利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.042 秒)

    Semiconductor module and joint material
    2.
    发明专利
    Semiconductor module and joint material 有权
    半导体模块和接头材料

    公开(公告)号：JP2014170945A

    公开(公告)日：2014-09-18

    申请号：JP2014077543

    申请日：2014-04-04

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： YAMAGUCHI TAKUTO ,  OKAMOTO MASAHIDE ,  IKEDA YASUSHI ,  KURODA HIROMITSU ,  KUROKI KAZUMA ,  HATA SHOHEI ,  ODA YUICHI

    IPC分类号： H01L21/52 ,  B23K35/28 ,  H01L23/36

    CPC分类号： H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： PROBLEM TO BE SOLVED: To use a lead-free material for joining a semiconductor element and a frame or substrate or joining a metal plate and a metal plate, and to ensure high reliability.SOLUTION: As a joint material for a semiconductor element and a frame or substrate, a Zn-based metal layer 101 is sandwiched by Al-based metal layers 102a, 102b. Further, as a joint material, a laminate material in which the outsides of the Al-based metal layers 102a, 102b are sandwiched by X-based metal layers 103, 103b (X=Cu, Au, Ag, Sn). Thereby, even in a high oxygen concentration atmosphere, the X-based metal layer as a surface protects Zn and Al from oxidation until the joint material melts. Thus, wettability and bondability of the joint materials, as solder, can be maintained, and the high reliability of the joint parts can be ensured.

    摘要翻译： 要解决的问题：使用无铅材料来连接半导体元件和框架或基板或者接合金属板和金属板，并且确保高可靠性。解决方案：作为用于半导体元件和 框架或衬底，Zn基金属层101被Al基金属层102a，102b夹持。 此外，作为接合材料，其中Al基金属层102a，102b的外部被X基金属层103,103b（X = Cu，Au，Ag，Sn）夹持的层压材料。 因此，即使在高氧浓度气氛中，作为表面的X基金属层也可以保护Zn和Al免于氧化，直到接合材料熔化。 因此，可以保持作为焊料的接合材料的润湿性和粘合性，并且可以确保接合部件的高可靠性。

    Lead wire for solar battery, and solar battery
    3.
    发明专利
    Lead wire for solar battery, and solar battery 审中-公开
    太阳能电池用铅线和太阳能电池

    公开(公告)号：JP2014042065A

    公开(公告)日：2014-03-06

    申请号：JP2013227870

    申请日：2013-11-01

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： NISHI HAJIME ,  SATO TAKUMI ,  TAKAHASHI TAKESHI ,  KURODA HIROMITSU ,  SAWAHATA KATSUNORI ,  TAKANO YUJI ,  AKUTSU HIROYUKI ,  HIGASHITANI IKU

    IPC分类号： H01L31/05 ,  B23K1/00 ,  B23K1/20 ,  B23K101/36

    CPC分类号： Y02E10/50

    摘要： PROBLEM TO BE SOLVED: To provide a lead wire for a solar battery which is low in cost, and superior in designability and bondability with a cell.SOLUTION: A lead wire for a solar battery comprises: a strip-like conductive material 2; a plating layer 4 on a surface of the strip-like conductive material 2; and a coating layer 5 located outside the plating layer 4. In the lead wire, the plating layer 4 includes a Sn-based solder or a Sn-based solder alloy which includes Sn as a first component, and as a second component, no less than 0.1 mass% of at least one element selected from a group consisting of Pb, In, Bi, Sb, Ag, Zn, Ni and Cu; the coating layer 5 includes a resin consisting of any one of a phenoxy resin, a polyvinyl butyral resin, a polyamide resin, an epoxy resin and a polyester resin; and the plating layer 4 has, on its surface, an oxide film having a thickness of 7 nm or less.

