中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

32 records (took 0.06 seconds)

    Thermally conductive adhesive sheet
    11.
    发明专利
    Thermally conductive adhesive sheet 有权
    导热粘合片

    公开(公告)号：JP2014167094A

    公开(公告)日：2014-09-11

    申请号：JP2013261727

    申请日：2013-12-18

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： NAKAYAMA JUNICHI ,  TERADA YOSHIO ,  FURUTA KENJI ,  TOJO MIDORI

    IPC: C09J7/00 ,  C09J201/00

    Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet excellent in thermal conductivity and electric insulation.SOLUTION: A thermally conductive adhesive sheet has an adhesive layer, has a thermal conductivity of 0.5 W/mK or more, and has a relative permittivity of 30 or less measured at a frequency of 120 Hz after being left for one day in the atmosphere of 40°C and 92% RH. Preferably, the thermally conductive adhesive sheet has a relative permittivity of 30 or less measured at a frequency of 1 kHz after being left for one day in the atmosphere of 40°C and 92% RH.

    Abstract translation: 要解决的问题：提供导热性和电绝缘性优异的导热性粘合片。解决方案：导热性粘合片具有粘合剂层，导热率为0.5W / m·K以上，并且具有相对介电常数 在40℃和92％RH的气氛中放置1天后以120Hz的频率测量30或更小。 优选地，导热粘合片在40℃和92％RH的气氛中放置1天后，其频率为1kHz时的相对介电常数为30以下。

    Light source apparatus
    12.
    发明专利
    Light source apparatus 审中-公开
    光源设备

    公开(公告)号：JP2014089943A

    公开(公告)日：2014-05-15

    申请号：JP2013173321

    申请日：2013-08-23

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： FURUTA KENJI

    IPC: F21S2/00 ,  F21Y101/02

    CPC classification number: C08F2/48 ,  C08F2810/20 ,  C09J133/14 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/10 ,  C08F220/58

    Abstract: PROBLEM TO BE SOLVED: To provide a light source apparatus having excellent luminous efficiency and luminous reliability in spite of its simple configuration.SOLUTION: A light source apparatus 1 is provided with a substrate 2 on which a light semiconductor element 5 is mounted, a heat-dissipating member 3 for supporting the substrate 2, and a heat-conductive pressure-sensitive adhesive sheet 4 provided on the heat-dissipating member 3. Heat conduction of the heat-conductive pressure-sensitive adhesive sheet 4 is at least 0.5 W/m K, and the 180° separation adhesion force of the heat-conductive pressure-sensitive adhesive sheet 4 is at least 0.1 N/20 mm.

    Abstract translation: 要解决的问题：提供一种具有优良的发光效率和发光可靠性的光源装置，尽管其结构简单。解决方案：光源装置1设置有其上安装有光半导体元件5的基板2，热量 用于支撑基板2的耗散部件3和设置在散热部件3上的导热性粘合片4.导热性粘合片4的导热至少为0.5W / m K，导热性粘合片4的180°分离粘合力为0.1N / 20mm以上。

    Semiconductor device, optical semiconductor device and heat dissipation member
    14.
    发明专利
    Semiconductor device, optical semiconductor device and heat dissipation member 有权
    半导体器件，光学半导体器件和散热器件

    公开(公告)号：JP2013149952A

    公开(公告)日：2013-08-01

    申请号：JP2012265191

    申请日：2012-12-04

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： TERADA YOSHIO ,  KAWAMOTO YUSUKE ,  FURUTA KENJI ,  TOJO MIDORI ,  NAKAYAMA JUNICHI

    IPC: H01L23/373 ,  H01L23/36 ,  H01L33/64

    CPC classification number: C09J133/066 ,  C08F222/1006 ,  H01L23/3737 ,  H01L23/4006 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2933/0075 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/08 ,  C08F220/58 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an optical semiconductor device including a semiconductor device which can effectively prevent uplift of a mounting substrate and a heat dissipation member; and provide a heat dissipation member used for the semiconductor device and the optical semiconductor device.SOLUTION: An optical semiconductor device 5 comprises: an optical semiconductor mounting substrate 6 on which an optical semiconductor element 8 is mounted; a heat sink 7 arranged at a distance from the optical semiconductor mounting substrate 6 in an opposed manner; and an adhesive heat dissipation sheet 1 which is sandwiched between the optical semiconductor mounting substrate 6 and the heat sink 7, and which adheres to the optical semiconductor mounting substrate 6 and the heat sink 7. The adhesive heat dissipation sheet has an interchuck distance of 20 mm, a tensile rate of 300 mm/min and tensile elasticity measured at 23°C of 600 MPa and under.

