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1.发明授权Apparatus and method for semiconductor wafer bumping via injection molded solder 失效通过注射成型焊料的半导体晶片凸块的装置和方法公开(公告)号：US07732320B2
公开(公告)日：2010-06-08
申请号：US12025686
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
发明人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point. The fixture tool with the aligned mold and semiconductor structures is inserted between the wafer heater stack and the mold heater stack. A deposition chamber is formed between the wafer heater stack and the mold heater stack by sealing the wafer heater stack and the mold heater stack against the frame.
摘要翻译： 用于半导体晶片凸块的改进的设备利用注射成型焊接工艺，并且被设计用于大批量制造。 该装置包括用于在具有焊料的模具结构上填充图案化模腔的设备，用于定位和对准与模具结构的焊料填充的图案化模腔直接相对的半导体结构的图案化表面的设备，用于保持和转移 对准的模具和半导体结构在一起，以及用于接收夹具工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。 焊接传输设备包括被配置为加热半导体结构的晶片加热器堆叠和构造成将模具结构加热到略高于焊料熔点的工艺温度的模具加热器堆叠。 具有对准的模具和半导体结构的固定工具插入在晶片加热器堆叠和模具加热器堆叠之间。 通过将晶片加热器堆叠和模具加热器堆叠密封在框架上，在晶片加热器堆叠和模具加热器堆叠之间形成沉积室。
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2.发明申请APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION MOLDED SOLDER 失效通过注塑成型焊机制造半导体波形的装置和方法公开(公告)号：US20080237315A1
公开(公告)日：2008-10-02
申请号：US12056369
申请日：2008-03-27
CPC分类号： B23K3/0623 , B23K2101/40 , B23K2101/42 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L2224/11003 , H01L2224/1111 , H01L2224/131 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K3/3436 , H05K2203/0126 , H01L2224/0401
摘要： An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position.
摘要翻译： 用于填充在模具结构的表面上形成的图案化模腔的改进装置包括具有焊料储存器的注射器头组件，所述焊料储存器具有底表面，其具有用于将焊料注入到模腔中的细长槽，以及支架组件， 扫描注射器头部组件下方的模具结构。 模具结构与焊料储存器底表面接触，并且在围绕细长槽的焊料储存器底表面的区域和模具结构表面之间形成密封件，然后在注射器头部组件下方扫描模具结构 从起始位置到完成位置的第一方向，用于填充模具腔，并且在与第一方向相反的第二方向上，从完成位置返回到起始位置。
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3.发明申请APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION MOLDED SOLDER 失效通过注塑成型焊机制造半导体波形的装置和方法公开(公告)号：US20080188072A1
公开(公告)日：2008-08-07
申请号：US12025686
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
发明人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point. The fixture tool with the aligned mold and semiconductor structures is inserted between the wafer heater stack and the mold heater stack. A deposition chamber is formed between the wafer heater stack and the mold heater stack by sealing the wafer heater stack and the mold heater stack against the frame.
摘要翻译： 用于半导体晶片凸块的改进的设备利用注射成型焊接工艺，并且被设计用于大批量制造。 该装置包括用于在具有焊料的模具结构上填充图案化模腔的设备，用于定位和对准与模具结构的焊料填充的图案化模腔直接相对的半导体结构的图案化表面的设备，用于保持和转移 对准的模具和半导体结构在一起，以及用于接收夹具工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。 焊接传输设备包括被配置为加热半导体结构的晶片加热器堆叠和构造成将模具结构加热到略高于焊料熔点的工艺温度的模具加热器堆叠。 具有对准的模具和半导体结构的固定工具插入在晶片加热器堆叠和模具加热器堆叠之间。 通过将晶片加热器堆叠和模具加热器堆叠密封在框架上，在晶片加热器堆叠和模具加热器堆叠之间形成沉积室。
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公开(公告)号：US08123089B2
公开(公告)日：2012-02-28
申请号：US12244145
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
IPC分类号： B22D37/00
CPC分类号： B23K3/0638
摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。
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5.发明授权Apparatus and method for semiconductor wafer bumping via injection molded solder 有权通过注射成型焊料的半导体晶片凸块的装置和方法公开(公告)号：US08088684B2
公开(公告)日：2012-01-03
申请号：US12025644
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley
发明人： Hale Johnson , G. Gerard Gormley
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder, equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The fixture tool includes a frame having a central aperture dimensioned to support a substrate and one or more clamp/spacer assemblies arranged symmetrically around the frame. Each clamp/spacer assembly includes a clamp configured to clamp the aligned mold and semiconductor structures together and a spacer configured to be inserted between the semiconductor structure and the mold structure.
