公开(公告)号：US5818087A

公开(公告)日：1998-10-06

申请号：US747659

申请日：1996-11-13

申请人： Hyeok Jae Yee

发明人： Hyeok Jae Yee

IPC分类号： H01L21/822 ,  H01L23/60 ,  H01L27/02 ,  H01L27/04 ,  H01L27/092 ,  H01L23/62

CPC分类号： H01L27/0251 ,  H01L27/0925 ,  Y10S438/981

摘要： An electrostatic-discharge (ESD) protecting circuit of a semiconductor device prevents damage from an ESD applied to an internal circuit through an input or output pad. The thickness of respective gate insulating layers of respective active devices of the electrostatic-discharge protecting circuit and internal circuit, which are formed within a given radius in the range of about 350.mu.m to about 1000.mu.m from the electrostatic-discharge protecting circuit, is thicker than the thickness of gate insulating layers of active devices formed outside the radius.

摘要翻译： 半导体器件的静电放电（ESD）保护电路可防止通过输入或输出焊盘施加到内部电路的ESD的损坏。 在距离静电放电保护电路约350μm至约1000μm范围内的给定半径内形成的静电放电保护电路和内部电路的各有源器件的各栅极绝缘层的厚度， 比形成在半径外的有源器件的栅极绝缘层的厚度厚。

公开(公告)号：US5893733A

公开(公告)日：1999-04-13

申请号：US49122

申请日：1998-03-27

申请人： Hyeok Jae Yee

发明人： Hyeok Jae Yee

IPC分类号： H01L21/822 ,  H01L23/60 ,  H01L27/02 ,  H01L27/04 ,  H01L27/092 ,  H01L23/62

CPC分类号： H01L27/0251 ,  H01L27/0925 ,  Y10S438/981

摘要： An electrostatic-discharge (ESD) protecting circuit of a semiconductor device prevents damage from an ESD applied to an internal circuit through an input or output pad. The thickness of respective gate insulating layers of respective active devices of the electrostatic-discharge protecting circuit and internal circuit, which are formed within a given radius in the range of about 350 .mu.m to about 1000 .mu.m from the electrostatic-discharge protecting circuit, is thicker than the thickness of gate insulating layers of active devices formed outside the radius.

摘要翻译： 半导体器件的静电放电（ESD）保护电路可防止通过输入或输出焊盘施加到内部电路的ESD的损坏。 在距离静电放电保护电路约350μm至约1000μm范围内的给定半径内形成的静电放电保护电路和内部电路的各有源器件的各栅极绝缘层的厚度， 比形成在半径外的有源器件的栅极绝缘层的厚度厚。

公开(公告)号：US20080036055A1

公开(公告)日：2008-02-14

申请号：US11365246

申请日：2006-03-01

申请人： Jae Yee ,  Young Chung ,  Jae Lee ,  Terry Davis ,  Chung Han ,  Jae Ku ,  Jae Kwak ,  Sang Ryu

发明人： Jae Yee ,  Young Chung ,  Jae Lee ,  Terry Davis ,  Chung Han ,  Jae Ku ,  Jae Kwak ,  Sang Ryu

IPC分类号： H01L23/495 ,  H01L21/98

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US20050062148A1

公开(公告)日：2005-03-24

申请号：US10944241

申请日：2004-09-17

申请人： Seong Seo ,  Young Chung ,  Jong Paek ,  Jae Ku ,  Jae Yee

发明人： Seong Seo ,  Young Chung ,  Jong Paek ,  Jae Ku ,  Jae Yee

IPC分类号： H01L23/48 ,  H01L21/60 ,  H01L23/495 ,  H01L23/34

CPC分类号： H01L24/83 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of leads are superimposed by the bond pads and active surface of the semiconductor chip. The leads have at least one exposed surface at a bottom surface of the package body. A plurality of conductive connecting means electrically connect the input-output pads of the chip to the leads. A package body is formed over the semiconductor chip and the conductive connecting means. The bottom surface portions of the leads are exposed to the outside.