Abstract:
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
Abstract:
PROBLEM TO BE SOLVED: To improve the accuracy of positioning between a lead pin of an electric socket and a pad of a circuit board.SOLUTION: An optical module 1 includes a circuit board 2 having a first pad 21a and a second pad 21b provided on a front surface 2a and a rear surface 2b respectively and an electric socket 5 for transmission/reception of electric signals to/from an external device. A first lead pin 52a of the electric socket 5 is electrically connected to the first pad 21a by a first solder layer 25a on the first pad 21a, and a second lead pin 52b of the electric socket 5 is electrically connected to the second pad 21b by a second solder layer 25b on the second pad 21b. The second pad 21b has a recess 211 dented forward, and the recess 211 has a left guide edge 21e inclined forward to the right and a right guide edge 21f inclined forward to the left, and a distance between the left guide edge 21e and the right guide edge 21f is reduced toward the front.
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic apparatus which improves impact resistance.SOLUTION: According to one embodiment, an electronic apparatus includes: a housing; a circuit board housed in the housing and provided with a cutout part; and a surface mount component provided on the circuit board and arranged along an edge part of the cutout part.
Abstract:
The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.
Abstract:
PROBLEM TO BE SOLVED: To provide a connector capable of handling a high voltage direct current.SOLUTION: In a connector which is electrically connected by fitting one connector and the other connector, the one connector has one contact terminal, and the other connector has the other contact terminal contacting with the one contact terminal and a switch portion connected to the other contact terminal. The switch portion has a fixed portion and a moving portion. By fitting the one connector and the other connector, a moving terminal provided on the other connector contacts with an end portion of the other connector. The moving terminal moves to push and deform the moving portion through the moving terminal, thereby making the moving portion and the fixed portion contact with each other.
Abstract:
PROBLEM TO BE SOLVED: To provide an LCD backlight unit capable of solving a problem in which a dark section is generated on an LCD panel positioned on an upper portion of a connector for electric connection between a plurality of LED modules when the plurality of LED modules individually driven for local dimming are connected.SOLUTION: A backlight of a liquid-crystal display device using a light-emitting diode includes: a double-sided printed circuit board 21 having a plurality of segmented regions and a conductive via hole; a plurality of light-emitting diodes 221 arranged on an upper surface of the double-sided printed circuit board; a plurality of driving circuit connecting connectors 25 arranged on one side of the double-sided printed circuit board; a plurality of first lead patterns 26 which are formed on the upper surface of the double-sided printed circuit board and electrically connect the plurality of light-emitting diodes located in the segmented regions with each other; and a plurality of second lead patterns which are formed on a lower surface of the double-sided printed circuit board and electrically connect the first lead patterns with the connectors respectively via the conductive via hole.