Abstract:
Provided are elements for an ion implanter and an ion generating device including the same. The elements include a repeller, a cathode, a chamber wall, and a slit member constituting an arc chamber of an ion generating device for ion implantation used in the fabrication of a semiconductor device. A coating structure including a semicarbide layer is provided to each of the elements in order to stabilize the element against thermal deformation, protect the element from wear, and prevent a deposition product from being peeled off. The coating structure enables precise ion implantation without a change in the position of ion generation or distortion of the equipment. The coating structure allows electrons to be uniformly reflected into the arc chamber to increase the uniformity of plasma, resulting in an improvement in the dissociation efficiency of an ion source gas. The coating structure significantly improves the service life of the element compared to those of existing elements. Also provided are ion generating devices including the elements.
Abstract:
Compositions, systems, and methods are described for implanting silicon and/or silicon ions in a substrate, involving generation of silicon and/or silicon ions from corresponding silicon precursor compositions, and implantation of the silicon and/or silicon ions in the substrate.
Abstract:
Fluid storage and dispensing systems and methods for remote delivery of fluids are described, for providing fluid from a source vessel at lower voltage to one or more fluid-utilizing tools at higher voltage, so that the fluid crosses the associated voltage gap without arcing, discharge, premature ionization, or other anomalous behavior, and so that when multiple fluid-utilizing tools are supplied by the remote source vessel, fluid is efficiently supplied to each of the multiple tools at suitable pressure level during the independent operation of others of the multiple vessels.
Abstract:
Herein, an improved technique for processing a substrate is disclosed. In one particular exemplary embodiment, the technique may be achieved using a mask for processing the substrate. The mask may be incorporated into a substrate processing system such as, for example, an ion implantation system. The mask may comprise one or more first apertures disposed in a first row; and one or more second apertures disposed in a second row, each row extending along a width direction of the mask, wherein the one or more first apertures and the one or more second apertures are non-uniform.
Abstract:
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron in a concentration or ratio greater than a natural abundance concentration or ratio thereof. The compound may have a chemical formula of B 2 F 4 . Synthesis methods for such compounds, and ion implantation methods using such compounds, are described, as well as storage and dispensing vessels in which the isotopically-enriched, boron-containing compound is advantageously contained for subsequent dispensing use.
Abstract translation:包含两个或多个硼原子和至少一个氟原子的同位素富集的含硼化合物,其中至少一个硼原子含有所需的硼同位素,其浓度或比例大于天然丰度浓度或比例 。 化合物可以具有B 2 F 4的化学式。 对这些化合物的合成方法和使用这种化合物的离子注入方法进行了描述,以及存储和分配容器,其中有利地含有同位素富集的含硼化合物用于随后的分配用途。
Abstract:
A TEM grid provides posts having steps, the steps increasing the number of samples that can be attached to the grid. In some embodiments, each post includes a one sided stair step configuration. A method of extracting multiple samples includes extracting samples and attaching the samples to the different stair steps on the posts.
Abstract:
To reduce artifacts in a surface exposed by a focused ion beam for viewing, a trench is milled next to the region of interest, and the trench is filled to create a bulkhead. The ion beam is directed through the bulkhead to expose a portion of the region of interest for viewing. The trench is filled, for example, by charged particle beam-induced deposition. The trench is typically milled and filled from the top down, and then the ion beam is angled with respect to the sample surface to expose the region of interest.
Abstract:
A focused ion beam system is offered which can make a focal adjustment without relying on the structure of a sample while suppressing damage to the sample to a minimum. Also, a method of making this focal adjustment is offered. The focused ion beam system has an ion source (10) for producing an ion beam (B), a lens system for focusing the beam onto the sample (S), a detector (26) for detecting secondary electrons emanating from the sample, and a controller (42) for controlling the lens system. The controller (42) is operative to provide control such that the sample (S) is irradiated with the ion beam (B) without scanning the beam and that a focus of the ion beam (B) is varied by varying the intensity of the objective lens (20) during the ion beam irradiation. Also, the controller (42) measures the intensity of a signal indicating secondary electrons emanating from the sample (S) while the intensity of the objective lens (20) is being varied. Furthermore, the controller (42) makes a focal adjustment of the ion beam (B) on the basis of the intensity of the objective lens (20) obtained when the measured intensity of the signal indicating secondary electrons is minimal.
Abstract:
An inductively coupled plasma source (201) having multiple gases in the plasma chamber provides multiple ion species to a focusing column. A mass filter (202) allows for selection of a specific ion species and rapid changing from one species to another.