    摘要翻译： 要解决的问题：提供一种太阳能电池用引线，其成本低廉，并且具有优异的设计能力和与电池的结合能力。解决方案：一种用于太阳能电池的引线包括：带状导电材料2; 带状导电材料2的表面上的镀层4; 以及位于镀层4外的涂层5.在引线中，镀层4包括Sn系焊料或Sn系焊料合金，其中Sn为第一成分，作为第二成分为第二成分 0.1质量％以下的选自由Pb，In，Bi，Sb，Ag，Zn，Ni和Cu组成的组中的至少一种元素; 涂层5包括由苯氧树脂，聚乙烯醇缩丁醛树脂，聚酰胺树脂，环氧树脂和聚酯树脂中的任一种组成的树脂; 镀层4的表面具有厚度为7nm以下的氧化膜。

    Laminate joint material and joint body joined by using the same
    4.
    发明专利
    Laminate joint material and joint body joined by using the same 审中-公开
    使用相同的层压材料和接合体

    公开(公告)号：JP2014184446A

    公开(公告)日：2014-10-02

    申请号：JP2013059416

    申请日：2013-03-22

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： KUROKI KAZUMA ,  ODA YUICHI ,  KURODA HIROMITSU ,  TSUJI TAKAYUKI ,  UCHIDA SOHEI

    IPC分类号： B23K35/14 ,  B23K1/00 ,  B23K35/28 ,  B23K101/40 ,  C22C9/06 ,  H01L21/52

    摘要： PROBLEM TO BE SOLVED: To provide a joint material capable of restraining a joint area shrinkage, while maintaining an advantage of zinc-aluminum (Zn-Al)-based solder as a non-lead-based high temperature solder.SOLUTION: The laminate joint material on the present invention is a sheet-like laminate joint material of laminating a plurality of metal layers, and in the laminate joint material, an Al layer is formed by two as both outer layers of sandwiching a zinc layer with the zinc layer as a central layer, and a Cu layer is formed as an outer layer of one layer of the two Al layers, and a Cu-Ni alloy layer is formed as an outer layer of the other layer of the two Al layers, and the Ni concentration in the Cu-Ni alloy layer is 10 mass%-30 mass%, and the Cu-Ni alloy layer is thicker than the Cu layer, and a difference between a thickness of the Cu-Ni alloy layer and a thickness of the Cu layer is 0.5% or more of the whole thickness of the laminate joint material, and the sum total of the thickness of the Cu-Ni alloy layer and the thickness of the Cu layer is more than 0.5% and 3% or less of the whole thickness of the laminate joint material.

    摘要翻译： 要解决的问题：提供能够抑制接合面收缩的接合材料，同时保持作为非铅基高温焊料的锌 - 铝（Zn-Al）基焊料的优点。解决方案：层压接头 本发明的材料是层叠多个金属层的片状层叠接合材料，在层叠接合材料中，Al层由两层形成，两层都夹着锌层，锌层为 中心层和Cu层形成为两层Al层的一层的外层，并且形成Cu-Ni合金层作为两个Al层的另一层的外层，并且Ni浓度 Cu-Ni合金层的厚度为10质量％-30质量％，Cu-Ni合金层比Cu层厚，Cu-Ni合金层的厚度与Cu层的厚度之差为 层压接头材料的整个厚度的0.5％以上，t的总和 Cu-Ni合金层的厚度和Cu层的厚度大于层压接头材料的整个厚度的0.5％以上3％以下。

    Solar cell module
    5.
    发明专利
    Solar cell module 有权
    太阳能电池模块

    公开(公告)号：JP2014143402A

    公开(公告)日：2014-08-07

    申请号：JP2013262627

    申请日：2013-12-19

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： ENDO HIROHISA ,  NEMOTO TAKASHI ,  KURODA HIROMITSU ,  OTAKE ATSUSHI ,  KAWASAKI SHUJI ,  BANDO CHU

    IPC分类号： H01L31/05 ,  C22C13/00 ,  C22F1/00 ,  C22F1/14 ,  C23C2/08 ,  C23C2/38 ,  H01B5/02

    CPC分类号： Y02E10/546

    摘要： PROBLEM TO BE SOLVED: To provide a solar cell module including a rectangular conductor for solar cell or a lead wire for solar cell in which a silicon crystal wafer is less likely to be warped or damaged, when joining a connection lead wire, even if the silicon crystal wafer is made thin.SOLUTION: A plurality of solar cells used for converting the photovoltaic energy into electric energy are arranged. The plurality of solar cells are connected by a rectangular conductor for solar cell 10 (excluding a clad rectangular conductor) produced by shaping a conductor 1 having a volume resistivity of 50 μΩ mm or less and 0.2% proof stress in tension test of 90 MPa or less (excluding 49 MPa or less) rectangularly, or a lead wire for solar cell 20 produced by coating the surface of the rectangular conductor 10 with a solder plating film 13.

