Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive polyimide composition which is soluble in organic solvents, which is excellent in adhesiveness, heat resistance, mechanical properties and flexibility, and which shows the property of a highly sensitive positive-type photoresist that is soluble in alkali upon irradiation with light. SOLUTION: The positive photosensitive polyimide composition contains a photoacid generator and a solvent-soluble polyimide which shows positive-type photosensitivity in the presence of the photoacid generator. The polyimide contains a photosensitive aromatic diamine and/or an aromatic diamine that shows alkali solubility by a photodecomposed acid as a diamine component. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a modified polyimide that contains a polycarbonate, is excellent in electrical characteristics, adhesiveness, heat resistance, flexibility, flexion, chemical resistance and storage stability and shows low warpage, the modified polyimide, a composition containing the modified polyimide, and applications therefor. SOLUTION: The method includes: synthesizing a tetracarboxylic dianhydride oligomer containing a polycarbonate component by reacting tetracarboxylic dianhydride with an isocyanate-terminated oligomer containing a polycarbonate component and having excellent flexibility; and subsequently reacting the oligomer with an aromatic diamine and an aromatic tetracarboxylic dianhydride to form a polyimide block copolymer. According to the method, a broad range of aromatic diamines can be selected, and by appropriately selecting the aromatic diamine, it is possible to produce an excellent modified polyimide which is capable of satisfying all the characteristics. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide metal laminate reduced in unevenness in thickness, and to provide a printed wiring board using the polyimide metal laminate the impedance control of which is easy. SOLUTION: The polyimide metal laminate has a polyimide layer, and a metal layer at least on one surface of the polyimide layer. In the polyimide metal laminate, when the average thickness of the polyimide layer is taken as 100%, unevenness in the thickness of the polyimide layer is 1.0% or smaller. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a battery long in cycle life, low in risk of breakage and rupture regardless of abnormal increase in battery temperature and high in reliability, and an electrode and a conductive agent used in the battery. SOLUTION: The conductive agent for the electrode of the battery contains a product of reaction with a π conjugate carbon material, a soluble polyimide, preferably, a soluble block copolymer polyimide as a principal component. The electrode of the battery is produced by depositing a composition containing the above conductive agent and an electrode active substance on a collector. the battery includes the above electrode. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a terminal-modified, alkali dissolvable polyimide having a good thermal stability and showing a good developing property, a positive type photosensitive composition containing the polyimide, and to provide a photosensitive film comprising the photosensitive resin composition. SOLUTION: This alkali dissolvable polyimide has at least one functional group selected from a carboxyl group, an aromatic hydroxy group and a sulfonic group at the terminal of a polymer main chain. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a laminated body in which a surface defect such as repellency is prevented from occurring. SOLUTION: This laminated body has a polyimide layer formed by applying and drying varnish on at least one surface of a base material film. The laminated body is characterized in that the varnish includes 10-25 wt.% of a solvent having saturated vapor pressure of 67 Pa-1,300 Pa at 25°C. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a high-density fine multilayer wiring structure which is controlled in its impedance in a multilayer wiring structure, in a digital integrated circuit chip for high-speed information processing and in a packaging system, such as, a package for mounting the chip, a module, and a board. SOLUTION: There provided are insulating layers 4, 4A, 4B, 4C via which via holes are formed through photolithography, and signal lines 7, 7A and ground layers 3, 3A laminated via the insulating layers. The insulating layers, the signal lines, and the ground lines are overlapped, and the upper and lower ground layers are connected by the vias 6, 6A, 6B and form a shielding wall. A dual strip line is formed, where the ground layers are arranged on the upper side and lower side with the signal line arranged therebetween. COPYRIGHT: (C)2009,JPO&INPIT