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    Copper strike plating solution for article of zinc-containing metal or magnesium-containing metal
    62.
    发明专利
    Copper strike plating solution for article of zinc-containing metal or magnesium-containing metal 有权
    含有金属或含镁金属的铜包铜镀层解决方案

    公开(公告)号：JP2010168626A

    公开(公告)日：2010-08-05

    申请号：JP2009012834

    申请日：2009-01-23

    Applicant: Okuno Chem Ind Co Ltd ,  奥野製薬工業株式会社

    Inventor： HARA KENJI ,  TAKAHASHI CHIE ,  YOSHIKATA TOSHIYUKI

    IPC: C25D3/38 ,  C25D5/34 ,  C25D5/42

    Abstract: PROBLEM TO BE SOLVED: To provide a copper plating solution capable of forming a copper strike plating film which stably has good adhesion to a material of zinc-containing metal or magnesium-containing metal, the copper plating solution having little adverse effect to a human body and environment. SOLUTION: The copper strike plating solution for zinc-containing metal or magnesium-containing metal contains the following components (1) and (2) and has a pH in the range of 10.5-13. The component (1) is at least one divalent copper compound selected from the group consisting of copper oxide, copper hydroxide, copper carbonate, copper formate, and copper acetate. The component (2) is an organic phosphonic acid having two or more groups represented by the formula: -PO(-OM 1 )(-OM 2 ), wherein M 1 and M 2 are the same or different and each hydrogen or an alkali metal. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供能够形成与含锌金属或含镁金属的材料具有良好粘合性的铜触镀电镀膜的铜电镀液，铜电镀溶液对 人体和环境。 解决方案：含锌金属或含镁金属的铜电镀溶液含有以下组分（1）和（2），其pH值在10.5-13的范围内。 组分（1）是选自氧化铜，氢氧化铜，碳酸铜，甲酸铜和乙酸铜中的至少一种二价铜化合物。 组分（2）是具有两个或更多个由下式表示的基团的有机膦酸：-PO（-OM 1 ）（ - OM 2 ）， SP> 1 和M 2 相同或不同，每个氢或碱金属。 版权所有（C）2010，JPO＆INPIT

    Method of manufacturing plated molded article using no nickel, and plated molded article
    64.
    发明专利
    Method of manufacturing plated molded article using no nickel, and plated molded article 有权
    使用无镍制造成型制品的方法和制造成型品

    公开(公告)号：JP2010084224A

    公开(公告)日：2010-04-15

    申请号：JP2008257884

    申请日：2008-10-02

    Applicant: Okuno Chem Ind Co Ltd ,  Taiyo Manufacturing Co Ltd ,  奥野製薬工業株式会社 ,  株式会社太洋工作所

    Inventor： OKANO KAZUYUKI ,  KITAMURA KOICHI ,  KATAYAMA JUNICHI ,  NAGAMINE SHINGO

    IPC: C25D5/14 ,  C25D3/06 ,  C25D5/56 ,  C25D7/00

    Abstract: PROBLEM TO BE SOLVED: To provide a plating film structure having superior appearance, corrosion resistance and wear resistance, and to provide a treatment process which can be industrially used.
    SOLUTION: The method of manufacturing plated molded article in which plating treatment is performed to the surface of a molded article includes: a process (a) of forming a copper plating film on the surface of the molded article according to a brilliance copper sulfate plating; a process (b) of forming a first chromium plating film by performing trivalent chromium plating onto the surface of the copper plating film; and a process (c) of forming a second chromium plating film by performing hexavalent chromium plating onto the surface of the first chromium plating film.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有优异外观，耐腐蚀性和耐磨性的电​​镀膜结构，并提供可在工业上使用的处理工艺。 ＆lt; P＆gt;解决方案：对成型品的表面进行电镀处理的制造电镀模制品的方法包括：根据亮度铜在模制品的表面上形成镀铜膜的工艺（a） 硫酸盐电镀; 通过对所述镀铜膜的表面进行3价铬镀成形形成第1镀铬膜的工序（b） 以及通过在第一镀铬膜的表面上进行六价铬镀层而形成第二镀铬膜的工序（c）。 版权所有（C）2010，JPO＆INPIT

    Black pigment, method for producing the same, black ceramic paste using the same and sheet glass product using the same
    65.
    发明专利
    Black pigment, method for producing the same, black ceramic paste using the same and sheet glass product using the same 有权
    黑色颜料，其制造方法，使用其的黑色陶瓷粉末和使用其的玻璃制品