    摘要翻译： 要解决的问题：为了提供一种太阳能电池模块，其包括用于太阳能电池的矩形导体或太阳能电池的导线，其中硅晶片不太可能翘曲或损坏，即使连接引线，即使 硅晶片制成薄片。解决方案：用于将光能转换成电能的多个太阳能电池被布置。 多个太阳能电池通过使体积电阻率为50μΩ的导体1成形而制成的太阳能电池用矩形导体（不包括包层矩形导体）连接， mm以下，拉伸试验中的0.2％屈曲应力为90MPa以下（不包括49MPa以下），或通过用焊料镀膜13涂布矩形导体10的表面而制造的太阳能电池用引线20。

    Joint material
    6.
    发明专利
    Joint material 审中-公开
    联合材料

    公开(公告)号：JP2014140852A

    公开(公告)日：2014-08-07

    申请号：JP2013009355

    申请日：2013-01-22

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： ODA YUICHI ,  KUROKI KAZUMA ,  KURODA HIROMITSU ,  TSUJI TAKAYUKI ,  UCHIDA SOHEI

    IPC分类号： B23K35/14 ,  B23K1/00 ,  B23K35/28 ,  B23K101/40 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C19/00 ,  H01L21/52 ,  H05K3/34

    摘要： PROBLEM TO BE SOLVED: To provide a joint material capable of suppressing displacement caused by shrinkage.SOLUTION: A joint material comprises: a shrinkage suppression layer 2 that is made of metal predominantly composed of one of Cu, Ni, Au, Ag, Co, Cr, Pd, Pt and Rh; a molten layer 3 that is provided in such a manner as to sandwich the shrinkage suppression layer 2 from a thickness direction and that has a Zn layer 4 made of metal predominantly composed of Zn and an Al layer 5 made of metal predominantly composed of Al; and an oxidation suppression layer 6 that is provided in such a manner as to sandwich the shrinkage suppression layer 2 and the molten layer 3 from the thickness direction and that is made of metal predominantly composed of one of Cu, Au and Ag.

    摘要翻译： 要解决的问题：提供能够抑制由收缩引起的位移的接合材料。解决方案：接头材料包括：收缩抑制层2，其由主要由Cu，Ni，Au，Ag，Co， Cr，Pd，Pt和Rh; 熔融层3以厚度方向夹着收缩抑制层2的方式设置，并且具有由主要由Zn构成的金属制成的Zn层4和主要由Al构成的金属构成的Al层5; 以及氧化抑制层6，其设置成从厚度方向夹住收缩抑制层2和熔融层3，并且由主要由Cu，Au和Ag之一构成的金属制成。

    金属線の製造方法及び金属線の製造装置
    7.
    发明专利
    金属線の製造方法及び金属線の製造装置 审中-公开

    公开(公告)号：JP2017087222A

    公开(公告)日：2017-05-25

    申请号：JP2015216360

    申请日：2015-11-04

    申请人： 日立金属株式会社 ,  Hitachi Metals Ltd

    发明人： HATA SHOHEI ,  KURODA HIROMITSU ,  TSUJI TAKAYUKI ,  FUJITO KEISUKE

    IPC分类号： B22D11/10 ,  B22D11/00 ,  B22D11/01 ,  B22D11/06 ,  B22D37/00 ,  B22D41/62

    摘要： 【課題】流量調整ピンの先端部付近に介在物が付着することを安定的に抑制することができる金属線の製造方法及び金属線の製造装置を提供する。【解決手段】金属の溶湯を連続的に鋳造して金属線を製造する金属線の製造方法であって、金属の溶湯をタンディッシュに貯留する工程と、タンディッシュに接続されるノズルを介して、タンディッシュから溶湯を流出させる工程と、を有し、溶湯を流出させる工程では、ノズル側に突出する先端部と、先端部の突出した側と反対側に接続される芯部と、芯部の外周を囲むように設けられる筒状部と、を有する流量調整ピンにより、タンディッシュからノズルを介して溶湯を流出させるときの流量を調整するとともに、芯部に接続される振動発生機により、芯部を介して、流量調整ピンの先端部を振動させる。【選択図】図2

