ろう付構造体の製造方法
    22.
    发明专利
    ろう付構造体の製造方法 有权
    制动结构的制造方法

    公开(公告)号:JP2015110236A

    公开(公告)日:2015-06-18

    申请号:JP2013253092

    申请日:2013-12-06

    Abstract: 【課題】一対の金属部材を予め決められた接合部において接合することであるろう付構造体の製造方法を得る。 【解決手段】配置工程において、予め決められた接合部24に金属粉末14の粉末集合体18が配置され、接合工程において、金属粉末14の粉末間にスラリー22が吸引され、金属粉末14にスラリー22に含まれるバインダが蒸発する。一対の金属板26、28が接合される際に、粉末集合体18を構成する金属粉末14が、支柱となる支柱効果を発揮するため、複合ろう材12が、一対の金属板26、28を予め決められた接合部24において接合することができる。 【選択図】図1

    Abstract translation: 要解决的问题:提供一种用于将一对金属构件接合在预定接合部分中的钎焊结构的制造方法。解决方案:在布置过程中,将金属粉末14的粉末骨料18布置在预定的接合部24中 ,并且在接合过程中,在金属粉末14的粉末之间吸附浆料22,并且包含在浆料22中的粘合剂在金属粉末14中蒸发。当接合一对金属板26和28时,由于金属粉末14 为了构成粉末聚集体18呈柱形效应,复合钎焊材料12可以在预定的接合部分24中连接一对金属板26和28。

    Mixed powder for powder metallurgy
    25.
    发明专利
    Mixed powder for powder metallurgy 审中-公开
    粉末混合粉末冶金

    公开(公告)号:JP2013023707A

    公开(公告)日:2013-02-04

    申请号:JP2011157312

    申请日:2011-07-18

    Abstract: PROBLEM TO BE SOLVED: To provide Cu-Sn-Ni based raw material powder for powder metallurgy which uniformizes the structure of a sintered compact and can obtain a green compact having high compacting property and a sintered compact having high strength as raw material powder dealing with higher strength and downsizing and more complicated shaping in sintered parts used for a Cu based bearing, sliding parts or the like.SOLUTION: The powdery mixture for powder metallurgy includes, by weight, 3 to 12% Sn, 5 to 15% Ni and 0.05 to 1.0% P, and the balance Cu with inevitable impurities.

    Abstract translation: 要解决的问题:为了提供Cu-Sn-Ni基粉末冶金原料粉末,其使烧结体的结构均匀,并且可以获得具有高压实性的生坯和具有高强度的烧结体作为原料 在用于Cu基轴承,滑动部件等的烧结部件中处理较高的强度和小型化以及更复杂的成形的粉末。 < P>解决方案:粉末冶金用粉末混合物包括3〜12%的Sn,5〜15%的Ni和0.05〜1.0%的P,余量为Cu和不可避免的杂质。 版权所有(C)2013,JPO&INPIT

    Conductive composition for forming solar cell collector electrode, and solar cell
    27.
    发明专利
    Conductive composition for forming solar cell collector electrode, and solar cell 有权
    用于形成太阳能电池收集器电极和太阳能电池的导电组合物

    公开(公告)号:JP2012151276A

    公开(公告)日:2012-08-09

    申请号:JP2011008824

    申请日:2011-01-19

    CPC classification number: Y02E10/50

    Abstract: PROBLEM TO BE SOLVED: To provide a conductive composition for forming a solar cell collector electrode, which is excellent in printability and is capable of forming an electrode having a high aspect ratio, and to provide a solar cell using the conductive composition.SOLUTION: The conductive composition for forming a solar cell collector electrode contains a spherical silver powder (A) having an average particle diameter of 0.5-5.0 μm, and a flaky silver power (B) having an average thickness of 0.05-0.2 μm and an apparent density of 0.4-1.1 g/cm.

