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21 条记录 (耗时 0.009 秒)

    MEMS DEVICE WITH CAPACITANCE ENHANCEMENT ON QUADRATURE COMPENSATION ELECTRODE
    1.
    发明公开
    MEMS DEVICE WITH CAPACITANCE ENHANCEMENT ON QUADRATURE COMPENSATION ELECTRODE 审中-公开
    电容补偿电极增强型MEMS器件

    公开(公告)号：EP3184962A1

    公开(公告)日：2017-06-28

    申请号：EP16198839.9

    申请日：2016-11-15

    申请人： NXP USA, Inc.

    发明人： Shao, Peng

    IPC分类号： G01C19/5733 ,  B81B5/00 ,  G01P15/125

    CPC分类号： G01C19/5712 ,  B81B3/0078 ,  B81B5/00 ,  B81B2201/0228 ,  B81B2201/025 ,  B81B2203/04 ,  B81B2203/055 ,  B81B2207/03 ,  G01C19/5733

    摘要： A MEMS device includes a mass system capable of undergoing oscillatory drive motion along a drive axis and oscillatory sense motion along a sense axis perpendicular to the drive axis. A quadrature correction unit includes a fixed electrode and a movable electrode coupled to the movable mass system, each being lengthwise oriented along the drive axis. The movable electrode is spaced apart from the fixed electrode by a gap having an initial width. At least one of the fixed and movable electrodes includes an extrusion region extending toward the other of the fixed and movable electrodes. The movable electrode undergoes oscillatory motion with the mass system such that the extrusion region is periodically spaced apart from the other of the fixed and movable electrodes by a gap exhibiting a second width that is less than the first width thereby enabling capacitance enhancement between the electrodes.

    摘要翻译： MEMS装置包括质量系统，该质量系统能够沿着驱动轴进行振荡驱动运动并且沿着垂直于驱动轴的感测轴进行振荡感测运动。 正交校正单元包括固定电极和耦合到可移动质量系统的可移动电极，每个沿着驱动轴纵向取向。 可动电极通过具有初始宽度的间隙与固定电极间隔开。 固定电极和可动电极中的至少一个包括朝向固定电极和可动电极中的另一个延伸的挤出区域。 可移动电极与质量体系进行振荡运动，使得挤出区域与固定电极和可移动​​电极中的另一个周期性地间隔开具有第二宽度的间隙，该第二宽度小于第一宽度，由此能够增强电极之间的电容。

    Resonant thermal out-of-plane buckle-beam acuator
    4.
    发明公开
    Resonant thermal out-of-plane buckle-beam acuator 有权
    谐振具有弯曲离开平面光束的热致动器

    公开(公告)号：EP1331201A3

    公开(公告)日：2005-02-16

    申请号：EP02027514.5

    申请日：2002-12-05

    申请人： MICROSOFT CORPORATION

    发明人： Sinclair,J. Michael

    IPC分类号： B81B3/00 ,  G02B26/08 ,  G02B26/10

    CPC分类号： B81B3/0024 ,  B81B2201/042 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/058

    摘要： An out-of-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material (e.g., silicon). The actuator includes first and second anchors secured to the substrate and multiple elongated thermal buckle beams that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame that includes a frame base secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A cyclic current source directs cyclic electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a cyclic buckling motion of them out of the plane (i.e., away from) the substrate. In one implementation, the actuator has a characteristic resonant deflection frequency range and the cyclic current is of a first frequency within the resonant deflection frequency range.

