公开(公告)号：KR102224186B1

公开(公告)日：2021-03-05

申请号：KR1020180057565A

申请日：2018-05-21

申请人： 히로세덴끼 가부시끼가이샤

发明人： 카즈야 미도리카와

IPC分类号： H01R13/639 ,  H01R12/50

CPC分类号： H01R13/639 ,  H01R12/00

摘要： (과제) 로크 금구의 로크부에 발출력이 작용해도 당해 로크 금구의 변형 나아가서는 파손을 확실하게 방지할 수 있는 전기 커넥터 및 전기 커넥터 조립체를 제공하는 것을 과제로 한다.
(해결 수단) 로크 부재(30)는, 단자 배열 방향으로 연장되어 형성되어 있고, 단자 배열 방향에서 로크 위치측으로 향하여 돌출된 로크 돌출부(33A, 33B)와, 단자 배열 방향에서 상기 탄성 지지부(45)보다도 로크 해제 위치측에 위치하는 로크 해제 조작부(36)를 갖고 있고, 상기 로크 부재(30)가 상기 탄성 지지부(45)로부터 탄성 지지력을 받아 로크 위치에 있을 때에, 상대 커넥터(2)에 형성된 피로크부(74, 73)에 대하여 상기 로크 돌출부(33A, 33B)가 걸리게, 상대 커넥터(2)의 발출을 저지 가능해지고, 상기 로크 해제 조작부(36)가 상기 탄성 지지력에 저항한 조작력을 받아 상기 로크 부재(30)가 로크 해제 위치로 이동했을 때에, 상기 상대 커넥터(2)의 발출을 허용 가능해진다.

公开(公告)号：JP2014139345A

公开(公告)日：2014-07-31

申请号：JP2014027882

申请日：2014-02-17

申请人： Jx Nippon Mining & Metals Corp ,  Jx日鉱日石金属株式会社

发明人： KODAMA ATSUSHI ,  SHIBUYA YOSHITAKA ,  FUKAMACHI KAZUHIKO

IPC分类号： C25D5/12 ,  C25D5/48 ,  C25D5/50 ,  C25D7/00 ,  H01R12/50 ,  H01R13/03

摘要： PROBLEM TO BE SOLVED: To provide a surface treatment plated material in which generation of a whisker is suppressed, even if being exposed to a high temperature environment, favorable solderability and low contact resistance are maintained, and an insertion force of a terminal and a connector is low.SOLUTION: A surface treatment plated material is such that a lower layer configured by Ni or a Ni alloy plating, and an upper layer configured by an alloy plating including Sn are sequentially formed on a metal base. The upper layer is configured by an alloy of Sn or Sn and In selected from A constituent element group consisting of Sn and In, and one or two or more selected from B constituent element group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and includes 10-50 at% of a metal of the A constituent element group, P and N exist on an upper layer surface, and amounts of P and N elements that adhere to the upper layer surface are respectively, P:1×10-4×10mol/cm, and N:2×10-8×10mol/cm.

摘要翻译： 要解决的问题：为了提供抑制晶须生成的表面处理电镀材料，即使暴露在高温环境下，也能保持良好的可焊性和低接触电阻，并且端子和连接器的插入力 是低的。解决方案：表面处理电镀材料使得通过Ni或Ni合金电镀构成的下层和由包含Sn的合金电镀构成的上层依次形成在金属基底上。 上层由Sn或Sn的合金和选自由Sn和In组成的构成元素组中的In组成，并且选自由Ag，Au，Pt，Pd，Ru组成的B构成元素组中的一种或两种以上， Rh，Os和Ir，并且包括10-50at％的A构成元素基团的金属，P和N存在于上层表面上，并且分别附着到上层表面的P和N元素的量， P：1×10-4×10mol / cm，N：2×10-8×10mol / cm。

公开(公告)号：JP5434182B2

公开(公告)日：2014-03-05

申请号：JP2009072045

申请日：2009-03-24

申请人： 住友電装株式会社

发明人： 隆 土屋

IPC分类号： H01R12/52 ,  H01R12/00 ,  H01R12/50 ,  H01R12/55 ,  H01R12/71 ,  H01R12/77

公开(公告)号：JP2013206842A

公开(公告)日：2013-10-07

申请号：JP2012077405

申请日：2012-03-29

申请人： Yazaki Corp ,  矢崎総業株式会社

发明人： MIURA KAZUNORI

IPC分类号： H01R12/71 ,  H01R12/50 ,  H01R12/77 ,  H05K1/14

CPC分类号： H01R12/7005 ,  H01R4/028 ,  H01R12/57 ,  H01R12/716 ,  H01R12/727 ,  H01R12/73 ,  H01R12/79

摘要： PROBLEM TO BE SOLVED: To prevent short-circuit of adjacent terminals or conductor patterns due to molten solder when terminals held by a connector housing are connected to conductor patterns on a printed wiring board.SOLUTION: End faces of plural terminals 15 held by a connector housing 13 are opposed to upper faces of plural conductor patterns respectively aligned on a printed circuit board. Ends (39) of the terminals 15 are soldered to the conductor patterns, and the connector housing 13 is mounted on the printed circuit board. Plural grooves 31 parted by partition walls 41 are provided on a side face of the connector housing 13. The ends (39) of the terminals 15 are respectively arranged in the grooves, and gaps 45 are formed between side faces of the ends (39) of the terminals 15 and the partition walls 41.