    公开(公告)号：JP2010077197A

    公开(公告)日：2010-04-08

    申请号：JP2008244528

    申请日：2008-09-24

    Applicant: Nakajima Sangyo Kk ,  Okuno Chem Ind Co Ltd ,  中島産業株式会社 ,  奥野製薬工業株式会社

    Inventor： NAKAJIMA MIKIO ,  UBUICHI MORIHIRO ,  KATO TAKASHI ,  KAGEHISA TERUHIKO

    IPC: C09C3/00 ,  C03C8/16 ,  C09C1/00 ,  C09C1/24 ,  C09D17/00

    Abstract: PROBLEM TO BE SOLVED: To provide a highly safe and economical black pigment which does not contain chromium of any valency as an essential component, has high color tone and is suitable for application to a ceramic paste used for manufacturing a sheet glass product such as an automobile window glass, and also to provide a method for producing the same, a black ceramic paste, and a sheet glass product coated with the same. SOLUTION: The black pigment essentially includes oxides of each of Mn, Fe, Cu and Co, provided that contents of the oxides of Mn, Fe, Cu and Co contained as essential components, which are converted into oxides and expressed in terms of weight based on the whole black pigment, are as follows: 40-75 wt.% of Mn in terms of MnO 2 ; 15-45 wt.% of Fe in terms of Fe 2 O 3 ; 1-10 wt.% of Cu in terms of CuO; and 0.5-10 wt.% of Co in terms of Co 3 O 4 . The black ceramic paste contains the black pigment. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供不含有任何化合物的铬作为必需组分的高度安全和经济的黑色颜料，具有高色调并且适用于用于制造玻璃制品的陶瓷糊料 例如汽车窗玻璃，还提供其制造方法，黑色陶瓷浆料和涂覆有该玻璃制品的玻璃制品。 解决方案：黑色颜料基本上包括Mn，Fe，Cu和Co各自的氧化物，条件是作为必需成分含有的Mn，Fe，Cu和Co的氧化物的含量被转化为氧化物并以表达式表示 基于全黑色颜料的重量计，如下：以MnO 2 计为40-75重量％的Mn; 15-45％（重量）Fe（以Fe 2 3 计）。 以CuO计为1〜10重量％的Cu; 以Co-SB 3 O 4 / SB 4计，Co为0.5〜10重量％。 黑色陶瓷膏含有黑色颜料。 版权所有（C）2010，JPO＆INPIT

    Plating method of magnesium alloy base material and plated product
    67.
    发明专利
    Plating method of magnesium alloy base material and plated product 有权
    镁合金基体材料和镀层产品的镀层方法

    公开(公告)号：JP2009120869A

    公开(公告)日：2009-06-04

    申请号：JP2007293072

    申请日：2007-11-12

    Applicant: Ast:Kk ,  Okuno Chem Ind Co Ltd ,  奥野製薬工業株式会社 ,  株式会社エーエステー

    Inventor： HIROSE TOSHIYUKI ,  HARA KENJI ,  YAMATO SHIGERU

    IPC: C25D5/42

    Abstract: PROBLEM TO BE SOLVED: To provide a plating method of a magnesium alloy base material by which excellent adhesion of the plating film is attained and plating swelling is surely prevented by carrying out the plating after inclusion such as the soiling on the surface is removed in a pretreatment in the plating of the surface of the magnesium alloy base material.
    SOLUTION: The plating pretreatment comprising: an etching step of removing an anodized film; a successive desmutting step; and a metal substitution treatment is applied successively after an anodizing treatment of a magnesium alloy base material which is applied with a pretreatment before a plating step. Then, excellent adhesion of the plating film is attained and plating swelling is surely prevented because the plating is carried out after inclusion such as the soiling on the surface is removed in the pretreatment in the plating of the surface of the magnesium alloy base material.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种镁合金基材的镀覆方法，通过在表面上的污渍等包含物之后，通过进行镀覆来确保电镀膜的优异粘合性和电镀溶胀性，可以确保电镀溶胀性 在镁合金基材的表面的电镀中的预处理中除去。 电镀预处理包括：去除阳极氧化膜的蚀刻步骤; 一个连续的desmutting步骤; 在对电镀工序前进行预处理的镁合金基材进行阳极氧化处理后，依次进行金属取代处理。 然后，通过在镁合金基材的表面的电镀中的预处理中除去表面上的污渍等包覆后进行镀覆，可以确保镀膜的良好的附着性，并可靠地防止电镀溶胀。 版权所有（C）2009，JPO＆INPIT

    Composition for smear removal
    68.
    发明专利
    Composition for smear removal 有权
    组织除去

    公开(公告)号：JP2009094277A

    公开(公告)日：2009-04-30

    申请号：JP2007263361

    申请日：2007-10-09

    Applicant: Okuno Chem Ind Co Ltd ,  奥野製薬工業株式会社

    Inventor： YOSHIKAWA JUNJI ,  NAGAO TOSHIMITSU ,  YOSHIKANE YUSUKE ,  MORIMOTO TORU ,  MURATA TOSHIYA ,  IKEDA MASAHIKO

    IPC: H05K3/42 ,  C23C18/20 ,  C25D5/56 ,  C25D7/00

    Abstract: PROBLEM TO BE SOLVED: To provide a novel composition for smear removal capable of solving various problems that a conventional smear removing agent has. SOLUTION: Disclosed are the composition for smear removal consisting of a solution containing at least one kind of component selected from a group of inorganic acid, permanganate, halogen oxo-acid, halogen-oxoate, persulfate, and bismuthate, and a smear removing method characterized in that a printed circuit board having a through hole formed is brought into contact with the composition for smear removal. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于污迹去除的新型组合物，其能够解决常规去污剂具有的各种问题。 解决方案：公开了用于涂抹去除的组合物，其由含有至少一种选自无机酸，高锰酸盐，卤代氧代酸，卤素 - 含氧酸盐，过硫酸盐和铋酸盐的组分的溶液和涂片 其特征在于，具有形成有通孔的印刷电路板与用于污迹去除的组合物接触。 版权所有（C）2009，JPO＆INPIT

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