摘要翻译： 一种用于半导体晶片凸块的改进的装置和方法，其利用注射模制的焊接工艺。 该设备被设计用于大批量制造，并且包括用于填充形成在具有焊料的模具结构的第一表面上的图案化模腔的设备，用于定位和对准与填充有焊料的图案化模腔直接相对的半导体结构的图案化第一表面的设备 模具结构的固定工具，用于将对准的模具和半导体结构保持和传送在一起的固定工具，以及用于接收固定工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。 固定工具包括具有中心孔的框架，该中心孔的尺寸被设计成支撑衬底以及围绕框架对称地布置的一个或多个夹具/间隔件组件。 每个夹具/间隔件组件包括被配置为将对准的模具和半导体结构夹持在一起的夹具和构造成插入在半导体结构和模具结构之间的间隔件。
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6.发明授权Apparatus and method for semiconductor wafer bumping via injection molded solder 失效通过注射成型焊料的半导体晶片凸块的装置和方法公开(公告)号：US07703658B2
公开(公告)日：2010-04-27
申请号：US12056369
申请日：2008-03-27
CPC分类号： B23K3/0623 , B23K2101/40 , B23K2101/42 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L2224/11003 , H01L2224/1111 , H01L2224/131 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K3/3436 , H05K2203/0126 , H01L2224/0401
摘要： An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position.
摘要翻译： 用于填充在模具结构的表面上形成的图案化模腔的改进装置包括具有焊料储存器的注射器头组件，所述焊料储存器具有底表面，其具有用于将焊料注入到模腔中的细长槽，以及支架组件， 扫描注射器头部组件下方的模具结构。 模具结构与焊料储存器底表面接触，并且在围绕细长槽的焊料储存器底表面的区域和模具结构表面之间形成密封件，然后在注射器头部组件下方扫描模具结构 从起始位置到完成位置的第一方向，用于填充模具腔，并且在与第一方向相反的第二方向上，从完成位置返回到起始位置。
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公开(公告)号：US20100084438A1
公开(公告)日：2010-04-08
申请号：US12244145
申请日：2008-10-02
申请人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
发明人： Glen Nelson Biggs , Russell A. Budd , Benjamin Vito Fasano , John Joseph Garant , G. Gerard Gormley , John Peter Karidis , Christopher Lee Tessler , Thomas Weiss
CPC分类号： B23K3/0638
摘要： An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas.
摘要翻译： 提供了一种用于将易熔材料分配到表面上的装置，其中可熔材料处于熔融形式。 该装置包括一个包括密封结构的分配组件。 密封结构控制可熔材料的分配。 一个或多个气体喷射器联接到分配组件。 一个或多个气体喷射器中的每一个适于将至少一种气体喷射到分配组件，用于控制围绕密封结构的至少一部分的气体环境。 作为至少一种气体的至少一种特性的函数控制可熔材料的氧化速率。
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8.发明申请APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION MOLDED SOLDER 有权通过注塑成型焊机制造半导体波形的装置和方法公开(公告)号：US20080188069A1
公开(公告)日：2008-08-07
申请号：US12025644
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley
发明人： Hale Johnson , G. Gerard Gormley
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder, equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The fixture tool includes a frame having a central aperture dimensioned to support a substrate and one or more clamp/spacer assemblies arranged symmetrically around the frame. Each clamp/spacer assembly includes a clamp configured to clamp the aligned mold and semiconductor structures together and a spacer configured to be inserted between the semiconductor structure and the mold structure.
摘要翻译： 一种用于半导体晶片凸块的改进的装置和方法，其利用注射模制的焊接工艺。 该设备被设计用于大批量制造，并且包括用于填充形成在具有焊料的模具结构的第一表面上的图案化模腔的设备，用于定位和对准与填充有焊料的图案化模腔直接相对的半导体结构的图案化第一表面的设备 模具结构的固定工具，用于将对准的模具和半导体结构保持和传送在一起的固定工具，以及用于接收固定工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。 固定工具包括具有中心孔的框架，该中心孔的尺寸被设计成支撑衬底以及围绕框架对称地布置的一个或多个夹具/间隔件组件。 每个夹具/间隔件组件包括被配置为将对准的模具和半导体结构夹持在一起的夹具和构造成插入在半导体结构和模具结构之间的间隔件。
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