    Abstract translation: 解决的问题:提供一种形成太阳能电池集电极的导电组合物,其印刷性优异并且能够形成具有高纵横比的电极,并提供使用该导电组合物的太阳能电池。 解决方案:用于形成太阳能电池集电极的导电组合物含有平均粒径为0.5-5.0μm的球形银粉(A)和平均厚度为0.05-0.2的片状银色电力(B) μm,表观密度为0.4-1.1g / cm 3。SP SP =“POST”> 3 。 版权所有(C)2012,JPO&INPIT

    Gold powder for uv flexo ink
    28.
    发明专利
    Gold powder for uv flexo ink 有权
    紫色FLEXO墨水粉末

    公开(公告)号:JP2012126824A

    公开(公告)日:2012-07-05

    申请号:JP2010279487

    申请日:2010-12-15

    Abstract: PROBLEM TO BE SOLVED: To provide a gold powder for UV flexo inks which exhibits excellent metallic luster as that used for UV flexo printing and has long-term storage stability even after gold ink preparation.SOLUTION: The gold powder for UV flexo inks is characterized in that 100 pts.wt. of a flake brass metal powder having an average particle size of 10-30 μm surface-treated with a fatty acid is mixed and coated with 0.2-3 pts.wt. of a silane coupling agent having an epoxy group as an organic functional group.

    Abstract translation: 要解决的问题:为了提供用于UV柔版印刷的优异的金属光泽的UV柔印油墨的金粉末,即使在金色油墨制备之后也具有长期的储存稳定性。 解决方案:用于UV柔版油墨的金粉的特征在于100重量份 的具有用脂肪酸表面处理的平均粒度为10-30μm的片状黄铜金属粉末混合并涂覆0.2-3重量份。 的具有环氧基作为有机官能团的硅烷偶联剂。 版权所有(C)2012,JPO&INPIT

    Treated copper foil for copper-clad laminated board and copper-clad laminated board obtained by adhering the treated copper foil onto insulating resin substrate, and printed circuit board using the copper-clad laminated board
    30.
    发明专利
    Treated copper foil for copper-clad laminated board and copper-clad laminated board obtained by adhering the treated copper foil onto insulating resin substrate, and printed circuit board using the copper-clad laminated board 有权
    用于铜箔层压板和铜箔层压板的处理铜箔通过将处理过的铜箔粘合到绝缘树脂基板和使用铜箔层压板的印刷电路板

    公开(公告)号:JP2011219790A

    公开(公告)日:2011-11-04

    申请号:JP2010087798

    申请日:2010-04-06

    Abstract: PROBLEM TO BE SOLVED: To provide a treated copper foil which provides high peeling strength with an insulating resin substrate although it has a low roughness, and after moisture absorption treatment, has the small deterioration rate of the peeling strength after immersion in an activation processing liquid and the small penetration amount after immersion in the activation processing liquid, and which is excellent in etching property.SOLUTION: In the treated copper foil 1 to be adhered to an insulating resin substrate, a roughening treatment layer, a chromate layer and a silane coupling agent layer are successively provided on the surface of an untreated copper foil 3. The treated copper foil 1 is characterized in that the ten-point average roughness Rz of the surface of the treated copper foil is 1.0-2.7 μm, and the average interval S5 between roughening particles 2 (local mountaintops) forming the roughening treatment layer is ≤0.210 (not including zero) μm, when a surface area of 177 μmof the surface of the treated copper foil 1 is measured by using a violet laser having a limit wavelength of visible light of 408 nm.

    Abstract translation: 要解决的问题:为了提供一种处理后的铜箔,其绝缘树脂基材虽然具有低的粗糙度而提供高的剥离强度,并且在吸湿处理后,浸渍后的剥离强度的劣化率小 活化处理液和浸渍在活化处理液中的渗透量小,蚀刻性优异。 解决方案:在待处理的铜箔1上,在未经处理的铜箔3的表面上依次设置一个被绝缘树脂基板上的粗糙化处理层,铬酸盐层和硅烷偶联剂层。处理过的铜 箔1的特征在于,经处理的铜箔的表面的十点平均粗糙度Rz为1.0-2.7μm,形成粗糙化处理层的粗糙化颗粒2(局部山顶)之间的平均间隔S5为≤0.210(不是 包括0)当处理铜箔1的表面的表面积为177μm 2 时,通过使用具有408的可见光的极限波长的紫色激光来测量 纳米。 版权所有(C)2012,JPO&INPIT

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