    Abstract translation: 要解决的问题：提供一种包括可以有效防止安装基板和散热构件的隆起的半导体装置的光学半导体装置; 并提供用于半导体器件和光学半导体器件的散热构件。解决方案：光学半导体器件5包括：安装有光学半导体元件8的光学半导体安装基板6; 以相对的方式与光半导体安装基板6一定距离配置的散热器7; 以及夹在光半导体安装基板6和散热器7之间并附着于光半导体安装基板6和散热片7的粘合性散热片1。粘合散热片的间隙距离为20 mm，拉伸速度为300mm / min，在23℃下测定的拉伸弹性为600MPa以下。

    Semiconductor device and manufacturing method of the same
    15.
    发明专利
    Semiconductor device and manufacturing method of the same 审中-公开
    半导体器件及其制造方法

    公开(公告)号：JP2013138105A

    公开(公告)日：2013-07-11

    申请号：JP2011288199

    申请日：2011-12-28

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： NAKAYAMA JUNICHI ,  TERADA YOSHIO ,  HATA KENTA ,  FURUTA KENJI ,  TOJO MIDORI ,  FURUTA YOSHIHISA

    IPC: H01L33/48 ,  H01L33/64

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can manufacture a semiconductor device with excellent manufacturing efficiency and which can prevent deterioration in performance of the obtained semiconductor device; and provide a semiconductor device obtained by the manufacturing method.SOLUTION: A semiconductor device manufacturing method comprises: preparing a substrate 3 on which a light-emitting diode element 2 is mounted on a top face; installing a spacer member 4 thicker than a thickness T1 of the light-emitting diode element 2 on the top face of the substrate 3 exposed from the light-emitting diode element 2; and pressure bonding the substrate 3 on which the space member 4 is installed to a support medium 10 by a roller 9 via a pressure-sensitive adhesive sheet 7 to manufacture a light-emitting diode device 1.

    Abstract translation: 要解决的问题：提供一种半导体器件制造方法，其可以制造具有优异的制造效率并能够防止所获得的半导体器件的性能劣化的半导体器件; 并提供通过制造方法获得的半导体器件。解决方案：一种半导体器件制造方法，包括：准备在顶面上安装有发光二极管元件2的衬底3; 在从发光二极管元件2暴露的基板3的顶面上安装比发光二极管元件2的厚度T1厚的间隔件4; 并且通过压敏粘合片7通过辊9将其上安装有空间部件4的基板3压接到支撑介质10上，以制造发光二极管装置1。

    Flame retardant thermoconductive adhesive sheet
    17.
    发明专利
    Flame retardant thermoconductive adhesive sheet 有权
    阻燃热固性粘合片

    公开(公告)号：JP2012180495A

    公开(公告)日：2012-09-20

    申请号：JP2011176787

    申请日：2011-08-12

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： TOJO MIDORI ,  NAKAYAMA YUSUKE ,  TERADA YOSHIO ,  FURUTA KENJI

    IPC: C09J7/02 ,  C08K3/22 ,  C08L33/04 ,  C09J9/00 ,  C09J11/04 ,  C09J133/04

    CPC classification number: C08K3/22 ,  C08K3/016 ,  C09J7/0217 ,  C09J7/385 ,  C09J133/04 ,  C09J2205/102 ,  Y10T428/2891

    Abstract: PROBLEM TO BE SOLVED: To provide a flame retardant thermoconductive adhesive sheet excellent in thermoconductivity and adhesion and holding power to an adherend, and having high flame retardancy.SOLUTION: The flame retardant thermoconductive adhesive sheet 1 has a flame retardant thermoconductive adhesive agent layer 2 containing at least: (a) an acrylic polymer having an alkyl (meth)acrylate as a main component, and obtained by copolymerizing monomer components containing a polar group-containing monomer and substantially no carboxyl group-containing monomer; and (b) a hydrated metal compound.

