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公开(公告)号：US20140176253A1
公开(公告)日：2014-06-26
申请号：US14235667
申请日：2012-07-26
摘要： A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction.
摘要翻译： 公开了一种差分传输跃迁接口，其可以包括在差分RF传输输出和波导之间分别提供第一和第二差分耦合的第一和第二掩埋导电轨道; 所述第一掩埋导电轨道在所述波导的开口上延伸以提供第一RF耦合元件; 以及在开口上延伸的第二掩埋导电轨道，以提供第二RF耦合元件。 第一RF耦合元件的至少一部分在第一角度方向上在波导开口上延伸; 并且所述第二RF耦合元件的至少一部分在与所述第一角度方向相对的第二角度方向上在所述波导开口上延伸。
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公开(公告)号：US08076591B2
公开(公告)日：2011-12-13
申请号：US11794652
申请日：2005-12-22
IPC分类号： H01B17/04
CPC分类号： H05K1/0218 , H05K1/142 , H05K1/144 , H05K1/145 , H05K3/368 , H05K3/403 , H05K2201/0397 , H05K2201/0715 , H05K2201/0919 , H05K2201/09836
摘要： The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.
摘要翻译： 本发明涉及电路板，并且当这些电路板被安装为这种电路板的阵列或叠层时，将这些电路板上的电路和组件从杂散干扰中筛选出来。 电路板（12,14）由本领域已知的导电屏蔽层（16,18）单独地屏蔽，并且单独的屏蔽层通过分层互连（34）耦合在一起，分层互连（34）将相应的屏蔽层（16,18） 各个电路板（12,14）组合在一起，而不是通孔。
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公开(公告)号：US20120279774A1
公开(公告)日：2012-11-08
申请号：US13512241
申请日：2010-11-23
申请人： Murray Jerel Niman
发明人： Murray Jerel Niman
CPC分类号： H05K3/429 , H05K1/0251 , H05K2201/0187 , H05K2201/0352 , H05K2201/09718 , H05K2201/09727 , H05K2203/0242 , Y10T29/49165
摘要： A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via passing through at least one of the printed circuit board layers in a direction hereinafter referred to as the via direction; wherein a surface of a further one of the printed circuit board layers comprises a conducting region surrounding a non-conducting region; the non-conducting region is substantially centered around a point on the surface of the further printed circuit board layer where the via direction intersects the surface; a back-drilled hole passes through the point on the surface; and a smallest width dimension, that includes the point on the surface, of the non-conducting region (e.g. diameter) is greater than the diameter of the back-drilled hole.
摘要翻译： 一种多层电路板，包括：堆叠在一起的多个印刷电路板层; 以及以下称为通孔方向的方向穿过至少一个所述印刷电路板层的导电电镀通孔; 其中所述印刷电路板层中的另一个的表面包括围绕非导电区域的导电区域; 非导电区域基本上围绕在通孔方向与表面相交的另一个印刷电路板层的表面上的点; 后钻孔穿过表面上的点; 并且包括非导电区域（例如直径）的表面上的点的最小宽度尺寸大于后钻孔的直径。
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公开(公告)号：US20120234580A1
公开(公告)日：2012-09-20
申请号：US13512488
申请日：2010-11-23
申请人： Murray Jerel Niman
发明人： Murray Jerel Niman
CPC分类号： H05K1/116 , H05K1/0219 , H05K1/0251 , H05K2201/015 , H05K2201/0352 , H05K2201/09618 , H05K2201/09718 , Y10T29/49124
摘要： A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via; a surface of a through which the via passes comprises a conducting region surrounding a non-conducting region that is substantially centered around a point where the via intersects the surface; a smallest width dimension, e.g. diameter of the non-conducting region is greater than or equal to 4 times the diameter of the via; the via connects a conductive contact pad on one printed circuit board layer to a conductive contact pad on another printed circuit board layer, with the printed circuit board with the non-conducting region lying between the two connected layers; and the largest width dimension of the conductive contact pads on the surfaces of the printed circuit board layers connected by the via are less than the smallest width dimension of the non-conducting region.
