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公开(公告)号：JP2012191108A
公开(公告)日：2012-10-04
申请号：JP2011055195
申请日：2011-03-14
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： ENDO TADASUKE , MITSUI YASUAKI
Abstract: PROBLEM TO BE SOLVED: To provide both improvement in embedding characteristic of an inner layer circuit and precision in thickness.SOLUTION: A prepreg 1 for buildup includes a fiber base material 2 and resin layers 3 and 4 provided on both surfaces of the fiber base material 2, and is compatible with IPC-TM-650 Method 2.3.17, to show the resin flow of 15-50 wt.% when measured after heated and pressurized for five minutes under the condition of 171±3°C, 1380±70 kPa.
Abstract translation: 要解决的问题：提供内层电路的嵌入特性和厚度精度两者。 解决方案：用于堆积的预浸料1包括纤维基材2和设置在纤维基材2的两个表面上的树脂层3和4，并且与IPC-TM-650方法2.3.17兼容，以显示 在171±3℃，1380±70kPa的条件下加热加压5分钟后，树脂流量为15-50重量％。 版权所有（C）2013，JPO＆INPIT
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2.发明专利Insulative resin sheet containing glass woven fabric, laminate plate, multilayer printed wiring board, and semiconductor device 审中-公开含玻璃织物，层压板，多层印刷线路板和半导体器件的绝缘树脂片
公开(公告)号：JP2011216892A
公开(公告)日：2011-10-27
申请号：JP2011108953
申请日：2011-05-16
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： ONOZUKA TAKESHI , HAMAYA KAZUYA , ENDO TADASUKE
Abstract: PROBLEM TO BE SOLVED: To provide an insulative resin sheet containing glass woven fabric which has low thermal expansivity, excellent thermal shock resistance, and excellent fire retardancy, also has high inter-wall insulation reliability in a high-temperature and high-humidity environment, and is enabled in high-density/high multilayer formation, and to provide a laminate plate, a multilayer printed wiring board and a semiconductor device using the sheet.SOLUTION: The insulative resin sheet containing glass woven fabric includes the glass woven fabric and an insulative resin composition where the number of voids present in warp threads is 0.1 to 10 inclusive for 100,000 warp threads.
Abstract translation: 要解决的问题：为了提供一种具有低热膨胀性，优异的耐热冲击性和优异的阻燃性的玻璃织物的绝缘性树脂片，在高温高湿环境下也具有高的壁间绝缘可靠性， 并且能够进行高密度/高多层形成，并且提供层压板，多层印刷线路板和使用该片的半导体器件。解决方案：包含玻璃织物的绝缘树脂片包括玻璃织物和绝缘体 经纱中存在的空隙数为0.1〜10，其中10万根经线为树脂组合物。
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3.发明专利Insulation resin sheet impregnated with glass fiber woven fabric, laminated plate, multilayered printed wiring board, and semiconductor device 审中-公开带有玻璃纤维织物，层压板，多层印刷布线板和半导体器件的绝缘树脂片
公开(公告)号：JP2009067852A
公开(公告)日：2009-04-02
申请号：JP2007235827
申请日：2007-09-11
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： HAMAYA KAZUYA , ONOZUKA TAKESHI , ENDO TADASUKE
Abstract: PROBLEM TO BE SOLVED: To provide an insulation resin sheet impregnated with glass fiber fabric of low thermal expansion, a laminated plate using the insulation resin sheet impregnated with glass fiber fabric and having good insulation reliability between walls, a multilayered printed wiring board having good implementation reliability, and a semiconductor device having good thermal shock resistance. SOLUTION: In the insulation resin sheet impregnated with glass fiber woven fabric comprising glass fiber woven fabric and an insulation resin composition including cyanate resin, the number of cavities existing in warp is 10 or less per 100,000 threads of warp. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种浸渍有低热膨胀的玻璃纤维织物的绝缘树脂片，使用浸渍有玻璃纤维织物并且在壁之间具有良好绝缘可靠性的绝缘树脂片的层压板，多层印刷线路板 具有良好的实施可靠性，以及具有良好耐热冲击性的半导体器件。 解决方案：在浸渍有包含玻璃纤维织物的玻璃纤维织物和包括氰酸酯树脂的绝缘树脂组合物的绝缘树脂片中，经纱中存在的空腔数量为每100,000线经纱10个或更少。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2014229775A
公开(公告)日：2014-12-08
申请号：JP2013108894
申请日：2013-05-23
Applicant: 住友ベークライト株式会社 , Sumitomo Bakelite Co Ltd
Inventor： ENDO TADASUKE , OKADA RYOICHI , DAITO NORIYUKI