摘要翻译： 要解决的问题：为了防止当由连接器壳体保持的端子连接到印刷线路板上的导体图案时由于熔融焊料导致的相邻端子或导体图案的短路。解决方案：由连接器保持的多个端子15的端面 壳体13与分别对准在印刷电路板上的多个导体图案的上表面相对。 端子15的端部（39）焊接到导体图案，并且连接器壳体13安装在印刷电路板上。 在连接器壳体13的侧面上设置有分隔壁41分隔的多个凹槽31.端子15的端部（39）分别布置在凹槽中，并且间隙45形成在端部（39）的侧面之间， 的端子15和分隔壁41。

公开(公告)号：JP5079475B2

公开(公告)日：2012-11-21

申请号：JP2007314280

申请日：2007-12-05

申请人： 新光電気工業株式会社

发明人： 翔太 三木 ,  直 荒井

IPC分类号： H01L23/12 ,  H01R12/50 ,  H05K3/28

CPC分类号： H05K3/284 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00

摘要： An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulating layers. The entire surface of the coreless substrate, exclusive of pad portions defined at desired positions of the outermost wiring layers thereof, is covered with a molding resin. Further, an interposer is mounted on the side of the electronic component mounting surface of the coreless substrate, and the molding resin is partially filled into a gap between the coreless substrate and the interposer.

公开(公告)号：JP2012169196A

公开(公告)日：2012-09-06

申请号：JP2011030440

申请日：2011-02-16

申请人： Hitachi Ltd ,  株式会社日立製作所

发明人： OKUTSU KEISUKE ,  TAKAHASHI ISAO ,  TAKAMATSU KOJI ,  YAMAMOTO TAISUKE

IPC分类号： H01R12/50

摘要： PROBLEM TO BE SOLVED: To provide a control device capable of improving productivity and working efficiency, miniaturizing control equipment, and reducing management costs and the like.SOLUTION: A control device 1 has: a base board unit 3 including a base board having a printed board circuit electrically connecting plural through holes, a substrate side terminal stand base 10 mounted on a front face of the base board and soldered to through holes for mounting the substrate side terminal stand base on a rear face, and a base board cover covering the base board; control equipment 2 mounted on a front face of the base board unit 3, soldered to through holes for mounting the control equipment electrically connected to the through holes for mounting the substrate side terminal stand base via the printed board circuit on the rear face of the base board, and controlling input/output between it and external equipment; and an insertion type terminal stand 13 which can be mounted to and dismounted from the substrate side terminal stand base 10 of the base board unit 3, and is connected to the external equipment.

摘要翻译： 要解决的问题：提供一种能够提高生产率和工作效率的控制装置，使控制设备小型化，并且降低管理成本等。 解决方案：控制装置1具有：基板单元3，其包括具有电连接多个通孔的印刷板电路的基板，安装在基板的正面上的基板侧端子台基座10，并焊接到 用于将基板侧端子台底座安装在后表面上的通孔和覆盖基板的基板盖; 安装在基板单元3的前表面上的控制设备2焊接到用于安装控制设备的通孔，该控制设备电连接到用于通过印刷板电路将基板侧端子台基座安装在基座的后表面上的通孔 并控制其与外部设备之间的输入/输出; 以及可以安装到基板单元3的基板侧端子座基座10上并从外部设备连接的插入型端子台13。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012119149A

公开(公告)日：2012-06-21

申请号：JP2010267445

申请日：2010-11-30

申请人： Fujitsu Component Ltd ,  富士通コンポーネント株式会社

发明人： OKUYAMA TAKESHI ,  KUMAMOTO TADASHI ,  MIZUKAMI KAZUHIRO

IPC分类号： H01R12/50 ,  H01R13/648

CPC分类号： H01R12/57 ,  H01R4/027 ,  H01R12/724 ,  H05K3/3426 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y02P70/613 ,  Y10T29/49147

摘要： PROBLEM TO BE SOLVED: To provide a connector capable of securely connecting a connector connection terminal to a substrate connection terminal.SOLUTION: The connector, formed of a conductive material, to be connected to another connector includes: a signal contact to be connected at one end portion to the connection terminal of the other connector; an insulator portion for installing the signal contact; a floating lead to be connected at one end portion to another end portion of the signal contact; and a solder member for connecting the other end portion of the signal contact to the one end portion of the floating lead. In a groove portion formed on the insulator portion, the one end portion of the floating lead is installed in a movable state.

