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    コンデンサ
    2.
    发明专利
    コンデンサ 审中-公开

    公开(公告)号：JPWO2017026295A1

    公开(公告)日：2018-04-19

    申请号：JP2017534180

    申请日：2016-07-28

    Applicant: 株式会社村田製作所

    Inventor： 井上 徳之 ,  服部 和生 ,  佐伯 洋昌

    IPC: H01G4/33 ,  H01G4/008 ,  H01G9/04

    CPC classification number: H01G4/08 ,  H01G4/248 ,  H01G4/33 ,  H01G9/04 ,  H01G9/048

    Abstract: 素子本体2が、微小な細孔が形成され大きな比表面積を有する金属製の高比表面積基体と、細孔の内表面を含む前記高比表面積基体の表面所定域に形成された誘電体層と、誘電体層上に形成された導電部5とを有している。第1の端子電極1aは高比表面積基体と電気的に接続されている。第2の端子電極1bは導電部5と電気的に接続されている。素子本体2は、高比表面積基体の空隙率に応じ、静電容量の取得に寄与する第1の領域3と、該第1の領域よりも空隙率の小さい第2の領域4a、4bとを含んでいる。第2の領域4a、4bは、高比表面積基体の空隙率が25%以下に形成されている。これにより絶縁性を損なうことなく機械的強度が良好で高信頼性を有する小型・大容量化が可能な新型タイプのコンデンサを実現する。

    Photoelectrode, photoelectric conversion element, and method for manufacturing photoelectrode
    3.
    发明专利
    Photoelectrode, photoelectric conversion element, and method for manufacturing photoelectrode 有权
    光电转换元件和制造光电子的方法

    公开(公告)号：JP2014137968A

    公开(公告)日：2014-07-28

    申请号：JP2013007511

    申请日：2013-01-18

    Applicant: Yamaguchi Univ ,  国立大学法人山口大学

    Inventor： NAKAYAMA MASAHARU ,  MITO SHUNSUKE

    IPC: H01M14/00 ,  H01G4/008 ,  H01G9/22 ,  H01G9/28 ,  H01L31/04

    CPC classification number: Y02E10/542 ,  Y02E10/549 ,  Y02P70/521

    Abstract: PROBLEM TO BE SOLVED: To provide: a photoelectrode capable of directly converting visible light into electric energy without using a dye, comprising a material having a photoelectric conversion function, the material being abundant in the amount of natural resources and having no risk of exhaustion, capable of being manufactured inexpensively, excellent in durability, and high in photoelectric conversion characteristics; and a photoelectric conversion element and a photo-charged redox capacitor which include the photoelectrode.SOLUTION: There are provided: a photoelectrode including a conductive substrate, a fibrous carbon layer formed on the conductive substrate, and a birnessite-type layered manganese oxide layer formed on the fibrous carbon layer; a photoelectric conversion element including the photoelectrode, an electrolyte layer and a counter electrode; and a photo-charged redox capacitor including the photoelectrode.

    Abstract translation: 要解决的问题：提供：能够在不使用染料的情况下将可见光直接转化为电能的光电极，其包含具有光电转换功能的材料，所述材料的天然资源量丰富且没有耗尽的风险， 能够廉价地制造，耐久性优异，光电转换特性高; 以及包含光电极的光电转换元件和光电荷氧化还原电容器。解决方案：提供一种光电极，其包括导电性基板，形成在导电性基板上的纤维状碳层，以及形成为双峰型层状锰氧化物层 在纤维碳层上; 包括光电极，电解质层和对电极的光电转换元件; 以及包含光电极的光电荷氧化还原电容器。

    Method of manufacturing a thin film capacitor, and a thin film capacitor
    4.
    发明专利
    Method of manufacturing a thin film capacitor, and a thin film capacitor 有权

    公开(公告)号：JP5267251B2

    公开(公告)日：2013-08-21

    申请号：JP2009066202

    申请日：2009-03-18

    Applicant: Tdk株式会社

    Inventor： 義彦 矢野 ,  泰伸 及川 ,  賢治 堀野

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/33

    Abstract: PROBLEM TO BE SOLVED: To provide a low-cost thin film capacitor capable of increasing electrostatic capacity and decreasing leakage current. SOLUTION: The thin film capacitor 100 includes: a base electrode 2 containing Ni as a main component; two or more dielectric layers 4 and 6 laminated over the base electrode 2; an internal electrode 8 which is laminated between the dielectric layers 4 and 6, and contains Ni as a main component and further contains at least one kind selected from a group consisting of Pt, Pd, Ir, Rh, Ru, Os, Re, W, Cr, Ta and Ag; and an upper electrode 10 which is laminated on the opposite side of the dielectric layers 4 and 6 and the internal electrode 8 from the base electrode 2, and consists of Cu or Cu alloy. COPYRIGHT: (C)2010,JPO&INPIT

    Chip type electronic component
    6.
    发明专利
    Chip type electronic component 有权
    芯片型电子元件

    公开(公告)号：JP2012015543A

    公开(公告)日：2012-01-19

    申请号：JP2011198005

    申请日：2011-09-12

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： YAMAZAKI YOICHI

    IPC: H01G4/12 ,  H01C1/02 ,  H01C7/18 ,  H01G2/10 ,  H01G4/008 ,  H01G4/30

    CPC classification number: H01G4/30 ,  H01C1/02 ,  H01C7/18 ,  H01G2/10

    Abstract: PROBLEM TO BE SOLVED: To provide a chip type electronic component having a high visibility and a high mechanical strength even when it is small-sized, and capable of preventing damage of an external electrode and making a ceramic main body larger.SOLUTION: A chip type electronic component is composed of a ceramic main body where a conductor layer and an insulating layer made of ceramic are laminated alternately. At least one face of the ceramic main body in a lamination direction is a first curved face which curves in convex shape, and an expansion coefficient of the ceramic main body in the lamination direction is 5% or larger in an absolute value. A curvature radius of the first curved face is 5.2 mm or lower.

    Abstract translation: 要解决的问题：即使在小尺寸的情况下也能提供具有高可见度和高机械强度的芯片型电子部件，并且能够防止外部电极的损坏并使陶瓷主体更大。 解决方案：芯片型电子部件由导体层和由陶瓷制成的绝缘层交替层叠的陶瓷主体构成。 陶瓷主体的层叠方向的至少一个面为凸形弯曲的第一曲面，陶瓷主体在层叠方向上的膨胀系数为绝对值的5％以上。 第一曲面的曲率半径为5.2mm以下。 版权所有（C）2012，JPO＆INPIT

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