Abstract: 【課題】配線間の絶縁信頼性に優れたプリント配線基板を提供すること。【解決手段】プリント配線基板100は、ビアホール101を有する絶縁層103と、絶縁層103の少なくとも一方の面110に設けられた回路層105とを有する。そして、プリント配線基板100は、絶縁層103の一方の面110のビアホール101の周縁領域C1における、X線光電子分光により測定される炭素量に対するクロム量の比の平均値が0.090以下であり、JIS B0601:2001に準拠して測定される、絶縁層103の一方の面110の10点平均粗さRzが1.2μm以上である。【選択図】図2
Abstract translation: 要解决的问题：提供在互连之间具有优异的绝缘可靠性的印刷线路板。解决方案：印刷电路板100包括具有通孔101的绝缘层103和设置在绝缘层的至少一个表面110上的电路层105 在印刷布线板100中，绝缘层103的一个表面110上的通孔101的周边区域C1的铬含量与碳含量的比率的平均值为X- X射线光电子发射光谱法不大于0.090，并且根据JIS B0601：2001测量的绝缘层103的一个表面110的十点平均粗糙度Rz不小于1.2μm。
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5.发明专利Resin sheet, laminated plate, electronic component, print wiring board and semiconductor device 有权树脂板，层压板，电子元件，打印接线板和半导体器件
公开(公告)号：JP2012081586A
公开(公告)日：2012-04-26
申请号：JP2010226793
申请日：2010-10-06
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： DAITO NORIYUKI , KANEDA KENICHI , ENDO TADASUKE
Abstract: PROBLEM TO BE SOLVED: To provide a resin sheet which can be thinned, has both sides having different purposes of use, functions, performances, characteristics or the like, the one side surface having excellent grooving performance and adhesion with a conductive layer and allowing a microcircuit to be formed thereon, and to provide a laminated plate, electronic component, a print wiring board and a semiconductor device produced by using the resin sheet.SOLUTION: The resin sheet has a multilayer structure including a first resin layer forming one surface side and a second resin layer forming the other surface side. The first resin layer contains at least a curable resin, and the second resin layer contains a thermosetting resin and inorganic filler and has a thickness of 5 to 30 μm.
Abstract translation: 要解决的问题：为了提供可以变薄的树脂片，其两侧具有不同的使用目的，功能，性能，特性等，所述单面具有优异的切槽性能和与导电层的粘合性 并且可以在其上形成微电路，并且提供通过使用树脂片制造的层压板，电子部件，印刷线路板和半导体器件。 解决方案：树脂片具有包括形成一个表面侧的第一树脂层和形成另一表面侧的第二树脂层的多层结构。 第一树脂层至少含有可固化树脂，第二树脂层含有热固性树脂和无机填料，其厚度为5〜30μm。 版权所有（C）2012，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2012057169A
公开(公告)日：2012-03-22
申请号：JP2011248956
申请日：2011-11-14
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： YOSHIDA TATSUHIRO , ENDO TADASUKE , HOZUMI TAKESHI
CPC classification number: H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide a prepreg capable of increasing the latitude in circuit wiring patterns by enabling improvement in performance of a board, and to provide a circuit board and a semiconductor device which use the prepreg.SOLUTION: In the prepreg formed by impregnating into a fibrous base material, a resin composition containing a cyanate resin and/or its prepolymer, and an inorganic filler, when setting mutually orthogonal X, Y directions on a surface of the prepreg, a thermal expansion coefficient [Ax] in the X direction of a cured product obtained by curing the prepreg at 30-150°C is ≤10 ppm, and a thermal expansion coefficient [Ay] in the Y direction thereof at 30-150°C is ≤10 ppm. The circuit board is composed of the cured product of the prepreg. In the semiconductor device, a semiconductor element is loaded on the circuit board.
Abstract translation: 要解决的问题：提供一种能够通过提高板的性能来提高电路布线图案的纬度的预浸料，并且提供使用该预浸料的电路板和半导体装置。 解决方案：在预浸料坯的表面上设置相互正交的X，Y方向时，在浸渍到纤维基材中的含有氰酸酯树脂和/或其预聚物的树脂组合物和无机填料形成的预浸料中， 通过在30〜150℃下固化预浸料获得的固化物的X方向的热膨胀系数[Ax]≤10ppm，在30〜150℃的Y方向的热膨胀系数[Ay] ≤10ppm。 电路板由预浸料的固化产物组成。 在半导体器件中，半导体元件被加载在电路板上。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2011179001A
公开(公告)日：2011-09-15
申请号：JP2011070552
申请日：2011-03-28
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： YOSHIDA TATSUHIRO , ENDO TADASUKE , HOZUMI TAKESHI
CPC classification number: H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide a prepreg extendable of degrees of freedom of a circuit wiring pattern by improving performance of a substrate, to provide a circuit board, and to provide a semiconductor device using the circuit board.
