DETERMINING A NUCLEIC ACID SEQUENCE IMBALANCE
    1.
    发明申请
    DETERMINING A NUCLEIC ACID SEQUENCE IMBALANCE 有权
    确定核酸序列不平衡

    公开(公告)号:US20090087847A1

    公开(公告)日:2009-04-02

    申请号:US12178116

    申请日:2008-07-23

    IPC分类号: C12Q1/68

    摘要: Methods, systems, and apparatus are provided for determining whether a nucleic acid sequence imbalance exists within a biological sample. One or more cutoff values for determining an imbalance of, for example, the ratio of the two sequences (or sets of sequences) are chosen. The cutoff value may be determined based at least in part on the percentage of fetal DNA in a sample, such as maternal plasma, containing a background of maternal nucleic acid sequences. The cutoff value may also be determined based on an average concentration of a sequence per reaction. In one aspect, the cutoff value is determined from a proportion of informative wells that are estimated to contain a particular nucleic acid sequence, where the proportion is determined based on the above-mentioned percentage and/or average concentration. The cutoff value may be determined using many different types of methods, such as sequential probability ratio testing (SPRT).

    摘要翻译: 提供了用于确定生物样品中是否存在核酸序列不平衡的方法,系统和装置。 选择用于确定例如两个序列(或序列集合)的比例的不平衡的一个或多个截断值。 截止值可以至少部分地基于含有母体核酸序列背景的样品中的胎儿DNA(例如母体血浆)的百分比来确定。 截止值也可以基于每个反应的序列的平均浓度来确定。 在一个方面,截断值由估计含有特定核酸序列的信息井的比例确定,其中所述比例基于上述百分比和/或平均浓度来确定。 截断值可以使用许多不同类型的方法来确定,例如顺序概率比测试(SPRT)。

    Apparatus and method of placing solder balls onto a substrate
    2.
    发明授权
    Apparatus and method of placing solder balls onto a substrate 有权
    将焊球放置在基板上的装置和方法

    公开(公告)号:US06766938B2

    公开(公告)日:2004-07-27

    申请号:US10042829

    申请日:2002-01-08

    IPC分类号: B23K3102

    摘要: The invention provides an apparatus and method for positioning solder balls in a desired array on a substrate. A positioning means is provided for positioning the solder balls in positions corresponding to the array of positions the solder balls are to take up on the substrate. A container for receiving a plurality of solder balls and which is movable between a first position remote from the positioning means and a second position directly thereover supplies solder balls to the positioning means. Means are provided to bias the solder balls in the direction of movement of the container from the first to the second position whereby to reduce or obviate damage to the solder balls during such movement.

    摘要翻译: 本发明提供了一种用于将焊球定位在基板上的所需阵列的装置和方法。 提供了一种定位装置,用于将焊球定位在与焊球要吸附在衬底上的位置阵列相对应的位置。 一种用于接收多个焊球并且可以在远离定位装置的第一位置和直接在其之间的第二位置移动的容器将焊球提供给定位装置。 提供装置以使焊球从容器的第一位置移动到第二位置,从而减少或消除在这种运动期间对焊球的损坏。

    Determining a nucleic acid sequence imbalance
    3.
    发明授权
    Determining a nucleic acid sequence imbalance 有权
    确定核酸序列失衡

    公开(公告)号:US08706422B2

    公开(公告)日:2014-04-22

    申请号:US12178116

    申请日:2008-07-23

    IPC分类号: G01N33/50 G01N33/48

    摘要: Methods, systems, and apparatus are provided for determining whether a nucleic acid sequence imbalance exists within a biological sample. One or more cutoff values for determining an imbalance of, for example, the ratio of the two sequences (or sets of sequences) are chosen. The cutoff value may be determined based at least in part on the percentage of fetal DNA in a sample, such as maternal plasma, containing a background of maternal nucleic acid sequences. The cutoff value may also be determined based on an average concentration of a sequence per reaction. In one aspect, the cutoff value is determined from a proportion of informative wells that are estimated to contain a particular nucleic acid sequence, where the proportion is determined based on the above-mentioned percentage and/or average concentration. The cutoff value may be determined using many different types of methods, such as sequential probability ratio testing (SPRT).