摘要翻译： 要解决的问题：提供一种能够将连接器连接端子牢固地连接到基板连接端子的连接器。 解决方案：由导电材料形成的连接到另一个连接器的连接器包括：一个端部连接到另一个连接器的连接端子的信号触头; 用于安装信号触头的绝缘体部分; 一个浮动引线在一个端部连接到信号触点的另一个端部; 以及用于将信号触点的另一端部与浮动引线的一个端部连接的焊接部件。 在形成在绝缘体部分上的沟槽部分中，浮动引线的一个端部安装在可移动状态。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011258313A

公开(公告)日：2011-12-22

申请号：JP2010129150

申请日：2010-06-04

申请人： Toshiba Lighting & Technology Corp ,  東芝ライテック株式会社

发明人： KOSA KIYOTERU ,  SUZUKI HIROSHI ,  SUGIYAMA MASAHIRO ,  NISHIIE MICHIHIKO

IPC分类号： H01R12/50 ,  F21V23/06 ,  F21Y101/02 ,  H01R4/24 ,  H05K7/00

摘要： PROBLEM TO BE SOLVED: To provide a wire connection apparatus with which a wire can be easily connected to a substrate and a highly reliable connection can be expected.SOLUTION: A wire connection apparatus includes a mount member 36 which is mounted onto one surface 17a where a wiring pattern 29 of a substrate 17 is formed, by interposing a wire 24. The mount member 36 includes connection means 37 for connecting the wire 24 to the wiring pattern 29 of the substrate 17 while holding the wire 24 between a wire connecting section 46 and the substrate 17.

摘要翻译： 要解决的问题：提供一种能够容易地将导线连接到基板的电线连接装置，并且可以期待高度可靠的连接。 电线连接装置包括安装部件36，安装部件36通过插入线24安装在形成有基板17的布线图案29的一个表面17a上。安装部件36包括连接装置37， 线24连接到基板17的布线图案29，同时将线24保持在线连接部分46和基板17之间。版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011187412A

公开(公告)日：2011-09-22

申请号：JP2010054420

申请日：2010-03-11

申请人： Sumitomo Wiring Syst Ltd ,  住友電装株式会社

发明人： GOTO HIDENORI

IPC分类号： H01R12/50 ,  H01R12/51 ,  H01R12/55 ,  H01R13/40 ,  H05K1/18

摘要： PROBLEM TO BE SOLVED: To provide a mounting board with a novel structure capable of simplifying a soldering process of a terminal to a printed circuit board and performing simplification of structures of jigs and reduction in the number of required jigs and avoiding troubles caused by adhesion of a flux to the terminal. SOLUTION: In the mounting board, bases 30, 32 and 34 for supporting the terminals 16, 18 and 20 are integrated with an insulating plate 14 via a connection section 52, the terminals 16, 18 and 20 are respectively inserted into terminal retention holes 40a-40c respectively penetrated through the bases 30, 32 and 34 from the surface 60 of the insulating plate 14 at a non-press-fitted state, and relative displacement of the base 30, 32 and 34 with respect to the insulating plate 14 is allowed at the connection section 52 while an insertion end is regulated by making contact sections 68, 68 projected on the terminals 16, 18 and 20 come in contact with terminal support sections 48, 48 of the bases 30, 32 and 34. COPYRIGHT: (C)2011,JPO&INPIT

摘要翻译： 要解决的问题：为了提供一种具有能够简化端子对印刷电路板的焊接工艺并且简化夹具结构并减少所需夹具数量并避免产生故障的新型结构的安装板 通过将助焊剂粘附到端子上。

解决方案：在安装板中，用于支撑端子16,18和20的基座30,32和34经由连接部分52与绝缘板14一体化，端子16,18和20分别插入端子 保持孔40a-40c分别从绝缘板14的表面60以非压配合状态穿过基座30,32和34，并且基座30,32和34相对于绝缘板的相对位移 通过使突出在端子16,18和20上的接触部分68,68与基座30,32和34的端子支撑部分48,48相接触来限制插入端被限制在连接部分52处。 P>版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP4732568B2

公开(公告)日：2011-07-27

申请号：JP2000236853

申请日：2000-08-04

申请人： エフシーアイ・アメリカズ・テクノロジー・インコーポレーテッド

发明人： ティモシー・エー・レムケ ,  ティモシー・ダブリュ・ホウツ ,  レービス・アール・ジョンソン

IPC分类号： H01R33/76 ,  H01R4/02 ,  H01R12/00 ,  H01R12/50 ,  H01R12/71 ,  H01R13/193 ,  H01R24/00 ,  H01R33/74 ,  H05K7/10

CPC分类号： H05K7/1007 ,  H01R13/193 ,  H05K7/1084