公开(公告)号：US08149565B2

公开(公告)日：2012-04-03

申请号：US12421953

申请日：2009-04-10

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G15/00

CPC分类号： H05K1/0231 ,  H01G2/065 ,  H01G4/35 ,  H05K2201/09318 ,  H05K2201/09481 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

摘要： A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

摘要翻译： 一种电路板装置，包括：电路板，包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器（MLCC），其包括电容器本体，多个第一和第二极性 内部电极，第一外部电极和第二外部电极以及第三外部电极，其中第一和第二电力线分别设置在安装区域上，连接到第一和第二外部电极，并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

公开(公告)号：US20100149769A1

公开(公告)日：2010-06-17

申请号：US12421953

申请日：2009-04-10

申请人： Byoung Hwa LEE ,  Sung Kwon WI ,  Hong Yeon CHO ,  Dong Seok PARK ,  Sang Soo PARK ,  Min Cheol PARK

发明人： Byoung Hwa LEE ,  Sung Kwon WI ,  Hong Yeon CHO ,  Dong Seok PARK ,  Sang Soo PARK ,  Min Cheol PARK

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01G2/065 ,  H01G4/35 ,  H05K2201/09318 ,  H05K2201/09481 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

摘要： A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

摘要翻译： 一种电路板装置，包括：电路板，包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器（MLCC），其包括电容器本体，多个第一和第二极性 内电极，第一外电极和第二外电极以及第三外电极，其中第一和第二电源线分别设置在安装区域上，连接到第一外电极和第二外电极，并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

公开(公告)号：US07688568B1

公开(公告)日：2010-03-30

申请号：US12407298

申请日：2009-03-19

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/228

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/385 ,  H01L2224/16227 ,  H01L2924/15311

摘要： A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies.

摘要翻译： 一种多层片状电容器包括：电容器主体，其具有层叠在其中的多个电介质层，并且包括第一和第二电容器单元; 以及形成在所述电容器主体的外表面上的第一至第四外部电极，其中所述第一电容器单元包括彼此面对的第一和第二内部电极，所述电介质层插入在所述第一和第二内部电极之间，连接到所述第一和第二外部电极，并具有不同的极性 每一对第一和第二内部电极层叠一次或多次以区分具有一定电容的多个电容器，第二电容器单元包括彼此面对的第三和第四内部电极，介电层插入其间，连接到第三个 和第四外部电极，并且具有与第一和第二内部电极相同的极性，每对第三和第四内部电极被层叠一次或多次以区分一个或多个具有一定电容的电容器，并且至少三个 电容器包括在第一和第二电容器单元ha中 不同的电容或谐振频率。

公开(公告)号：US07567425B1

公开(公告)日：2009-07-28

申请号：US12339839

申请日：2008-12-19

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/228

CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/38

摘要： There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units; and first to fourth outer electrodes, wherein the first capacitor unit includes at least one pair of first and second inner electrodes, the second capacitor unit includes at least one pair of third and fourth inner electrodes, an alternate laminated portion is formed in one area within the capacitor body, the alternate laminated portion having the first to fourth inner electrodes sequentially laminated therein, and a capacitance adjusting portion is formed in another area within the capacitor body, the capacitance adjusting portion having at least one of the one pair of first and second inner electrodes and the one pair of third and fourth inner electrodes laminated repeatedly.

摘要翻译： 提供了一种多层片状电容器，包括：电容器主体，包括第一和第二电容器单元; 和第一至第四外部电极，其中所述第一电容器单元包括至少一对第一和第二内部电极，所述第二电容器单元包括至少一对第三和第四内部电极，在一个区域内形成交替的层叠部分 电容器主体，具有依次层叠的第一至第四内部电极的交替层叠部分和电容器体内的另一区域中形成电容调整部，电容调整部具有一对第一和第二电极中的至少一个 内电极和一对第三和第四内电极重复层叠。

公开(公告)号：US08184444B2

公开(公告)日：2012-05-22

申请号：US12425068

申请日：2009-04-16

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H05K7/00

CPC分类号： H05K1/111 ,  H05K1/0231 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10636 ,  Y02P70/611

摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.

摘要翻译： 提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。 电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。 第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。 第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。 因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

公开(公告)号：US20100032193A1

公开(公告)日：2010-02-11

申请号：US12425068

申请日：2009-04-16

申请人： Byoung Hwa LEE ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa LEE ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H05K1/111 ,  H05K1/0231 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10636 ,  Y02P70/611

摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.

摘要翻译： 提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。 电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。 第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。 第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。 因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

公开(公告)号：US20120138350A1

公开(公告)日：2012-06-07

申请号：US13309263

申请日：2011-12-01

申请人： Pum San CHAE ,  Doo Young KIM ,  Kang Heon HUR ,  Hong Yeon CHO

发明人： Pum San CHAE ,  Doo Young KIM ,  Kang Heon HUR ,  Hong Yeon CHO

IPC分类号： H05K1/16 ,  H05K13/04 ,  B65G47/24

CPC分类号： H05K13/021 ,  H05K1/181 ,  H05K1/185 ,  H05K13/022 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/5317

摘要： There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which the magnetic field and magnetic resistance are reduced.

摘要翻译： 提供了一种用于电子部件的装置，包括：托盘，其设置有通过堆叠形成有内导体的电介质片形成的电子部件; 传送单元连续地传送从托盘移动的电子部件; 以及磁场提供单元，其向从所述传送单元移动的所述电子部件提供磁场，以沿着所述磁场和磁阻减小的方向对准所述内部导体。

公开(公告)号：US20100091427A1

公开(公告)日：2010-04-15

申请号：US12407298

申请日：2009-03-19

申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hong Yeon Cho ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

IPC分类号： H01G4/228

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/385 ,  H01L2224/16227 ,  H01L2924/15311

摘要： A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies.

摘要翻译： 一种多层片状电容器包括：电容器主体，其具有层叠在其中的多个电介质层，并且包括第一和第二电容器单元; 以及形成在所述电容器主体的外表面上的第一至第四外部电极，其中所述第一电容器单元包括彼此面对的第一和第二内部电极，所述电介质层插入在所述第一和第二内部电极之间，连接到所述第一和第二外部电极，并且具有不同的极性 每一对第一和第二内部电极层叠一次或多次以区分具有一定电容的多个电容器，第二电容器单元包括彼此面对的第三和第四内部电极，介电层插入其间，连接到第三个 和第四外部电极，并且具有与第一和第二内部电极相同的极性，每对第三和第四内部电极被层叠一次或多次以区分一个或多个具有一定电容的电容器，并且至少三个 电容器包括在第一和第二电容器单元ha中 不同的电容或谐振频率。