and pressurizing the alloy composite coated with the metallic layer, at a temperature equal to or lower than the melting points of the metallic layer and the alloy composite. Consequently a heat dissipation substrate is obtained which has a coefficient of linear expansion of 6.5 ppm/K or higher and 15 ppm/K or lower as well as a degree of thermal conductivity of 420 W/m·K or higher, the substrate having a metallic layer with few defects in its surface layer and thereby allowing for a Ni-based plating on which the void percentage in the solder joint will be 5 % or lower.

摘要翻译： 具有表面缺陷少的金属层的散热基板通过包括以下步骤的方法获得：通过电镀在主要由主要金属，附加金属和主要金属的粉末组成的合金复合物的表面上形成金属层， 钻石; 以及在等于或低于金属层和合金复合物的熔点的温度下加热和加压涂覆有金属层的合金复合物。 因此，得到线膨胀系数为6.5ppm / K以上且15ppm / K以下，并且热传导率为420W / m·K以上的散热基板， 在其表面层中具有很少缺陷的金属层，从而允许在焊接接缝中空隙百分比为5％或更低的Ni基镀层。