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公开(公告)号:EP4451045A1
公开(公告)日:2024-10-23
申请号:EP24167931.5
申请日:2024-03-29
发明人: LIANG, Hanxiao , SONG, Yipin , ZHOU, Yingcong , WU, Haicang , MAO, Wenhao , SONG, Shiwei , SUN, Weiqi , YU, Qingyang , ZHANG, Zhouyu
摘要: A phase modulation module and an electro-optic modulator are provided. The phase modulation module has an input end face and an output end face and comprises a substrate, an isolation layer, a waveguide layer, and an electrode layer which are arranged in sequence. The electrode layer includes a plurality of electrodes which are arranged at intervals and configured to form a modulating electric field region. The waveguide layer comprises a plate layer, a first ridge layer and a second ridge layer which are arranged in sequence in a direction away from the substrate, wherein the plate layer extends to the input end face and the output end face; the first ridge layer protrudes in a ridge shape from a surface of the plate layer, extends to the input end face and the output end face, and is partially located in the modulating electric field region; the second ridge layer protrudes in a ridge shape from a surface of the first ridge layer, has a spacing from each of the input end face and the output end face, and is partially located in the modulating electric field region; and the second ridge layer and the first ridge layer form at least one waveguide arm extending to the input end face and the output end face and modulated by the modulating electric field region.
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公开(公告)号:EP4439140A1
公开(公告)日:2024-10-02
申请号:EP23196123.6
申请日:2023-09-08
发明人: BIAN, Yusheng
CPC分类号: G02B6/305 , G02B6/4214 , G02B6/12002 , G02B6/125 , G02B6/1228
摘要: Structures for an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate, a first waveguide core including a curved section and an end that terminates the curved section, and a second waveguide core including a section disposed adjacent to the curved section of the first waveguide core. The first waveguide core is positioned between the second waveguide core and the semiconductor substrate.
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公开(公告)号:EP3865860B1
公开(公告)日:2024-09-18
申请号:EP20020071.5
申请日:2020-02-14
CPC分类号: G02B6/1226 , G02B6/0003 , G02B6/0076 , H10K50/856
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公开(公告)号:EP3963677B1
公开(公告)日:2024-09-11
申请号:EP20747162.4
申请日:2020-05-28
IPC分类号: H01S5/50 , H01S5/227 , H01S5/026 , H01S5/20 , H01S5/343 , G02B6/12 , G02B6/122 , G02F1/025 , H01S5/10 , H01S5/22
CPC分类号: G02B6/1228 , G02B6/12004 , G02F1/025 , H01S5/2272 , H01S5/0265 , H01S5/34306 , H01S5/2224 , H01S5/1064 , H01S5/1014 , H01S5/2086 , H01S5/2275 , H01S5/50
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公开(公告)号:EP3821232B1
公开(公告)日:2024-09-11
申请号:EP19833944.2
申请日:2019-07-11
IPC分类号: G01N21/552 , G01N29/02 , G01N29/24 , G01N21/64 , G02B6/122
CPC分类号: G01N21/553 , G01N21/554 , G02B6/1226 , G01N21/648
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公开(公告)号:EP4423549A1
公开(公告)日:2024-09-04
申请号:EP22888096.9
申请日:2022-10-26
申请人: Avicenatech, Corp.
CPC分类号: G02B6/4292 , G02B6/4214
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公开(公告)号:EP4409341A1
公开(公告)日:2024-08-07
申请号:EP21819071.8
申请日:2021-11-18
发明人: HÖSSBACHER, Claudia , DE LEO, Eva , HENI, Wolfgang
CPC分类号: G02B6/1226 , G02B6/136 , G02B2006/12120130101 , G02B2006/1214220130101 , G02F1/225 , G02F1/035
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公开(公告)号:EP4406022A1
公开(公告)日:2024-07-31
申请号:EP22873386.1
申请日:2022-08-22
申请人: INTEL Corporation
IPC分类号: H01L25/065 , H01L23/538 , H01L25/18 , G02B6/122 , H01S5/0239 , H01L23/31 , H01L25/00 , G02B6/12
CPC分类号: G02B6/4204 , G02B6/4214 , G02B6/4249 , H01L25/167
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公开(公告)号:EP3153899B1
公开(公告)日:2024-07-31
申请号:EP15189197.5
申请日:2015-10-09
CPC分类号: G02B6/12002 , G02B6/12004 , G02B6/1223 , G02B6/1228
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