SOLUTION: The prepreg is formed by impregnating a resin composition with a fibrous substrate, wherein the composition comprises a cyanate resin and/or a prepolymer thereof and an inorganic filler. When X and Y directions vertically crossing each other are set on the surface of the prepreg, the coefficient [Ax] of thermal expansion of a cured product formed by curing the prepreg at 30-150°C in the X direction is 10 ppm or less, and the coefficient [Ay] of thermal expansion in the Y direction is 10 ppm or less. Furthermore, the circuit board is composed of the cured product of the prepreg, and in the semiconductor device, a semiconductor element is mounted on the circuit board.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：通过提高基板的性能，提供电路板和提供使用电路板的半导体器件来提供可延长电路布线图案的自由度的预浸料。 解决方案：预浸料通过用纤维基材浸渍树脂组合物形成，其中组合物包含氰酸酯树脂和/或其预聚物和无机填料。 当在预浸料坯的表面上设置彼此垂直的X和Y方向时，通过在X方向上将预浸料坯在30-150℃下固化而形成的固化物的热膨胀系数[Ax]为10ppm以下 ，Y方向的热膨胀系数[Ay]为10ppm以下。 此外，电路板由预浸料的固化物构成，在半导体装置中，将半导体元件安装在电路基板上。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2004269590A
公开(公告)日：2004-09-30
申请号：JP2003059288
申请日：2003-03-06
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： ENDO TADASUKE
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition, a prepreg and a laminate which are excellent in dielectric characteristics at a high frequency and heat resistance.
SOLUTION: The resin composition is used for forming a prepreg in the form of a sheet by impregnating a base material therewith. It contains a phenylaralkylmaleimide resin and a cyanate resin. The prepreg is obtained by impregnating a base material with the resin composition. The laminate is obtained by laminating one or more plies of the prepreg.
COPYRIGHT: (C)2004,JPO&NCIPI-
公开(公告)号：JP2014218600A
公开(公告)日：2014-11-20
申请号：JP2013099361
申请日：2013-05-09
Applicant: 住友ベークライト株式会社 , Sumitomo Bakelite Co Ltd
Inventor： DAITO NORIYUKI , UMENO KUNIHARU , SATO KOJI , ENDO TADASUKE , KITAMURA MASAHIRO
Abstract: 【課題】微細な回路寸法を有し、絶縁信頼性に優れるプリント配線基板を提供できと共に、反りが抑制された半導体パッケージを提供可能なプリプレグを提供する。【解決手段】プリプレグ100は、熱硬化性樹脂と無機充填材とを含有する樹脂組成物を繊維基材101に少なくとも2層以上含浸してなる。プリプレグは,一方の面108から繊維基材までを第一樹脂層103とし、プリプレグの他方の面109から繊維基材までを第二樹脂層105としたとき、第一樹脂層および第二樹脂層の少なくとも一方が、下記一般式(1)で表されるナフチレンエーテル型エポキシ樹脂を含む。さらに、プリプレグは、一方の面と繊維基材の中心線A1との距離をD1とし、他方の面と繊維基材の中心線A1との距離をD2としたとき、D2>D1を満たす。【選択図】図1
Abstract translation: 要解决的问题：提供具有精细的电路尺寸和优异的绝缘可靠性的印刷电路基板以及能够提供具有减小的翘曲的半导体封装的预浸料。解决方案：通过浸渍至少两层含有 热固性树脂和无机填料在纤维基材101中。在预浸料坯中，从一个表面108到纤维基材的第一树脂层103和从预浸料坯的另一个表面109到纤维基材的第二树脂层105中的至少一个 含有由通式（1）表示的亚乙基醚型环氧树脂。 在预浸料坯中，将纤维基材的一面与中心线A1之间的距离设定为D1，将其另一面与纤维基材的中心线A1之间的距离设为D2时，满足D2> D1 。
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公开(公告)号：JP2013021306A
公开(公告)日：2013-01-31
申请号：JP2012133421
申请日：2012-06-13
Applicant: Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
Inventor： KIMURA MICHIO , MITSUI YASUAKI , DAITO NORIYUKI , ENDO TADASUKE
IPC: H05K3/46
CPC classification number: H05K3/4644 , H01L21/4857 , H01L23/49822 , H01L2224/73204 , H01L2224/83951 , H05K1/0366 , H05K1/112 , H05K2201/0195 , H05K2201/09509 , H05K2201/10674 , H05K2201/2072 , H05K2203/0554
Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board having high connection reliability.SOLUTION: A printed wiring board 100 includes a resin layer 106 and a fiber base material 108 positioned in the resin layer 106. An opening 116, having a region where an opening diameter becomes smaller from a first surface to a second surface and penetrating through the resin layer 106, is formed in the resin layer 106. The printed wiring board 100 has a conductor 124 burying the opening 116 and an inner circuit 104 electrically connecting with the conductor 124. The inner circuit 104 contacts with the second surface of the resin layer 106 and covers an opening surface of the opening 116 on the second surface side from the second surface side. The inner circuit (104) is formed as a separate body from the conductor 124. The fiber base material 108 has a protruding part 109 protruding from a side wall of the opening part 116, and the protruding part 109 is positioned in the conductor 124.
Abstract translation: 要解决的问题：提供具有高连接可靠性的印刷线路板。 解决方案：印刷电路板100包括树脂层106和定位在树脂层106中的纤维基材108.开口116具有从第一表面到第二表面的开口直径变小的区域， 穿过树脂层106形成在树脂层106中。印刷布线板100具有埋入开口116的导体124和与导体124电连接的内部电路104.内部电路104与第二表面 树脂层106从第二表面侧覆盖开口116的第二表面侧的开口表面。 内部电路104形成为与导体124分离的本体。纤维基材108具有从开口部116的侧壁突出的突出部109，突出部109位于导体124中。 版权所有（C）2013，JPO＆INPIT
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