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公开(公告)号：US12203959B2
公开(公告)日：2025-01-21
申请号：US18510290
申请日：2023-11-15
Applicant: FormFactor, Inc.
Inventor： Martin Schindler , Felix Krug
IPC: G01R1/067
Abstract: Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a height differential between a DUT surface of the DUT and an auxiliary surface of an auxiliary chuck and aligning the probe tip and the auxiliary chuck for contact with one another. The methods also include physically contacting the probe tip with the auxiliary surface to determine an auxiliary contact height between the probe tip and the auxiliary surface and determining a DUT contact height between the probe tip and the DUT surface. The methods further include aligning the probe tip and the DUT for contact with one another and moving the probe tip to the DUT contact height to physically contact the probe tip with the DUT surface.
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公开(公告)号：US20240190019A1
公开(公告)日：2024-06-13
申请号：US18506935
申请日：2023-11-10
Applicant: FormFactor, Inc.
Inventor： Benedikt Marx , Axel Becker
CPC classification number: B25J15/0616 , B25J11/0095
Abstract: Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.
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公开(公告)号：US11626357B2
公开(公告)日：2023-04-11
申请号：US17333890
申请日：2021-05-28
Applicant: FormFactor, Inc.
Inventor： Roy J. Henson , Shawn O. Powell
IPC: H01L23/498 , H01L25/065 , H01L23/13 , H01L23/538 , H05K1/18 , H01R12/52
Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
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公开(公告)号：US11460485B2
公开(公告)日：2022-10-04
申请号：US16164326
申请日：2018-10-18
Applicant: FormFactor, Inc.
Inventor： Jason William Cosman , Benjamin N. Eldridge , Eric Hill , John Ebner , Edin Sijercic
Abstract: Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
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5.发明申请公开(公告)号：US20220236304A1
公开(公告)日：2022-07-28
申请号：US17587898
申请日：2022-01-28
Applicant: FormFactor, Inc.
IPC: G01R1/073
Abstract: Vertical probe arrays having angled guide plates are provided. With this configuration, the probes can be straight conductors (when mechanically undeformed) and the mechanical bias provided by the angled guide plates can ensure the probes have a well-defined deformation when the probe array make contact to the device under test. This allows the use of straight conductors as probes without suffering from probe shorting and mechanical interference caused by straight probes buckling in unpredictable directions when vertically compressed.
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Patent Agency Ranking
公开(公告)号：US10527647B2
公开(公告)日：2020-01-07
申请号：US16016141
申请日：2018-06-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge , Edin Sijercic , Eric Hill , John Ebner
Abstract: Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
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公开(公告)号：US20190293685A1
公开(公告)日：2019-09-26
申请号：US16362239
申请日：2019-03-22
Applicant: FormFactor, Inc.
Inventor： January Kister , Chun-Chih Wang
Abstract: A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.
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公开(公告)号：US20180196086A1
公开(公告)日：2018-07-12
申请号：US15868737
申请日：2018-01-11
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
IPC: G01R1/073
Abstract: Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.
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公开(公告)号：US09958476B2
公开(公告)日：2018-05-01
申请号：US15359245
申请日：2016-11-22
Applicant: FormFactor, Inc.
Inventor： Benjamin N. Eldridge
CPC classification number: G01R1/0441
Abstract: A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.
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公开(公告)号：US09689915B2
公开(公告)日：2017-06-27
申请号：US14274889
申请日：2014-05-12
Applicant: FormFactor, Inc.
Inventor： Toshihiro Kasai , Masanori Watanabe , Yoichi Urakawa
CPC classification number: G01R31/2887 , Y10T29/49117
Abstract: A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.
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