公开(公告)号：JP5482878B2

公开(公告)日：2014-05-07

申请号：JP2012266239

申请日：2012-12-05

Applicant: Jsr株式会社

Inventor： 英司 米田 ,  敏 江幡 ,  英徹 吉澤 ,  紫 山口 ,  淳史 伊藤 ,  泰典 川部

IPC: G03F7/027 ,  G02B5/20 ,  G03F7/004

CPC classification number: C09B11/24 ,  C09B69/103

公开(公告)号：JP5093116B2

公开(公告)日：2012-12-05

申请号：JP2008550058

申请日：2007-10-05

Applicant: Jsr株式会社

Inventor： 宏文 後藤 ,  淳史 伊藤 ,  寛文 佐々木 ,  隆一 奥田

IPC: G03F7/004 ,  G03F7/038 ,  H01L21/027

CPC classification number: H01L21/312 ,  G03F7/0045 ,  G03F7/038

公开(公告)号：JP4853155B2

公开(公告)日：2012-01-11

申请号：JP2006201309

申请日：2006-07-24

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  寛文 佐々木 ,  宏文 後藤 ,  裕一 橋口

IPC: G03F7/023 ,  G03F7/004 ,  H01L21/027 ,  H05K1/03

公开(公告)号：JP4640037B2

公开(公告)日：2011-03-02

申请号：JP2005240038

申请日：2005-08-22

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  伸一郎 岩永 ,  宏文 後藤 ,  健一 横山 ,  克巳 猪俣

IPC: G03F7/023 ,  G03F7/004

公开(公告)号：JP4403627B2

公开(公告)日：2010-01-27

申请号：JP2000090853

申请日：2000-03-29

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  克 太田 ,  伸一郎 岩永

IPC: G03F7/039 ,  C08J5/18 ,  C08L29/10 ,  C08L101/02 ,  G03F7/004 ,  G03F7/033 ,  G03F7/38 ,  G03F7/40 ,  G03F7/42 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a positive type radiation sensitive resin composition giving a pattern free of cracking even in plating and even by washing and drying after plating, capable of precisely forming a thick plated/shaped body such as a bump or wiring and excellent also in sensitivity, resolution, etc., and a method for producing the plated/shaped body using the composition. SOLUTION: The positive type radiation sensitive resin composition contains (A) a polymer having an acid dissociable functional group which is dissociated by an acid to form an acidic functional group, (B) a poly(vinyl lower alkyl ether), (C) a component which generates the acid when irradiated and (D) an organic solvent. The composition is also used as a positive type radiation sensitive resin film. The plated/shaped body is produced through a step for carrying out electroplating using a pattern formed on a substrate from the composition or the resin film as a template.

公开(公告)号：JP5585065B2

公开(公告)日：2014-09-10

申请号：JP2009279870

申请日：2009-12-09

Applicant: Jsr株式会社

Inventor： 寛文 佐々木 ,  淳史 伊藤

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/023 ,  G03F7/38 ,  G03F7/40

CPC classification number: G03F7/0382 ,  G03F7/0233 ,  G03F7/0388 ,  G03F7/40

公开(公告)号：JP4063053B2

公开(公告)日：2008-03-19

申请号：JP2002329851

申请日：2002-11-13

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  克 太田 ,  伸一郎 岩永 ,  勇 望月 ,  克巳 猪俣

IPC: G03F7/26 ,  G03F7/40 ,  G11B5/60 ,  G11B21/21

公开(公告)号：JP4029556B2

公开(公告)日：2008-01-09

申请号：JP2000334348

申请日：2000-11-01

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  伸一郎 岩永 ,  克巳 猪俣 ,  雅子 鈴木

IPC: G03F7/038 ,  C08K5/00 ,  C08L61/06 ,  C08L61/32 ,  G03F7/004 ,  H01B3/30 ,  H01B3/36

CPC classification number: G03F7/038

Abstract: Disclosed is a photosensitive insulating resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound containing at least two alkyl-etherificated amino groups in the molecule, (C) crosslinked fine particles, (D) a photosensitive acid generator and (E) an organic solvent. Also disclosed is a cured product obtained by curing the photosensitive insulating resin composition. From the photosensitive insulating resin composition, a cured product excellent not only in resolution, electrical insulation properties and thermal shock resistance but also in heat resistance and chemical resistance can be obtained.

公开(公告)号：JP3812654B2

公开(公告)日：2006-08-23

申请号：JP2002014307

申请日：2002-01-23

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  伸一郎 岩永 ,  克巳 猪俣 ,  隆 西岡 ,  正睦 鈴木

IPC: G03F7/004 ,  G03F7/022 ,  H01L21/312

Abstract: A positively photosensitive insulating resin composition characterized by containing at least (A) an alkali-soluble resin having phenolic hydroxy groups, (B) a compound having a quinonediazide group, (C) fine crosslinking particles, (D) a compound having per molecule at least two amino groups into which an alkyl ether group has been incorporated, and (F) a solvent. The positively photosensitive insulating resin composition is excellent in resolution, electrical insulating properties, and thermal shock resistance. Also provided is a cured object characterized by being obtained by curing the positively photosensitive insulating resin composition. The cured object has satisfactory adhesion.

公开(公告)号：JP4983798B2

公开(公告)日：2012-07-25

申请号：JP2008531996

申请日：2007-07-23

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  寛文 佐々木 ,  宏文 後藤

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/075 ,  H01L21/027

CPC classification number: G03F7/0385 ,  C08F212/08 ,  C08F212/14 ,  Y10T428/31504 ,  C08F220/10