公开(公告)号：KR1020090049186A

公开(公告)日：2009-05-18

申请号：KR1020070115312

申请日：2007-11-13

申请人： 주식회사 디비하이텍

发明人： 방상원

IPC分类号： H01L21/677

CPC分类号： H01L21/265 ,  H01L21/67011 ,  H01L21/677

摘要： 본 발명은 이온 주입 장치용 웨이브 가이드 이송 장치에 관한 것으로, 해결하고자 하는 기술적 과제는 이온의 이동 경로의 설치되어 이온의 이동경로를 진공상태로 유지하기 위한 웨이브 가이드의 밀폐력을 향상시키는 이온 주입 장치용 웨이브 가이드 이송 장치를 제공하는 데 있다.
이를 위해 이온 주입 장치의 이온 이동 경로 중 상부 전자석과 하부 전자석 사이에 탈부착이 가능하게 설치되는 웨이브 가이드; 웨이브 가이드의 일 면과, 상기 일 면과 대응하는 전자석의 일면에 설치되는 변위 감지용 센서; 웨이브 가이드에 결합되어 웨이브 가이드를 이송시키는 구동부; 및 변위 감지용 센서에서 출력되는 웨이브 가이드의 위치에 대한 전기적인 신호를 입력받아 웨이브 가이드가 이동하기 위한 전기적인 신호를 구동부에 출력시키는 제어부로 이루어진 이온 주입 장치용 웨이브 가이드 이송 장치를 개시한다.
그에 따른 본 발명의 이온 주입 장치용 웨이브 가이드 이송 장치는 이온의 경로의 설치되는 웨이브 가이드가 정확한 위치에 위치하게 하여 이온의 이동경로를 진공상태로 유지한다.
웨이브 가이드, 진공, 이온 주입, 전자석, 질량 분석

公开(公告)号：KR1020090049166A

公开(公告)日：2009-05-18

申请号：KR1020070115280

申请日：2007-11-13

申请人： 세메스 주식회사

发明人： 현재일

IPC分类号： H01L21/304 ,  H01L21/02

CPC分类号： H01L21/67011 ,  H01L21/67259

摘要： 지그 및 이를 이용한 나이프 셋팅 방법에서, 지그는 서로 마주하도록 배치되어 기판이 통과되는 공간을 제공하는 두 개의 나이프 사이로 삽입되어 두 개의 나이프 사이의 갭이 정상적으로 설정되었는지 판단하는데 사용된다. 지그를 이용하여 두 개의 나이프 사이의 갭이 정상적으로 설정되었는지 판단한 후, 판단 결과 갭이 정상치보다 크거나 혹은 작으면, 두 개의 나이프 사이의 갭을 조정한다. 즉, 두 개의 나이프 사이의 갭은 기판의 건조력을 좌우하는 주요한 팩터이므로, 지그를 이용하여 갭이 정상적으로 셋팅될 수 있도록 하여 기판 전체의 건조력이 저하되는 것을 방지할 수 있다.

公开(公告)号：KR1020080107552A

公开(公告)日：2008-12-11

申请号：KR1020070055445

申请日：2007-06-07

申请人： 주성엔지니어링(주)

发明人： 이규환 ,  차안기

IPC分类号： H01L21/00 ,  H01L21/02 ,  H01L21/3065

CPC分类号： H01L21/67011 ,  C23C16/50 ,  H01J37/32174

摘要： A crash buffer and an apparatus for processing thin film including the crash buffer are provided to prevent the supply tube in advance by decentralizing the loads concentrated to one end portion of the supply tube connecting the processing chamber and the reacting gas providing unit. The crash buffer(190) comprises the buffer member. The buffer member is equipped on the top of the chamber defining the reaction zone. The buffer member fixes the reacting gas providing unit(160) supplying the reaction gas. The buffer member comprises the first fix piece(191), the second fixture piece(193), and the elastic member(200). The first fix piece is fixed on the top of the chamber. The second fixture piece is fixed to the reacting gas providing unit. The first and the second fixture piece are connected by the elastic member.

