公开(公告)号：EP2616772A4

公开(公告)日：2014-03-26

申请号：EP11826071

申请日：2011-09-18

申请人： FAIRCHILD SEMICONDUCTOR

发明人： ACAR CENK

IPC分类号： G01P15/02 ,  B81B7/02 ,  B81C1/00 ,  G01C19/56 ,  G01C19/5755 ,  G01P15/08 ,  G01P15/097 ,  G01P15/125 ,  G01P15/18

CPC分类号： H01L29/84 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058 ,  B81B2207/094 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0848

摘要： This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

公开(公告)号：EP2616771A4

公开(公告)日：2015-08-26

申请号：EP11826069

申请日：2011-09-18

申请人： FAIRCHILD SEMICONDUCTOR

发明人： ACAR CENK

IPC分类号： G01C19/56 ,  G01P15/125 ,  G01P15/18

CPC分类号： B81B3/0018 ,  B81C1/00158 ,  G01C19/5712 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  G01P2015/084

摘要： The device layer of a 6-degrees-of-freedom (6-DOF) inertial measurement system can include a single proof-mass 6-axis inertial sensor formed in an x-y plane, the inertial sensor including: a main proof-mass section suspended about a single, central anchor; a central suspension system configured to suspend the 6-axis inertial sensor from the single, central anchor; and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion. The drive electrode and the central suspension system are configured to oscillate the 6-axis inertial sensor about a z-axis normal to the x-y plane.

公开(公告)号：EP2616387A4

公开(公告)日：2014-11-05

申请号：EP11826067

申请日：2011-09-18

申请人： FAIRCHILD SEMICONDUCTOR

发明人： BRYZEK JANUSZ ,  BLOOMSBURGH JOHN GARDNER ,  ACAR CENK

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L21/00

CPC分类号： B81B3/0021 ,  B81B3/0072 ,  B81B7/0016 ,  B81B7/0051 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/0785 ,  H01L29/84 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.

摘要翻译： 一个示例包括集成电路，其包括设置在细长上的至少一个电互连，远离集成电路的主要部分延伸，以及包括振荡部分的微机电层，微机电层耦合到集成电路的主要部分。

公开(公告)号：EP2462408A4

公开(公告)日：2014-01-22

申请号：EP10806751

申请日：2010-08-04

申请人： FAIRCHILD SEMICONDUCTOR

发明人： ACAR CENK

IPC分类号： G01C19/56 ,  G01C19/5719 ,  G01P15/125 ,  G01P15/18

CPC分类号： G01P15/18 ,  G01C19/5712 ,  G01C19/5719 ,  G01P15/125 ,  G01P2015/082 ,  G01P2015/0842

摘要： A micromachined inertial sensor (200) with a single proof-mass (201) or measuring 6-degree-of-motions. The single proof-mass (201) includes a frame (202), an x-axis proof mass section (212a, 212b) attached to the frame by a first flexure, and a y-axis proof mass section (218) attached to the frame (202) by a second flexure (228a, 228b). The single proof-mass (201) is formed in a micromachined structural layer and is adapted to measure angular rates about three axes with a single drive motion and linear accelerations about the three axes.

公开(公告)号：EP2616389A4

公开(公告)日：2016-03-23

申请号：EP11826043

申请日：2011-09-16

申请人： FAIRCHILD SEMICONDUCTOR

发明人： BRYZEK JANUSZ ,  BLOOMSBURGH JOHN GARDNER ,  ACAR CENK

IPC分类号： B81C1/00 ,  B81B7/00 ,  H01L23/52

CPC分类号： B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/07 ,  B81C1/0023 ,  H01L23/481 ,  H01L2224/131 ,  H01L2924/1461 ,  H05K1/18 ,  H01L2924/014 ,  H01L2924/00

公开(公告)号：EP2619130A4

公开(公告)日：2014-12-10

申请号：EP11827384

申请日：2011-09-20

申请人： FAIRCHILD SEMICONDUCTOR

发明人： BRYZEK JANUSZ ,  BLOOMSBURGH JOHN GARDNER ,  ACAR CENK

IPC分类号： B81C1/00 ,  B81B1/00 ,  B81B7/02 ,  H01G7/00

CPC分类号： B81B3/0086 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2207/096 ,  H01G7/06

公开(公告)号：EP2616388A4

公开(公告)日：2014-08-13

申请号：EP11826068

申请日：2011-09-18

申请人： FAIRCHILD SEMICONDUCTOR

发明人： BRYZEK JANUSZ ,  BLOOMSBURGH JOHN GARDNER ,  ACAR CENK

IPC分类号： B81B7/04 ,  B81B7/00 ,  B81C1/00 ,  B81C3/00 ,  H01L21/00

CPC分类号： B81B3/0021 ,  B81B3/0072 ,  B81B7/0016 ,  B81B7/0051 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/0785 ,  H01L29/84 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.

摘要翻译： 一个示例包括集成电路，其包括设置在细长上的至少一个电互连，远离集成电路的主要部分延伸，以及包括振荡部分的微机电层，微机电层耦合到集成电路的主要部分。

公开(公告)号：EP2616822A4

公开(公告)日：2014-03-26

申请号：EP11826070

申请日：2011-09-18

申请人： FAIRCHILD SEMICONDUCTOR

发明人： ACAR CENK

IPC分类号： G01P15/02 ,  B81B7/02 ,  B81C1/00 ,  G01C19/56 ,  G01C19/5755 ,  G01P15/08 ,  G01P15/097 ,  G01P15/125 ,  G01P15/18

CPC分类号： H01L29/84 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058 ,  B81B2207/094 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0848

摘要： This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.