    Acceleration sensor and manufacturing method for the same
    5.
    发明公开
    Acceleration sensor and manufacturing method for the same 有权
    Beschleunigungsaufnehmer und Verfahren zu seiner Herstellung

    公开(公告)号：EP1371993A2

    公开(公告)日：2003-12-17

    申请号：EP03010605.8

    申请日：2003-05-12

    申请人： WACOH CORPORATION

    发明人： Okada, Kazuhiro

    IPC分类号： G01P15/08 ,  G01P15/18 ,  G01P1/02 ,  G01P15/12 ,  B81C3/00 ,  B81B1/00

    CPC分类号： G01P15/125 ,  B81B3/0062 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058 ,  G01P15/08 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/084 ,  G01P2015/0842 ,  G01P2015/0871

    摘要： The present invention easily achieves an accurate control structure for limiting displacement of a weight (310; 310B). An SOI substrate with a trilaminar structure including a silicon layer (10), a silicon oxide layer (20), and a silicon layer (30) is prepared, and slits (S1-S4) are opened by applying induced coupling plasma etching which can selectively remove only silicon from the upper side. Then, the same etching is applied from the lower side to form grooves (G1, G2), whereby the silicon layer (30) is separated into a weight (310; 310B) and a pedestal (330; 330B). Next, the structure is immersed in an etchant which can selectively remove only silicon oxide, whereby the vicinities of exposed portions of the silicon oxide layer (20) are removed to form joint layers. A glass substrate (400) is joined to the bottom surface of the pedestal (330; 330B). Piezo resistor elements (Rx1-Rx4, Ry1-Ry4, Rz1-Rz4) are formed on the upper surface of the silicon layer (100) to detect bending. The degree of freedom of upward displacements of the weight (310; 310B) is accurately set based on the thickness of the joint layer (200; 200B).

    摘要翻译： 本发明容易实现用于限制配重（310; 310B）的位移的精确的控制结构。 制备具有硅层（10），氧化硅层（20）和硅层（30）的三层结构的SOI衬底，并通过施加感应耦合等离子体蚀刻来打开缝隙（S1-S4） 有选择地从上侧除去硅。 然后，从下侧施加相同的蚀刻以形成沟槽（G1，G2），由此将硅层（30）分离成重物（310; 310B）和基座（330; 330B）。 接下来，将该结构浸渍在可以仅选择性地除去氧化硅的蚀刻剂中，由此去除氧化硅层（20）的暴露部分附近以形成接合层。 玻璃基板（400）与基座（330; 330B）的底面接合。 压电电阻元件（Rx1-Rx4，Ry1-Ry4，Rz1-Rz4）形成在硅层（100）的上表面上以检测弯曲。 基于接合层（200; 200B）的厚度，精确地设定重量（310; 310B）向上位移的自由度。

    MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE
    8.
    发明公开
    MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE 有权
    微型机械单轴三轴陀螺仪

    公开(公告)号：EP2616772A2

    公开(公告)日：2013-07-24

    申请号：EP11826071.0

    申请日：2011-09-18

    申请人： Fairchild Semiconductor Corporation

    发明人： ACAR, Cenk

    IPC分类号： G01C19/56 ,  B81B3/00

    CPC分类号： H01L29/84 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058 ,  B81B2207/094 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0848

    摘要： This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

    摘要翻译： 该文献尤其讨论了帽晶片和通孔晶片，其被配置为封装在器件层的x-y平面中形成的单个质量块3轴陀螺仪。 单个质量块三轴陀螺仪可以包括悬挂在单个中心锚上的主质量块部分，主质量块部分包括径向部分，该部分朝向三轴陀螺仪传感器的边缘向外延伸，中心 悬架系统，所述悬架系统被构造成将所述3轴陀螺仪从所述单个中央锚定件悬置，以及驱动电极，所述驱动电极包括移动部分和静止部分，所述移动部分联接到所述径向部分，其中，所述驱动电极和所述中央悬架系统被配置 以驱动频率围绕垂直于xy平面的z轴振荡3轴陀螺仪。

    SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS
    9.
    发明授权
    SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS 有权
    装置和方法用于固定全部免除微型元件

    公开(公告)号：EP1345843B1

    公开(公告)日：2006-11-08

    申请号：EP01951048.6

    申请日：2001-07-12

    申请人： Zyvex Corporation

    发明人： ELLIS, Matthew, D. ,  PARKER, Eric, G. ,  SKIDMORE, George, D.

    IPC分类号： B81B7/00

    CPC分类号： B81B3/0051 ,  B81B2203/053 ,  B81B2203/055

    摘要： A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate ). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a "pallet" having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.