摘要翻译： 提供碰撞缓冲器和用于处理包括碰撞缓冲器的薄膜的装置，以通过将集中到连接处理室和反应气体提供单元的供应管的一个端部的负载分散来预先防止供给管。 碰撞缓冲器（190）包括缓冲构件。 缓冲构件配备在限定反应区的室的顶部。 缓冲构件固定供应反应气体的反应气体提供单元（160）。 缓冲构件包括第一固定件（191），第二固定件（193）和弹性构件（200）。 第一固定件固定在腔室的顶部。 第二固定件被固定到反应气体提供单元。 第一和第二固定件通过弹性构件连接。

公开(公告)号：KR100857212B1

公开(公告)日：2008-09-05

申请号：KR1020070042234

申请日：2007-04-30

申请人： 주식회사 싸이텍

发明人： 오두환

IPC分类号： G02F1/13

CPC分类号： G02F1/1303 ,  B65H37/002 ,  B65H2301/4606 ,  H01L21/67011

摘要： An apparatus and a method for bonding a gasket are provided to move one of plural pullout units selectively to a corresponding work position, thereby achieving a continuous work without interruption of a bonding work caused by replacement of a bobbin. In pullout units(120,130), a bobbin(20) wound with a gasket is mounted. The pullout unit provides a pullout path for pulling out the gasket from the bobbin. One of the plural pullout units selectively moves to a work position. A transfer unit(140) transfers the gasket of the pullout unit, moved to the work position among the plural pullout units, along a length direction of a bonding object(10). A cutting unit(170) cuts the gasket, transferred by the transfer unit, in a length corresponding to the bonding object. A bonding unit(180) bonds the gasket, cut by the cutting unit, with the bonding object after moving the gasket to the bonding object.

摘要翻译： 提供一种用于接合垫圈的装置和方法，用于将多个拉出单元中的一个选择性地移动到相应的工作位置，从而实现连续工作，而不会中断由更换线轴引起的接合作业。 在拉出单元（120,130）中，安装缠绕有垫圈的线轴（20）。 拉出单元提供用于从线轴上拉出垫圈的拉出路径。 多个拉出单元中的一个选择性地移动到工作位置。 传送单元（140）沿着粘合物（10）的长度方向传送拉出单元的垫圈，移动到多个拉出单元中的工作位置。 切割单元（170）以对应于粘合对象的长度切割由传送单元传送的垫圈。 接合单元（180）在将垫圈移动到接合物体之后，将由切割单元切割的垫圈与接合对象接合。

公开(公告)号：KR1020080075609A

公开(公告)日：2008-08-19

申请号：KR1020070014719

申请日：2007-02-13

申请人： 삼성전자주식회사

发明人： 박의진 ,  박인영

IPC分类号： H01L21/67 ,  H01L21/68

CPC分类号： H01L21/6833 ,  H01L21/67011

摘要： A wafer lift assembly of a semiconductor manufacturing apparatus is provided to generate reliably generate plasma discharges by preventing an electrostatic chuck from being contaminated due to a friction between a lift plate and a guide shaft. Plural lift pins(10) penetrate an electrostatic chuck in a vertical direction and are arranged to elevate in the vertical direction. A lift plate(20) fixes lower ends of the lift pins at a lower portion of the electrostatic chuck and is elevated along an elevation groove, which is formed to be upwardly engraved at a bottom of the electrostatic chuck. A guide shaft(30) is screw-coupled with the electrostatic chuck on the elevation groove and penetrates a center portion of the lift plate to prevent a downward derailment of the lift plate. The guide shaft supports the lift plate. An elevation driver(40) is connected to a lower end of the lift plate and elevates the lift plate at a constant height. A spring(50) is elastically arranged outside a guide shaft between the electrostatic chuck and the lift plate inside the elevation groove. A protective cap(60) is arranged to surround an outer portion of the spring and prevents an upper portion of the electrostatic chuck from being contaminated by the particles due to a friction between the electrostatic chuck and the guide shaft, while the lift plate is elevated.

摘要翻译： 提供半导体制造装置的晶片提升组件，以通过防止静电卡盘由于升降板和引导轴之间的摩擦而被污染而可靠地产生等离子体放电。 多个提升销（10）在垂直方向上穿过静电卡盘并且被布置成在垂直方向上升高。 升降板（20）在静电卡盘的下部固定提升销的下端，并且沿着升降槽升高，该升降槽形成为在静电卡盘的底部向上雕刻。 引导轴（30）与静电卡盘螺纹连接在升降槽上，并穿过提升板的中心部分，以防止升降板向下脱轨。 导向轴支撑升降板。 升降驱动器（40）连接到提升板的下端，并将升降板以恒定的高度升高。 弹簧（50）弹性地布置在垂直槽内的静电卡盘和提升板之间的引导轴外侧。 保护盖（60）布置成围绕弹簧的外部部分，并且防止静电卡盘的上部由于静电卡盘和引导轴之间的摩擦而被颗粒污染，同时升降板升高 。

