公开(公告)号：EP2810299B1

公开(公告)日：2016-07-20

申请号：EP13712302.2

申请日：2013-01-22

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： BRUN, Jean

IPC分类号： H01L21/60 ,  H01L23/49 ,  B23K20/00 ,  H01L33/62 ,  G06K19/077

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05601 ,  H01L2224/0569 ,  H01L2224/0618 ,  H01L2224/45099 ,  H01L2224/4847 ,  H01L2224/4918 ,  H01L2224/78611 ,  H01L2224/78651 ,  H01L2224/7898 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85801 ,  H01L2224/85805 ,  H01L2224/85862 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00

公开(公告)号：EP3105786A1

公开(公告)日：2016-12-21

申请号：EP15704012.2

申请日：2015-02-12

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： SCHMIDT, Joachim-Franz ,  NEUBAUER, Marcel

IPC分类号： H01L23/495

CPC分类号： H01L24/78 ,  B23K20/02 ,  B23K20/24 ,  B32B15/017 ,  B32B15/043 ,  B32B15/20 ,  B32B2457/00 ,  C22C9/04 ,  C22C21/02 ,  H01L21/4842 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/4847 ,  H01L2224/7898 ,  H01L2224/85424 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a method for producing a bondable coating on a metallic support strip (4) made of a brass alloy comprising at least 15% by weight zinc or a precipitation-hardening copper-based alloy comprising at least 0.03% by weight titanium, chromium, zirconium and/or cobalt, in which method, in a single working step, a bondable metallic functional layer (14) made of aluminium or an aluminium-based alloy and a metallic intermediate layer (16) are applied to the metallic support strip (4) by a roll cladding method and bonded thereto, wherein the intermediate layer (16) is arranged entirely between the functional layer (14) and the metallic support strip (4), such that no bond is formed between the functional layer (14) and the metallic support strip (4). The invention also relates to a coated support strip (20) produced by such a method, wherein the intermediate layer (16) is arranged on the support strip (4) and fastened thereon and the functional layer (14) is arranged on the intermediate layer (16) and fastened thereon.

摘要翻译： 在由黄铜合金制成的金属载体带上制造可粘结涂层的方法，所述黄铜合金具有至少15wt。 ％锌或排泄硬化铜基合金，其含有至少0.03重量％ 提供％钛，铬，锆和/或钴。 根据该方法，在单个工作步骤中，将由铝或铝基合金制成的可结合金属功能层和金属中间层放置在金属载体条上，并使用辊包覆法结合。 中间层完全布置在功能层和金属载体带之间，使得不产生功能层与金属载体带之间的接触。 使用这种方法制造的涂覆载体条。 中间层布置并固定在载体条上，功能层被布置并固定在中间层上。

公开(公告)号：EP2334978A2

公开(公告)日：2011-06-22

申请号：EP09785184.4

申请日：2009-10-01

申请人： Optovate Limited

发明人： WOODGATE, Graham, John ,  HARROLD, Jonathan

IPC分类号： F21K99/00 ,  G02B17/08 ,  F21Y101/02

CPC分类号： G02B19/0066 ,  F21K9/232 ,  F21V5/007 ,  F21V5/008 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/30 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/7898 ,  H01L2224/83801 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An illumination apparatus and method of manufacture of the same in which an array of light-emitting elements is aligned to an array of optical elements to achieve a thin and efficient light source that can also be arranged to provide directional and/or programmable illumination.

摘要翻译： 一种照明装置及其制造方法，其中发光元件阵列与光学元件阵列对准以实现薄且高效的光源，该光源也可被布置为提供定向和/或可编程照明。

公开(公告)号：EP2334978B1

公开(公告)日：2018-12-12

申请号：EP09785184.4

申请日：2009-10-01

申请人： Optovate Limited

发明人： WOODGATE, Graham, John ,  HARROLD, Jonathan

IPC分类号： F21K9/90 ,  F21K9/232 ,  F21V5/00 ,  F21Y105/10 ,  F21Y107/30 ,  F21Y115/10 ,  G02B19/00 ,  H01L33/58 ,  H01L33/60

CPC分类号： G02B19/0066 ,  F21K9/232 ,  F21V5/007 ,  F21V5/008 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/30 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/7898 ,  H01L2224/83801 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An illumination apparatus and method of manufacture of the same in which an array of light-emitting elements is aligned to an array of optical elements to achieve a thin and efficient light source that can also be arranged to provide directional and/or programmable illumination.

公开(公告)号：EP2810299A1

公开(公告)日：2014-12-10

申请号：EP13712302.2

申请日：2013-01-22

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： BRUN, Jean

IPC分类号： H01L21/60 ,  H01L23/49 ,  G06K19/077 ,  H01L33/62 ,  B23K20/00 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05601 ,  H01L2224/0569 ,  H01L2224/0618 ,  H01L2224/45099 ,  H01L2224/4847 ,  H01L2224/4918 ,  H01L2224/78611 ,  H01L2224/78651 ,  H01L2224/7898 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85801 ,  H01L2224/85805 ,  H01L2224/85862 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00

摘要： The invention relates to an assembly method, including the following steps: providing a system for moving the wire element (6) from a wire-element supply system (16) to a device (18) for storing said wire element; tensioning the wire element between the supply device (16) and the storage device (18) using a tensioning device (16, 18); providing (E1) a supply (7) of customized and separated chip elements (1), each chip element (1) including a connection terminal (3), the connection terminal (3) of each chip element (1) including a free top access portion, opposite which no portion of the chip element (1) is arranged; moving (E2) a chip element (1) from the supply (7) into an assembly area (Z1) located between the supply (16) and storage (18) devices such that the wire element (6) is tensioned in said assembly area (Z1); attaching (E3), in the assembly area (Z1), the electrically conductive wire element (6) to the connection terminal (3) of the chip element (1); and supplying electrically insulating material at the chip element (1) after the attachment thereof to the wire element so as to form a cover (13), said supply of material being carried out on the surface of the chip element (1) that comprises the connection terminal (3) attached to said wire element (6), so as to cover at least the connection terminal (3) and a portion of the wire element (6) at the attachment point.

摘要翻译： 对于组装方法包括：提供一个系统，以线元件从导线传送到线元件供给装置元件存储装置; 通过张紧拉伸供应和存储设备之间的线元件; 提供个性化贮存器和分离芯片元件，每一个都包括连接端子包括与免费访问在哪个芯片元件面临的一个顶部是不存在; 输送从储存器中的芯片元件在哪个线元件在装配区域紧紧拉伸供应和存储设备之间的组装区域; 导电线固定元件在装配区域芯片元件连接端子; 和添加电绝缘芯片元件上材料之后后者已固定到金属丝元件形成盖，材料的添加正在执行上，包括固定到线元件连接端子，以至少覆盖所述连接端子和导线元件的部分芯片元件的表面 在后者的固定点。