摘要翻译： 一种多层电路板，包括：堆叠在一起的多个印刷电路板层; 和电导通孔; 通孔通过的表面包括围绕非导电区域的导电区域，该非导电区域基本上以通孔与表面相交的点为中心; 最小的宽度尺寸，例如 非导电区域的直径大于或等于通孔直径的4倍; 通孔将一个印刷电路板层上的导电接触焊盘连接到另一个印刷电路板层上的导电接触焊盘，其中印刷电路板具有位于两个连接层之间的非导电区域; 并且由通孔连接的印刷电路板层的表面上的导电接触焊盘的最大宽度尺寸小于非导电区域的最小宽度尺寸。
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5.发明授权Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region 有权微波电路组件包括悬浮在气体或真空区域中的微波组件公开(公告)号：US07999638B2
公开(公告)日：2011-08-16
申请号：US12304995
申请日：2008-06-13
IPC分类号： H01P3/08
CPC分类号： H01P1/203 , H01P3/08 , Y10T29/49117
摘要： A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit.
摘要翻译： 微波电路组件包括支持至少一个微波电路部件的液晶聚合物（LCP）层。 第一和第二接地平面层形成组件的外表面，并且它们至少部分地由来自LCP支撑层和至少一个微波电路的气体，气体或真空的混合物间隔开。
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公开(公告)号：US20090279274A1
公开(公告)日：2009-11-12
申请号：US11794652
申请日：2005-12-22
IPC分类号： H05K1/11
CPC分类号： H05K1/0218 , H05K1/142 , H05K1/144 , H05K1/145 , H05K3/368 , H05K3/403 , H05K2201/0397 , H05K2201/0715 , H05K2201/0919 , H05K2201/09836
摘要： The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.
摘要翻译： 本发明涉及电路板，并且当这些电路板被安装为这种电路板的阵列或叠层时，将这些电路板上的电路和组件从杂散干扰中筛选出来。 电路板（12,14）由本领域已知的导电屏蔽层（16,18）单独地屏蔽，并且各个屏蔽层通过分层互连（34）耦合在一起，分层互连（34）将相应的屏蔽层（16,18） 各个电路板（12,14）组合在一起，而不是通孔。
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7.发明授权Transition interface having first and second coupling elements comprised of conductive tracks oriented at different angles with respect to each other 有权具有由相对于彼此以不同角度定向的导电轨道组成的第一和第二耦合元件的过渡界面公开(公告)号：US09203132B2
公开(公告)日：2015-12-01
申请号：US14235667
申请日：2012-07-26
摘要： A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction.
摘要翻译： 公开了一种差分传输跃迁接口，其可以包括在差分RF传输输出和波导之间分别提供第一和第二差分耦合的第一和第二掩埋导电轨道; 所述第一掩埋导电轨道在所述波导的开口上延伸以提供第一RF耦合元件; 以及在开口上延伸的第二掩埋导电轨道，以提供第二RF耦合元件。 第一RF耦合元件的至少一部分在第一角度方向上在波导开口上延伸; 并且所述第二RF耦合元件的至少一部分在与所述第一角度方向相对的第二角度方向上在所述波导开口上延伸。
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公开(公告)号：US20100237966A1
公开(公告)日：2010-09-23
申请号：US12304995
申请日：2008-06-13
CPC分类号： H01P1/203 , H01P3/08 , Y10T29/49117
摘要： A microwave circuit assembly includes a Liquid Crystalline Polymer (LCP) layer that supports at least one microwave circuit component. First and second ground plane layers form the outer surfaces of the assembly and these are spaced apart at least partially by a gas, a mixture of gases, or a vacuum, from the LCP supporting layer and the at least one microwave circuit.
摘要翻译： 微波电路组件包括支持至少一个微波电路部件的液晶聚合物（LCP）层。 第一和第二接地平面层形成组件的外表面，并且它们至少部分地由来自LCP支撑层和至少一个微波电路的气体，气体或真空的混合物间隔开。
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