公开(公告)号：KR1020080049461A

公开(公告)日：2008-06-04

申请号：KR1020060120053

申请日：2006-11-30

申请人： 엘지디스플레이 주식회사

发明人： 이광연 ,  이석종

IPC分类号： H01L21/205

CPC分类号： C23C14/588 ,  C23C14/0021 ,  H01L21/67011

摘要： A vacuum deposition apparatus is provided to clean easily an anti-sticking plate by performing only a simple process for removing an outermost film of films of the anti-sticking plate. An evaporation source includes a melting pot and a heating unit. The melting pot is positioned in an inside of a vacuum chamber in order to receive organic materials. The heating unit is installed at the outside of the melting pot. A substrate supporting plate is installed at a position corresponding to the evaporation source. An anti-sticking plate(270) is positioned at an inner wall of the vacuum chamber. A film(280A) is attached on a surface of the anti-sticking plate. The film has a multilayered structure. The film includes polyethylene and PVC.

摘要翻译： 提供一种真空沉积装置，通过仅进行简单的除去防粘板的膜的最外层的方法来容易地清洁防粘板。 蒸发源包括熔炉和加热单元。 熔池位于真空室的内部，以便接收有机材料。 加热单元安装在熔炉外侧。 基板支撑板安装在与蒸发源对应的位置。 防粘板（270）位于真空室的内壁。 膜（280A）附着在防粘板的表面上。 该片具有多层结构。 该膜包括聚乙烯和PVC。

公开(公告)号：KR1020070115658A

公开(公告)日：2007-12-06

申请号：KR1020070051439

申请日：2007-05-28

申请人： 니혼덴산리드가부시키가이샤

发明人： 카토미노루 ,  후지노마코토

IPC分类号： G01R1/06 ,  G01R31/28

CPC分类号： G01R31/2601 ,  G01R1/0408 ,  G01R1/07364 ,  G01R31/2891 ,  H01L21/67011 ,  H01L22/30

摘要： A substrate inspecting tool and a substrate inspection apparatus having the same are provided to accurately contact a testing probe on a tiny wire pattern by decreasing a positioning error of the testing probe due to manufacturing variations. A substrate inspecting tool includes a testing probe(16) and a support member. One end of the testing probe is conductively contacted with an inspection unit for a substrate to be tested. The support member includes an upper plate(14) and a lower plate(18). The upper plate supports the probe. A guide hole guides the testing probe to the inspection unit. The lower plate is arranged to be spaced from the upper plate by a predetermined distance. A position determining unit supports the testing probe on specific positions on a periphery of the guiding hole of the upper plate.

摘要翻译： 提供了一种基板检查工具和具有该基板检查工具的基板检查装置，以通过由于制造变化减小测试探针的定位误差而以微小的线图案精确地接触测试探针。 基板检查工具包括测试探针（16）和支撑构件。 测试探针的一端与被检测基板的检查单元导电接触。 支撑构件包括上板（14）和下板（18）。 上板支撑探头。 导孔将测试探针引导到检查单元。 下板布置成与上板隔开预定距离。 位置确定单元在上板的引导孔的周边上的特定位置处支撑测试探针。

公开(公告)号：KR1020070111787A

公开(公告)日：2007-11-22

申请号：KR1020060045043

申请日：2006-05-19

申请人： 주식회사 원익홀딩스

发明人： 김운수 ,  김용진

IPC分类号： H01L21/205

CPC分类号： C23C16/45565 ,  H01L21/67011

摘要： A shower head is provided to form a thin film of a desired composition on a wafer by injecting first source gas and second source gas to the wafer while the first and second source gases are not mixed. A top plate(10) is disposed in a space of a reactor in which a wafer is installed, including a first supply flow path for introducing first source gas and a second supply flow path for introducing second source gas wherein the first supply flow path is separated from the second supply flow path. A second source gas diffusion space(22) in which the second source gas introduced through the second supply flow path is diffused is airtightly formed between the top plate and a mid plate(20). The mid plate includes a first through hole connected to the first supply flow path and a plurality of second through holes(202) that are separated from the first through hole and are connected to the second source gas diffusion space. A first source gas diffusion space(32) in which the first source gas introduced through the first through hole is diffused is airtightly formed between the mid plate and an end plate(30) disposed under the mid plate. The end plate includes a plurality of first exhaust holes(301) connected to the first source gas diffusion space and a plurality of second exhaust holes(302) separated from the first exhaust hole. A flow path part of the top plate is fixed to the mid plate by a fixing unit.