    摘要翻译: 提供了用于确定生物样品中是否存在核酸序列不平衡的方法,系统和装置。 选择用于确定例如两个序列(或序列集合)的比例的不平衡的一个或多个截断值。 截止值可以至少部分地基于含有母体核酸序列背景的样品中的胎儿DNA(例如母体血浆)的百分比来确定。 截止值也可以基于每个反应的序列的平均浓度来确定。 在一个方面,截断值由估计含有特定核酸序列的信息井的比例确定,其中所述比例基于上述百分比和/或平均浓度来确定。 截断值可以使用许多不同类型的方法来确定,例如顺序概率比测试(SPRT)。

    METHOD FOR FABRICATING FIRST ELECTRODE OF CAPACITOR
    5.
    发明申请
    METHOD FOR FABRICATING FIRST ELECTRODE OF CAPACITOR 审中-公开
    用于制造电容器的第一电极的方法

    公开(公告)号:US20080057640A1

    公开(公告)日:2008-03-06

    申请号:US11559062

    申请日:2006-11-13

    IPC分类号: H01L21/8244

    摘要: A method for fabricating a first electrode of a capacitor is described. A substrate comprising an insulating layer formed thereon is provided. The insulating layer has an opening. A silicon layer is formed on the insulating layer. The silicon layer is transformed to a hemispherical grain layer. An etching process is performed to remove a portion of the hemispherical grain layer outside the opening.

    摘要翻译: 描述制造电容器的第一电极的方法。 提供了包括其上形成的绝缘层的基板。 绝缘层具有开口。 在绝缘层上形成硅层。 将硅层转变为半球形晶粒层。 进行蚀刻处理以去除开口外部的半球形晶粒层的一部分。

    Multi-use acoustic leak path system
    6.
    发明申请
    Multi-use acoustic leak path system 有权
    多用途声学泄漏路径系统

    公开(公告)号:US20070123312A1

    公开(公告)日:2007-05-31

    申请号:US11289909

    申请日:2005-11-30

    IPC分类号: H04M1/00 H04M9/00

    CPC分类号: H04M1/6041 H04M1/03

    摘要: The invention concerns a mobile communications unit (100) having at least one transducer (120) that can broadcast audio through a direct port (110), at least one leak port (114) for leak tolerance of the unit, in which the leak port can have a first opening (116) and a multi-use opening (118). The multi-use opening can be coupled to the first opening of the leak port to complete a path for the leak port, and the multi-use opening can also receive a part of an accessory. As an example, the mobile unit can be a monolith mobile unit. As another example, the accessory can be a holster having a hook mechanism that fits within the multi-use opening and can secure the mobile communications unit to the holster.

    摘要翻译: 本发明涉及具有至少一个可通过直接端口(110)广播音频的传感器(120)的移动通信单元(100),用于该单元的泄漏容限的至少一个泄漏端口(114),其中泄漏端口 可以具有第一开口(116)和多用途开口(118)。 多用开口可以连接到泄漏口的第一开口,以完成泄漏口的路径,并且多用途开口也可以容纳附件的一部分。 作为示例,移动单元可以是单体移动单元。 作为另一个示例,附件可以是具有适配在多用途开口内的钩机构并且可以将移动通信单元固定到机架的皮套。

    Double printed circuit board with solderless connecting structure
    7.
    发明申请
    Double printed circuit board with solderless connecting structure 审中-公开
    双面印刷电路板,无焊接连接结构

    公开(公告)号:US20060166526A1

    公开(公告)日:2006-07-27

    申请号:US11336520

    申请日:2006-01-20

    IPC分类号: H05K1/00

    摘要: Disclosed herein is a double printed circuit board with a solderless connecting structure, which electrically connects an upper board and a lower board of the double printed circuit board without soldering. The double printed circuit board comprises upper and lower boards, each having a hole with a conductive layer formed on an inner surface thereof. A pin is press-fitted through the holes of the upper and lower boards, and has upper and lower compliant portions formed at upper and lower portions of a pin body to electrically connect the upper board and the lower board, respectively. Since the pin comprises the upper and lower compliant portions, the pin can maintain stable connection between circuits of the upper and lower boards while being firmly coupled to the printed circuit boards, and minimize environmental contamination due to lead.

    摘要翻译: 本发明公开了一种具有无焊接连接结构的双面印刷电路板,其电连接双印刷电路板的上板和下板,而无需焊接。 双面印刷电路板包括上板和下板,每个板具有形成在其内表面上的导电层的孔。 销通过上板和下板的孔压配合,并且在销体的上部和下部分别形成有上下柔性部分,以分别电连接上板和下板。 由于该销包括上部和下部柔性部分,所以销可以在牢固地连接到印刷电路板的同时保持上部和下部电路板的电路之间的稳定连接,并且最小化由于铅导致的环境污染。