    Heat pipe and composite material for heat pipe
    9.
    发明专利
    Heat pipe and composite material for heat pipe 审中-公开
    热管热合管和复合材料

    公开(公告)号：JP2014185793A

    公开(公告)日：2014-10-02

    申请号：JP2013059946

    申请日：2013-03-22

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： KUROKI KAZUMA ,  SAGAWA HIDEYUKI ,  KURODA HIROMITSU ,  SUZUKI YUKIO

    IPC分类号： F28D15/02 ,  B23K20/04

    CPC分类号： B32B15/015 ,  B23K35/302 ,  F01N5/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28F19/06 ,  F28F21/083 ,  Y10T428/1291

    摘要： PROBLEM TO BE SOLVED: To provide a heat pipe and a composite material for the heat pipe that can restrain oxidation on an inner surface of the heat pipe.SOLUTION: A heat pipe 1 comprises: a cylindrical body made of metal and including a closed storage space 10a in which water 5 is stored; a heat absorption part 101 provided at its one end part and for absorbing heat by vaporizing the water 5; a heat dissipation part 102 provided at another end part and for dissipating heat by condensing water vapor generated by vaporizing the water 5; a base material 2 mainly made of stainless steel; a nickel layer 3 provided on an inner surface of the base material 2 and mainly made of nickel; and a copper layer 4 provided on an inner surface of the nickel layer 3 and containing copper. A surface 4a of the copper layer 4 is exposed to the storage space 10a.

    摘要翻译： 要解决的问题：提供一种能够抑制热管的内表面上的氧化的热管的热管和复合材料。热管1包括：由金属制成的圆筒体，包括封闭的储存 存储有水5的空间10a; 设置在其一个端部并用于通过蒸发水5吸收热量的吸热部分101; 设置在另一端部的散热部102，通过使通过蒸发水5而产生的水蒸气冷凝而散发热量; 主要由不锈钢制成的基材2; 镍层3，设置在基材2的内表面上，主要由镍构成; 以及设置在镍层3的内表面并含有铜的铜层4。 铜层4的表面4a暴露于存储空间10a。

    Lead-free solder
    10.
    发明专利
    Lead-free solder 审中-公开
    无铅焊枪

    公开(公告)号：JP2014140865A

    公开(公告)日：2014-08-07

    申请号：JP2013010521

    申请日：2013-01-23

    申请人： Hitachi Metals Ltd ,  日立金属株式会社

    发明人： TSUJI TAKAYUKI ,  UCHIDA SHOHEI ,  KURODA HIROMITSU

    IPC分类号： B23K35/26 ,  C22C12/00 ,  C22C13/02

    摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder having a low melting point than that of a lead solder and also having excellent fatigue resistance without using Ag, In or Sb.SOLUTION: A lead-free solder contains: Bi added in an amount of 20-60 mass%; one or more element selected from Cu, Ni and P, with the selected Cu being added in an amount of 0-3 mass%, the selected Ni being added in an amount of 0.005-0.5 mass%, and the selected P being added in an amount of 0.005-0.05 mass%; and the balance of Sn and unavoidable impurities.

    摘要翻译： 要解决的问题：提供熔点低于铅焊料的无铅焊料，并且在不使用Ag，In或Sb的情况下也具有优异的耐疲劳性。解决方案：无铅焊料含有：Bi 用量20-60质量％ 选自Cu，Ni和P中的一种或多种元素，所选择的Cu以0-3质量％的量添加，所选择的Ni以0.005-0.5质量％的量加入，并将所选择的P加入 0.005-0.05质量％的量; 其余为Sn和不可避免的杂质。