摘要翻译： 在第一和第二源气体不混合的同时，通过在晶片上注入第一源气体和第二源气体来提供淋浴头以在晶片上形成所需组成的薄膜。 顶板（10）设置在其中安装有晶片的反应器的空间中，包括用于引入第一源气体的第一供应流路和用于引入第二源气体的第二供应流路，其中第一供应流路是 与第二供应流路分离。 通过第二供应流路引入的第二源气体扩散的第二源气体扩散空间（22）气密地形成在顶板和中板（20）之间。 中间板包括连接到第一供应流路的第一通孔和与第一通孔分离并连接到第二源气体扩散空间的多个第二通孔（202）。 通过第一通孔引入的第一源气体扩散的第一源气体扩散空间（32）气密地形成在中间板和设置在中间板下方的端板（30）之间。 端板包括连接到第一源气体扩散空间的多个第一排气孔（301）和与第一排气孔分离的多个第二排气孔（302）。 顶板的流路部分通过定影单元固定到中间板。

公开(公告)号：KR1020070083407A

公开(公告)日：2007-08-24

申请号：KR1020070015802

申请日：2007-02-15

申请人： 가부시키가이샤 스크린 홀딩스

发明人： 나카하라마사나오 ,  나카타히로유키

IPC分类号： H01L21/66 ,  H01J9/42

CPC分类号： H01L21/67288 ,  H01L21/67011

摘要： An apparatus for detecting a crack of a substrate and a substrate processing apparatus are provided to improve crack detection accuracy by setting a time width of a signal from a signal output unit to have a larger width. A crack detection apparatus(12) detects a crack of a substrate(B) being transferred along a transfer path. A first signal output unit includes a light irradiating unit(40) for irradiating light onto the substrate and a light receiving unit(42). The first signal output unit outputs a signal based on a light receiving state of the light receiving unit. A crack detection unit(30A or 30B) detects the crack of the substrate based on a signal outputted from the first signal output unit during the substrate passes a light irradiation position by the light irradiating unit. After detecting the crack of the substrate, the first signal output unit outputs the signal having a time width greater than a minimum time width capable of being processed by the crack detection unit when the light receiving state of the light receiving unit is changed.

摘要翻译： 提供了用于检测基板的裂纹的装置和基板处理装置，以通过将来自信号输出单元的信号的时间宽度设置为具有较大的宽度来提高裂纹检测精度。 裂纹检测装置（12）检测沿传送路径传送的基板（B）的裂纹。 第一信号输出单元包括用于将光照射到基板上的光照射单元（40）和光接收单元（42）。 第一信号输出单元基于光接收单元的光接收状态输出信号。 裂纹检测单元（30A或30B）在基板通过光照射单元的光照射位置时，基于从第一信号输出单元输出的信号来检测基板的裂纹。 在检测到基板的裂纹之后，当光接收单元的光接收状态改变时，第一信号输出单元输出具有大于能够由裂纹检测单元处理的最小时间宽度的时间宽度的信号。

公开(公告)号：KR1020070070901A

公开(公告)日：2007-07-04

申请号：KR1020050133918

申请日：2005-12-29

申请人： 삼성전자주식회사

发明人： 이태일

IPC分类号： H01L21/687

CPC分类号： H01L21/67259 ,  H01L21/67011 ,  H01L21/6838

摘要： Equipment for fabricating a semiconductor device is provided to prevent a semiconductor substrate from being slid from a robot arm when the semiconductor substrate is transferred, by installing a pressure detecting part and a control part in the robot arm. A semiconductor substrate is supported by a robot arm(110) which includes a placement part(112) having a vacuum hole(114) in a region in contact with the semiconductor substrate. A vacuum line(116) penetrates the inside of the robot arm, connected to the vacuum holes. A pressure detecting part(120) detects the pressure of the vacuum hole, connected to the vacuum line. A control part(130) stops the operation of the robot arm when the pressure detecting part detects an abnormal pressure, connected to the pressure detecting part. The control part can generate an alarm when the pressure detecting part detects the abnormal pressure.

摘要翻译： 提供用于制造半导体器件的设备，以通过在机器人手臂中安装压力检测部分和控制部分来防止当半导体衬底被传送时半导体衬底从机器人臂滑动。 半导体基板由机器人手臂（110）支撑，该机器人臂（110）包括在与半导体基板接触的区域中具有真空孔（114）的放置部分（112）。 真空管线（116）穿过与真空孔连接的机器人臂的内部。 压力检测部（120）检测与真空管线连接的真空孔的压力。 当压力检测部检测到与压力检测部分连接的异常压力时，控制部件（130）停止机器人手臂的操作。 当压力检测部检测到异常压力时，控制部可以产生报警。