Method of manufacturing minute metal structure
    88.
    发明专利
    Method of manufacturing minute metal structure 审中-公开
    制造MINUTE METAL STRUCTURE的方法

    公开(公告)号:JP2014187370A

    公开(公告)日:2014-10-02

    申请号:JP2014094902

    申请日:2014-05-01

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a minute metal structure.SOLUTION: A minute metal structure is manufactured by generating a region in which a pattern of enhanced conductivity is formed, or exposing it, and then, forming a conductor by electrodeposition on the region. In some embodiments, a minute metal structure is formed on a substrate, and then, in order to remove the structure from the substrate, etching is performed with the substrate. In some embodiments, a convergence gallium ion beam which does not contain deposition precursor gas scans a silicon substrate in a pattern, so as to generate a conductive pattern, and then, on the conductive pattern, copper structure is formed by electro-chemical deposition of one or more kinds of metal. The structure can be taken out from the substrate by etching, otherwise, that can be used on the spot. Using beam, an active layer of a transistor can be accessed for electrodeposition of a conductor, to form a lead for sensing or changing the behavior during a period in which a transistor is functioning.

    Abstract translation: 要解决的问题:提供一种制造微小金属结构的方法。解决方案:通过产生形成增强导电性图案或暴露图案的区域,然后通过电沉积形成导体来制造微小的金属结构 在该地区。 在一些实施例中,在衬底上形成微小的金属结构,然后为了从衬底去除结构,用衬底进行蚀刻。 在一些实施例中,不包含沉积前体气体的会聚镓离子束以图案扫描硅衬底,以便产生导电图案,然后在导电图案上,通过电化学沉积形成铜结构 一种或多种金属。 该结构可以通过蚀刻从衬底中取出,否则可以在现场使用。 使用光束,可以访问晶体管的有源层用于电沉积导体,以形成用于在晶体管工作的时段期间感测或改变行为的引线。

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