Light emitted diode
    2.
    发明授权
    Light emitted diode 有权
    发光二极管

    公开(公告)号:US08710530B2

    公开(公告)日:2014-04-29

    申请号:US13572209

    申请日:2012-08-10

    CPC classification number: H01L33/10 H01L33/0079

    Abstract: The present invention relates to a light emitted diode (LED). The LED includes a metal mirror, a bonding substrate, a distributed bragg reflector (DBR), a buffer layer, and a LED epitaxial structure. The bonding substrate is arranged under the metal mirror. The DBR is arranged on the metal mirror. The buffer layer is arranged on the DBR. The LED epitaxial structure is arranged on the buffer layer.

    Abstract translation: 本发明涉及一种发光二极管(LED)。 LED包括金属镜,接合衬底,分布式布拉格反射器(DBR),缓冲层和LED外延结构。 接合基板设置在金属镜下方。 DBR布置在金属镜上。 缓冲层布置在DBR上。 LED外延结构布置在缓冲层上。

    SOLID-STATE LIGHT EMITTING DEVICE
    5.
    发明申请
    SOLID-STATE LIGHT EMITTING DEVICE 审中-公开
    固态发光装置

    公开(公告)号:US20130200408A1

    公开(公告)日:2013-08-08

    申请号:US13734055

    申请日:2013-01-04

    Inventor: SONG WANG

    Abstract: An exemplary embodiment of the present disclosure provides a solid-state light emitting device. The solid-state light emitting device includes a stair-type bowl, a plurality of light emitting chips, and an encapsulation glue. The stair-type bowl includes a base and a ring stair structure. The ring stair structure includes a plurality of ring tread surfaces and a plurality of ring riser surfaces connected to the ring tread surfaces. The ring stair structure is connected to the base. The base has a bottom surface. The ring stair structure surrounds the bottom surface and protrudes from the bottom surface. The light emitting chips are respectively disposed above the ring tread surfaces and the bottom surfaces. The stair-type bowl is filled with the encapsulation glue. The encapsulation glue covers the light-emitting chips.

    Abstract translation: 本公开的示例性实施例提供了一种固态发光器件。 固态发光器件包括阶梯式碗,多个发光芯片和封装胶。 楼梯式碗包括底座和环形楼梯结构。 环形台阶结构包括多个环形胎面表面和连接到环形胎面表面的多个环形立管表面。 环形楼梯结构连接到基座。 底座有底面。 环形台阶结构围绕底面并从底面突出。 发光芯片分别设置在环形胎面表面和底面之上。 楼梯式碗里装满胶囊。 封装胶覆盖发光芯片。

    PLANT ILLUMINATION APPARATUS
    6.
    发明申请
    PLANT ILLUMINATION APPARATUS 有权
    植物照明设备

    公开(公告)号:US20130162147A1

    公开(公告)日:2013-06-27

    申请号:US13689111

    申请日:2012-11-29

    Inventor: Jin-Yong JIANG

    CPC classification number: H05B37/0218 A01G7/045 Y02B20/40 Y02B20/46 Y02P60/149

    Abstract: A plant illumination apparatus includes a light source module including a first light source and a second light source generating lights having different wavelengths, an environment-detecting module detecting an external environment to obtain a real-time environment parameter, and a control module connected to the light source module and the environment-detecting module. The control module includes a processor unit and a storage unit storing a database of plant growing environment parameters. The processor unit loads at least one preset growing environment parameter corresponding to a plant growth timing from the database of plant growing environment parameters, and compares the preset growing environment parameter with the real-time environment parameter to output at least one comparison result. The processor unit adjusts the first light source and the second light source according to the comparison result, so that an adjusted environment parameter matches the preset growing environment parameter.

    Abstract translation: 工厂照明装置包括:光源模块,包括第一光源和产生具有不同波长的光的第二光源,环境检测模块检测外部环境以获得实时环境参数;以及控制模块, 光源模块和环境检测模块。 控制模块包括处理器单元和存储植物生长环境参数数据库的存储单元。 所述处理器单元从所述植物生长环境参数的数据库加载至少一个对应于植物生长时间的预定生长环境参数,并将所述预设生长环境参数与所述实时环境参数进行比较以输出至少一个比较结果。 处理器单元根据比较结果调整第一光源和第二光源,使得调整后的环境参数与预设的生长环境参数相匹配。

    Multi-chip LED
    8.
    外观设计
    Multi-chip LED 有权
    多芯片LED

    公开(公告)号:USD675169S1

    公开(公告)日:2013-01-29

    申请号:US29408511

    申请日:2011-12-13

    Applicant: Yen-Chih Chou

    Designer: Yen-Chih Chou

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