    Abstract translation: 要解决的问题：提供一种导热性和附着力以及对被粘物的保持力优异且阻燃性高的阻燃性导热粘合片。 阻燃剂导热粘合片1具有阻燃剂导热粘合剂层2，其至少包含：（a）具有（甲基）丙烯酸烷基酯作为主要成分的丙烯酸类聚合物，并且通过使包含 含极性基团的单体和基本上不含羧基的单体; 和（b）水合金属化合物。 版权所有（C）2012，JPO＆INPIT

    Thermally conductive self-adhesive composition and thermally conductive self-adhesive sheet
    19.
    发明专利
    Thermally conductive self-adhesive composition and thermally conductive self-adhesive sheet 有权
    导热自粘组合物和导热自粘胶片

    公开(公告)号：JP2010174173A

    公开(公告)日：2010-08-12

    申请号：JP2009019959

    申请日：2009-01-30

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： NAKAYAMA JUNICHI ,  TERADA YOSHIO ,  FURUTA KENJI ,  WANO TAKASHI

    IPC: C09J133/00 ,  C09J7/00 ,  C09J11/04

    CPC classification number: C09J133/08 ,  C08K7/00 ,  C08K2003/382 ,  C09J9/00 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To obtain a thermally conductive self-adhesive composition containing boron nitride particles and an acrylic polymer component and formable of a molded article having an excellent coefficient of thermal conductivity and to provide a thermally conductive self-adhesive sheet using the thermally conductive self-adhesive composition and having an excellent coefficient of thermal conductivity and adhesive force. SOLUTION: The thermally conductive self-adhesive composition contains the boron nitride particles and the acrylic polymer component, the boron nitride particles having particle diameters of ≥3 μm and ≤300 μm. Also, the boron nitride particles comprise 5-45 vol.% of boron nitride particles having particle diameters of ≥3 μm and ≤20 μm, 30-70 vol.% of boron nitride particles having particle diameters >20 μm and ≤60 μm, and 10-40 vol.% of boron nitride particles having particle diameters of >60 μm and ≤300 μm. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了获得具有优异的导热系数的含有氮化硼颗粒和丙烯酸类聚合物组分的可形成模塑制品的导热性自粘合剂组合物，并提供使用 导热性自粘合剂组合物，并且具有优异的导热系数和粘合力。 解决方案：导热自粘组合物含有氮化硼颗粒和丙烯酸聚合物组分，氮化硼颗粒的粒径为≥3μm和≤300μm。 此外，氮化硼颗粒包含5-45体积％的粒径≥3μm和≤20μm的氮化硼颗粒，30-70体积％的粒径>20μm和≤60μm的氮化硼颗粒， 和10-40体积％的粒径>60μm和≤300μm的氮化硼颗粒。 版权所有（C）2010，JPO＆INPIT

    Wired circuit board
    20.
    发明专利
    Wired circuit board 有权
    有线电路板

    公开(公告)号：JP2010135514A

    公开(公告)日：2010-06-17

    申请号：JP2008309049

    申请日：2008-12-03

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： TAMURA YASUSHI ,  FURUTA KENJI ,  ISHII ATSUSHI ,  SUEZAKI RYOJI

    IPC: H05K3/28 ,  G11B5/60

    Abstract: PROBLEM TO BE SOLVED: To provide a wired circuit board which further suppresses a peeling of a cover insulating layer from a conductor wire.
    SOLUTION: A plurality of conductor wires 2 are formed side by side on an upper face of a base substrate 1, and the conductor wires are covered with a cover insulating layer 3 made of polyimide to form the wired circuit board. Here, when a thickness of the cover insulating layer from an upper face of the conductor wire 2 is t1, a thickness of the cover insulating layer from the upper face of the base substrate at the center of a space between the conductor wires is t2, a thickness of the conductor wire from the upper face of the base substrate is tc, and then a thickness of the cover insulating layer from the side of the conductor wire to a lateral direction at a height of [(t2+tc)/2] from the upper face of the base substrate is t3, the cover insulating layer is formed so as to satisfy t1≥t2 and t1>t3, so that stress following thermal shrinkage of the cover insulating layer is reduced.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供进一步抑制覆盖绝缘层与导线剥离的布线电路板。 解决方案：在基底基板1的上表面上并排地形成多根导线2，并且用由聚酰亚胺制成的覆盖绝缘层3覆盖导线以形成布线电路板。 这里，当覆盖绝缘层从导体线2的上表面的厚度为t1时，覆盖绝缘层的厚度从基底的上表面在导线之间的空间的中心处的厚度为t2， 从基底基板的上表面的导线的厚度为tc，然后在[（t2 + tc）/ 2]的高度处，覆盖绝缘层从导线侧的横向方向的厚度， 从基底基板的上表面是t3，覆盖绝缘层形成为满足t1≥t2和t1> t3，使得覆盖绝缘层的热收缩之后的应力减小。 版权所有（C）2010，JPO＆INPIT

Patent Agency Ranking