感放射線性樹脂組成物及びパターン形成方法

    公开(公告)号:JPWO2009020029A1

    公开(公告)日:2010-11-04

    申请号:JP2009526410

    申请日:2008-07-30

    CPC classification number: C08F220/12 G03F7/0397 G03F7/2041

    Abstract: 本発明の目的は、レジストとしての基本物性に優れるとともに、コンタクトホールパターンを形成する際における円形性及びCD Uniformityに優れる感放射線性樹脂組成物を提供することである。本感放射線性樹脂組成物は、酸の作用によりアルカリ可溶性となる酸解離性基含有樹脂(A)と、酸発生剤(B)と、溶剤(C)とを含有する感放射線性樹脂組成物であって、前記樹脂(A)は、下記一般式(1)及び(2)で表される各繰り返し単位を含むものである。〔R1及びR2は、各々、水素原子又は炭素数1〜4の置換基を有してもよいアルキル基、R3は炭素数1〜4の置換基を有してもよいアルキル基、Xは水素原子、ヒドロキシル基又はアシル基を示し、mは1〜18の整数、nは4〜8の整数である。〕

    Radiation-sensitive resin composition

    公开(公告)号:JP5407906B2

    公开(公告)日:2014-02-05

    申请号:JP2010017785

    申请日:2010-01-29

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition, which is free from problems of a radiation-sensitive acid generator, having a perfluoroalkyl sulfonyl structure such as PFOS (perfluoro-n-octane sulfonic acid), which has characteristics of excellent resolution performance, no vaporization of an acid generated by exposure, and an appropriately short diffusion length, and which gives a small LWR (line width roughness) as an index of fluctuation in the line width of a resist pattern, and can give a resist pattern having a small film reduction. SOLUTION: The radiation-sensitive resin composition comprises (A) a radiation-sensitive acid generator, having a partial fluoroalkyl structure and (B) a resin having a specified cyclic carbonate structure. COPYRIGHT: (C)2011,JPO&INPIT

    Semiconductor resist polymer and a radiation-sensitive composition

    公开(公告)号:JP5003548B2

    公开(公告)日:2012-08-15

    申请号:JP2008078984

    申请日:2008-03-25

    Abstract: PROBLEM TO BE SOLVED: To provide a radiosensitive composition and a polymer for a semiconductor resist, having a high transparency for a radiation and being excellent in basic physical properties for a resist, such as sensitivity and resolution, as well as in EL, LWR and a minimum collapse size when forming a line pattern. SOLUTION: This polymer for a semiconductor resist contains a formula (1) unit and a formula (2) unit, wherein a content rate of a repeating unit represented by formula (1) is 0.5-10 mol% and a content rate of a repeating unit represented by formula (2) is 50-70 mol% when total repeating units included in the polymer for a semiconductor resist are 100 mol%. COPYRIGHT: (C)2010,JPO&INPIT

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