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公开(公告)号：JP5246259B2
公开(公告)日：2013-07-24
申请号：JP2010516800
申请日：2009-05-13
Applicant: Jsr株式会社
IPC: G03F7/023 , G03F7/40 , H01L21/027
CPC classification number: G03F7/022 , G03F7/0047 , G03F7/16
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公开(公告)号：JP4983798B2
公开(公告)日：2012-07-25
申请号：JP2008531996
申请日：2007-07-23
Applicant: Jsr株式会社
IPC: G03F7/038 , G03F7/004 , G03F7/075 , H01L21/027
CPC classification number: G03F7/0385 , C08F212/08 , C08F212/14 , Y10T428/31504 , C08F220/10
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公开(公告)号：JP3644206B2
公开(公告)日：2005-04-27
申请号：JP22208297
申请日：1997-08-05
Applicant: Jsr株式会社
IPC: C08L79/08 , C09D179/08
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公开(公告)号：JPWO2015005370A1
公开(公告)日：2017-03-02
申请号：JP2015526368
申请日：2014-07-09
Applicant: Jsr株式会社
IPC: H01M8/02 , C08J5/22 , C08L101/06 , H01B1/06 , H01M8/10
CPC classification number: H01M8/1044 , C08G61/12 , C08G65/40 , C08G65/4031 , C08G65/4056 , C08G2261/1428 , C08G2261/1452 , C08G2261/344 , C08G2261/412 , C08G2261/516 , C08G2650/40 , C08J5/22 , H01B1/06 , H01M8/1004 , H01M8/1007 , H01M8/1025 , H01M8/1027 , H01M8/103 , H01M8/1032 , H01M2008/1095 , H01M2300/0082
Abstract: 本発明は、電解質膜、膜−電極接合体および固体高分子型燃料電池に関し、前記電解質膜は、疎水性構造単位とプロトン伝導性基を有する構造単位とを有する重合体(1)、および、該重合体(1)の疎水性構造単位とは異なるスルホン酸基を有さない疎水性構造単位を有する重合体(2)を含有する。
Abstract translation: 本发明包括一个膜，膜 - 涉及电极组件和聚合物电解质燃料电池中，电解质膜，其具有具有疏水性结构单元和质子传导基团（1），和的结构单元的聚合物， 含有聚合物（2）和具有聚合物的没有什么不同磺酸基团和疏水性结构单元的疏水性结构单元（1）。
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Patent Agency Ranking
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公开(公告)号：JP5311104B2
公开(公告)日：2013-10-09
申请号：JP2008169486
申请日：2008-06-27
Applicant: Jsr株式会社
IPC: H01L23/522 , C08F20/58 , C08K5/00 , C08L33/24 , H01L21/3205 , H01L21/768 , H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H01L2224/16145 , H01L2224/16225 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a structure which has a uniform insulating film with superior electric insulation and a method of manufacturing the same, a resin composition which can form the insulating film, and an electronic component. SOLUTION: The method of manufacturing the structure which has the insulating film includes a step of coating a substrate having a hole portion with a solvent, a step of coating the substrate with the resin composition so that the resin composition may come into contact with the solvent in the hole portion, a step of forming films 117, 118, and 119 containing a resin component on at least an internal wall surface between the internal wall surface and a bottom surface of the hole portion by drying the coating, a heating and curing step of heating the film formed on the entire surface of the substrate including the internal wall surface and bottom surface of the hole portion into insulating films 217, 218, and 219 containing a cured body of the resin component, and a surface and bottom surface-side insulating film removing step of removing the insulating film 219 formed on the surface of the substrate and the insulating film 218 formed on the bottom surface of the hole portion of the substrate, and leaving the insulating film 217 formed on the internal wall surface of the hole portion. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5195428B2
公开(公告)日：2013-05-08
申请号：JP2008531998
申请日：2007-07-30
Applicant: Jsr株式会社
CPC classification number: G03F7/0233 , G03F7/0388 , H01L21/312 , H05K3/0023 , H05K3/287 , H05K3/4676 , H05K2201/0212
Abstract: A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.
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