公开(公告)号：EP2495818A1

公开(公告)日：2012-09-05

申请号：EP10826747.7

申请日：2010-10-27

申请人： Sumitomo Bakelite Company Limited

发明人： KAGIMOTO Tomohiro ,  CHUMA Toshiaki

IPC分类号： H01R11/01 ,  H01B5/16 ,  H01L21/60 ,  H05K3/36

CPC分类号： H01L24/29 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83205 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31678 ,  Y10T428/31699 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a conductive connecting material having a multilayered structure comprising a resin composition (A) and a metal foil (B) selected from a solder foil or a tin foil, wherein the volume ratio ((A)/(B)) of the resin composition (A) and the metal foil (B) selected from a solder foil or a tin foil in the conductive connecting material is 1-40 or 20-500, as well as a method for connecting terminals using the conductive connecting material. The conductive connecting material of the present invention is preferably used for electrically connecting electronic members in an electrical or electronic component.

摘要翻译： 本发明提供一种具有导电连接材料的多层结构，其包括一种树脂组合物（A）和从一个焊料箔或锡箔中的金属箔（B），worin的体积比（（A）/（B））的 从焊料箔或在连接的导电材料锡箔中树脂组合物（A）与金属箔（B）为1-40或20-500，以及用于连接用的导电连接材料端子的方法。 本发明的导电连接材料优选用于电到电气或电子部件连接的电子部件。